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公开(公告)号:DE602006008480D1
公开(公告)日:2009-09-24
申请号:DE602006008480
申请日:2006-09-13
Applicant: HYNIX SEMICONDUCTOR INC , ST MICROELECTRONICS SRL
Inventor: MICHELONI RINO , RAVASIO ROBERTO , MARELLI ALESSIA
Abstract: Basic redundancy information is non volatily stored in a reserved area (that is an area of the array that is not addressable by the user of the device) of the addressable area of the array and is copied on volatile storage supports at every power-on of the memory device. The unpredictable though statistically inevitable presence of fail array elements also in such a reserved area of the memory array that would corrupt the basic redundancy information as established during the test-on wafer (EWS) phase of the fabrication process and thus increasing the number of rejects, lowering the yield of the fabrication process, is effectively overcome by writing the basic redundancy data in the reserved area of the array with an ECC technique, using a certain error correction code that may be chosen among so-called majority codes 3, 5, 7, 15 and the like or Hamming code for 1, 2, 3 or more errors, in function of the fail probability of a memory cell as determined by the testing on wafer of the devices during fabrication (fail probability of the specific fabrication process used). A significant area saving is achieved compared to the use of fuse arrays and other known approaches.
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公开(公告)号:DE602006013977D1
公开(公告)日:2010-06-10
申请号:DE602006013977
申请日:2006-09-13
Applicant: HYNIX SEMICONDUCTOR INC , ST MICROELECTRONICS SRL
Inventor: CRIPPA LUCA , RAVASIO ROBERTO , MICHELONI RINO
Abstract: The evaluation time (Teval) of the programmed or erased state of a cell of the NAND memory array is set for the individual memory device in a way that at least partially compensates the generally large spread of parasitic capacitance values of the array bitlines in the mass production fabrication process of these devices.
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公开(公告)号:DE602005011603D1
公开(公告)日:2009-01-22
申请号:DE602005011603
申请日:2005-07-28
Applicant: ST MICROELECTRONICS SRL , HYNIX SEMICONDUCTOR INC
Inventor: CRIPPA LUCA , MISSIROLI CHIARA , BOVINO ANGELO , RAVASIO ROBERTO , MICHELONI RINO
IPC: G11C11/56
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公开(公告)号:DE602005006274D1
公开(公告)日:2008-06-05
申请号:DE602005006274
申请日:2005-07-28
Applicant: ST MICROELECTRONICS SRL , HYNIX SEMICONDUCTOR INC
Inventor: BOVINO ANGELO , MICHELONI RINO , RAVASIO ROBERTO
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公开(公告)号:ITMI20022629A1
公开(公告)日:2004-06-13
申请号:ITMI20022629
申请日:2002-12-12
Applicant: ST MICROELECTRONICS SRL
Inventor: MICHELONI RINO , RAVASIO ROBERTO
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公开(公告)号:DE602005021344D1
公开(公告)日:2010-07-01
申请号:DE602005021344
申请日:2005-07-28
Applicant: ST MICROELECTRONICS SRL , HYNIX SEMICONDUCTOR INC
Inventor: BOVINO ANGELO , RAVASIO ROBERTO , MICHELONI RINO
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公开(公告)号:DE602006009662D1
公开(公告)日:2009-11-19
申请号:DE602006009662
申请日:