公开(公告)号：FR2839581A1

公开(公告)日：2003-11-14

申请号：FR0205712

申请日：2002-05-07

Applicant: ST MICROELECTRONICS SA

Inventor： CATHELIN ANDREA ,  BERNARD CHRISTOPHE ,  DELPECH PHILIPPE ,  TROADEC PIERRE ,  SALAGER LAURENT ,  GARNIER CHRISTOPHE

IPC: H01L23/52 ,  H01G17/00 ,  H01L21/3205 ,  H01L21/4763 ,  H01L21/76 ,  H01L21/822 ,  H01L23/48 ,  H01L23/522 ,  H01L23/58 ,  H01L23/66 ,  H01L27/04 ,  H04Q7/20

Abstract: An electronic circuit includes a substrate. A capacitor and at least one semiconductor component are supported by a surface of the substrate. A substantially planar screen, oriented parallel to the surface of the substrate and made of metallic material, is placed between the capacitor and the semiconductor component. Preferably, the semiconductor component is placed in proximity to the surface of the substrate and several superposed layers of insulating material cover the surface of the substrate and the semiconductor component. The capacitor is then placed within at least one layer of insulating material above the semiconductor component, and the screen is placed within an intermediate layer of insulating material between the layer incorporating the capacitor and the surface of the substrate.

公开(公告)号：AT376256T

公开(公告)日：2007-11-15

申请号：AT03749913

申请日：2003-05-02

Applicant: ST MICROELECTRONICS SA

Inventor： CATHELIN ANDREA ,  BERNARD CHRISTOPHE ,  DELPECH PHILIPPE ,  TROADEC PIERRE ,  SALAGER LAURENT ,  GARNIER CHRISTOPHE

IPC: H01L23/52 ,  H01L23/66 ,  H01G17/00 ,  H01L21/3205 ,  H01L21/4763 ,  H01L21/76 ,  H01L21/822 ,  H01L23/48 ,  H01L23/522 ,  H01L23/58 ,  H01L27/04 ,  H04Q7/20

Abstract: An electronic circuit includes a substrate. A capacitor and at least one semiconductor component are supported by a surface of the substrate. A substantially planar screen, oriented parallel to the surface of the substrate and made of metallic material, is placed between the capacitor and the semiconductor component. Preferably, the semiconductor component is placed in proximity to the surface of the substrate and several superposed layers of insulating material cover the surface of the substrate and the semiconductor component. The capacitor is then placed within at least one layer of insulating material above the semiconductor component, and the screen is placed within an intermediate layer of insulating material between the layer incorporating the capacitor and the surface of the substrate.

公开(公告)号：DE60316934D1

公开(公告)日：2007-11-29

申请号：DE60316934

申请日：2003-05-02

Applicant: ST MICROELECTRONICS SA

Inventor： CATHELIN ANDREA ,  BERNARD CHRISTOPHE ,  DELPECH PHILIPPE ,  TROADEC PIERRE ,  SALAGER LAURENT ,  GARNIER CHRISTOPHE

IPC: H01L23/52 ,  H01L23/66 ,  H01G17/00 ,  H01L21/3205 ,  H01L21/4763 ,  H01L21/76 ,  H01L21/822 ,  H01L23/48 ,  H01L23/522 ,  H01L23/58 ,  H01L27/04 ,  H04Q7/20

Abstract: An electronic circuit includes a substrate. A capacitor and at least one semiconductor component are supported by a surface of the substrate. A substantially planar screen, oriented parallel to the surface of the substrate and made of metallic material, is placed between the capacitor and the semiconductor component. Preferably, the semiconductor component is placed in proximity to the surface of the substrate and several superposed layers of insulating material cover the surface of the substrate and the semiconductor component. The capacitor is then placed within at least one layer of insulating material above the semiconductor component, and the screen is placed within an intermediate layer of insulating material between the layer incorporating the capacitor and the surface of the substrate.

公开(公告)号：FR2839581B1

公开(公告)日：2005-07-01

申请号：FR0205712

申请日：2002-05-07

Applicant: ST MICROELECTRONICS SA

Inventor： CATHELIN ANDREA ,  BERNARD CHRISTOPHE ,  DELPECH PHILIPPE ,  TROADEC PIERRE ,  SALAGER LAURENT ,  GARNIER CHRISTOPHE

IPC: H01L23/52 ,  H01G17/00 ,  H01L21/3205 ,  H01L21/4763 ,  H01L21/76 ,  H01L21/822 ,  H01L23/48 ,  H01L23/522 ,  H01L23/58 ,  H01L23/66 ,  H01L27/04 ,  H04Q7/20

Abstract: An electronic circuit includes a substrate. A capacitor and at least one semiconductor component are supported by a surface of the substrate. A substantially planar screen, oriented parallel to the surface of the substrate and made of metallic material, is placed between the capacitor and the semiconductor component. Preferably, the semiconductor component is placed in proximity to the surface of the substrate and several superposed layers of insulating material cover the surface of the substrate and the semiconductor component. The capacitor is then placed within at least one layer of insulating material above the semiconductor component, and the screen is placed within an intermediate layer of insulating material between the layer incorporating the capacitor and the surface of the substrate.