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公开(公告)号:JP2000164835A
公开(公告)日:2000-06-16
申请号:JP33420599
申请日:1999-11-25
Applicant: ST MICROELECTRONICS SRL
Inventor: CAPPELLETTI PAOLO GIUSEPPE , MAURELLI ALFONSO
IPC: H01L21/8238 , H01L21/8247 , H01L27/092 , H01L27/105 , H01L27/115 , H01L29/423 , H01L29/43 , H01L29/49 , H01L29/788 , H01L29/792
Abstract: PROBLEM TO BE SOLVED: To provide a process that can easily integrate a nonvolatile memory and a high-performance logic circuit on the same chip. SOLUTION: A method for manufacturing integrated circuit includes the steps of forming first gate oxide layers of first transistors on first sections of a substrate 1, a step of forming a second gate oxide layer 5 of memory cells on second sections of the substrate 1, and a step of forming gate electrodes 8 of the first transistors and floating gate electrodes 7 of the memory cells of first polysilicon layers 6 in the first and second gate oxide layers 3 and 5. The method also includes a step of forming dielectric layers o the floating gate electrodes 7, a step of forming third gate oxide layers 24 of second transistors on third sections of the substrate 1, a step of forming control gate electrodes of the memory cells and the gate electrodes of the second transistor of second polysilicon layers on the dielectric layers and third sections of the substrate 1, and a step of forming the source and drain regions of the first transistors on the first sections of the substrate 1. In addition to these steps, the method also includes a step of forming source and drain regions of memory cells on the second sections of the substrate 1 and a step of forming the source and drain region of the second transistors on the third sections of the substrate 1.
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公开(公告)号:JPH0745728A
公开(公告)日:1995-02-14
申请号:JP2054894
申请日:1994-02-17
Applicant: ST MICROELECTRONICS SRL
Inventor: CAPPELLETTI PAOLO GIUSEPPE
IPC: G11C5/00 , H01L21/8247 , H01L27/02 , H01L27/115 , H01L29/788 , H01L29/792
Abstract: PURPOSE: To prevent the control gate region of each cell from reaching a potential for damaging a tunnel oxide layer by providing a diode between the control gate region of a memory cell and a substrate. CONSTITUTION: In a flash EEPROM memory array, a cell 1 is arranged in columns and rows and the array has a control gate region 7 that is connected to word lines WL0-WL2 for determining the column of the array, a drain region that is connected to bit lines BL0-BL3 for determining the row of the array, and a source region that is connected to a source line SL. Then, a diode D is inserted between the control gate region 7 of the cell 1 and the substrate 2, and the control gate region 7 is closed to prevent an electric charge from passing, when an operation potential is brought about. When a potential that is lower than a breakdown potential that is high but is divided by a coupling coefficient is reached, the control gate region 7 is open-circuited and passes an electric charge.
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公开(公告)号:JPH077140A
公开(公告)日:1995-01-10
申请号:JP27248493
申请日:1993-10-29
Applicant: ST MICROELECTRONICS SRL
Inventor: CAPPELLETTI PAOLO GIUSEPPE , RAVAZZI LEONARDO
IPC: G11C17/00 , G11C29/00 , G11C29/50 , G11C29/56 , H01L21/8247 , H01L27/115 , H01L29/788 , H01L29/792 , G11C16/06
Abstract: PURPOSE: To detect the presence of a defective cell by analyzing current-voltage characteristic by using a test equipment which is the same as a memory array to be evaluated, except when each cell is connected in parallel. CONSTITUTION: In a test equipment 10, to which access can be performed from the outside by single pads 15, 18, and 21, an electric stress is applied to the gate oxide layers of EPROM, EEPROM, and flash EEPROM memories, so that electrons can be extracted from the floating gate region of a deflective cell, and a threshold characteristic of the cell are changed, while the charge of a non-defective cell remains without being charged. Then, a voltage lower than the threshold is applied, and drain currents related to the presence of at least one defective cell in an equipment passing through the cell are measured. The measurement and analysis of the current-voltage characteristic are conducted for deciding the number of defective cells. Gate currents can be measured indirectly through the measurement of the drain and source currents of the cells, and the detection of the defective cells can be attained.
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公开(公告)号:JPH077093A
公开(公告)日:1995-01-10
申请号:JP1674494
申请日:1994-02-10
Applicant: ST MICROELECTRONICS SRL
Inventor: CAPPELLETTI PAOLO GIUSEPPE , CANTARELLI DANIELE
IPC: H01L21/8247 , H01L27/105 , H01L27/115 , H01L29/788 , H01L29/792
Abstract: PURPOSE: To provide a non-volatile memory cell and a circuit transistor for flash EEPROM at low cost. CONSTITUTION: A 1st polysilicon layer is not removed from a circuit area 40a, a gate region of a circuit transistor is formed by short-circuiting 1st and 2nd polysilicon layers, a thin tunnel oxide layer 61 of a memory cell is formed by using identical mask, a gate oxide layer is removed from a cell area without removing the mask after ion-implantation, and a boron implant mask is removed.
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公开(公告)号:JPH076599A
公开(公告)日:1995-01-10
申请号:JP27248593
申请日:1993-10-29
Applicant: ST MICROELECTRONICS SRL
Inventor: CAPPELLETTI PAOLO GIUSEPPE , RAVAZZI LEONARDO
IPC: G11C17/00 , G11C29/00 , G11C29/50 , G11C29/56 , H01L21/66 , H01L21/8247 , H01L29/788 , H01L29/792 , G11C16/06
Abstract: PURPOSE: To easily find the existence of a defective cell by impressing voltage which is lower than normal threshold on a testing device and measuring and analyzing a current-voltage characteristic. CONSTITUTION: A cell drain area of a testing device 10 of a flash EPROM memory, etc., is mutually connected by metallic lines 13, and a metallic source line 17 and control gate lines 19 are mutually connected. The device 10 which can externally access by single pads 15 to 21 is electrically equivalent in entire cells that are connected in parallel. When the device 10 is given stress by extracting electrons from a floating gate consisting of a gate oxide layer cell that has a defect and a method leaving a charged state of the other cells that are not charged as it is, only threshold voltage of the cell having defect is reduced. Therefore, by impressing the voltage which is lower than normal threshold voltage of the device 10, measuring a current-voltage characteristic and analyzing it, a defective is found.
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公开(公告)号:FR3084963B1
公开(公告)日:2022-12-16
申请号:FR1857389
申请日:2018-08-08
Applicant: COMMISSARIAT ENERGIE ATOMIQUE , ST MICROELECTRONICS SRL
Inventor: CAPPELLETTI PAOLO GIUSEPPE , NAVARRO GABRIELE
IPC: H01L21/8258 , H01L21/8256
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公开(公告)号:FR3096826B1
公开(公告)日:2022-06-03
申请号:FR1905663
申请日:2019-05-28
Applicant: ST MICROELECTRONICS SRL
Inventor: CAPPELLETTI PAOLO GIUSEPPE
Abstract: Cellule mémoire La présente description concerne une cellule mémoire à changement de phase (200), comprenant : un élément chauffant (202) ; et une couche cristalline (206), située au-dessus de l’élément chauffant (202), des parois latérales de la cellule (200) étant entourées par une région isolante (212). Figure pour l'abrégé : Fig. 2
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公开(公告)号:DE69325767T2
公开(公告)日:1999-12-02
申请号:DE69325767
申请日:1993-04-01
Applicant: ST MICROELECTRONICS SRL
Inventor: CAPPELLETTI PAOLO GIUSEPPE , RAVAZZI LEONARDO
IPC: G11C17/00 , G11C29/00 , G11C29/50 , G11C29/56 , H01L21/8247 , H01L27/115 , H01L29/788 , H01L29/792 , H01L21/66
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公开(公告)号:FR3096826A1
公开(公告)日:2020-12-04
申请号:FR1905663
申请日:2019-05-28
Applicant: ST MICROELECTRONICS SRL
Inventor: CAPPELLETTI PAOLO GIUSEPPE
Abstract: Cellule mémoire La présente description concerne une cellule mémoire à changement de phase (200), comprenant : un élément chauffant (202) ; et une couche cristalline (206), située au-dessus de l’élément chauffant (202), des parois latérales de la cellule (200) étant entourées par une région isolante (212). Figure pour l'abrégé : Fig. 2
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公开(公告)号:FR3084963A1
公开(公告)日:2020-02-14
申请号:FR1857389
申请日:2018-08-08
Applicant: COMMISSARIAT ENERGIE ATOMIQUE , ST MICROELECTRONICS SRL
Inventor: CAPPELLETTI PAOLO GIUSEPPE , NAVARRO GABRIELE
IPC: H01L21/8258 , H01L21/8256
Abstract: La présente description concerne un dispositif mémoire (300) comprenant des premières (301) et deuxièmes (302) cellules mémoire à changement de phase, les premières cellules mémoire comprenant un premier alliage à base de germanium, d'antimoine et de tellure et les deuxièmes cellules mémoire comprenant le premier alliage et un deuxième alliage à base de germanium, d'antimoine et de tellure.
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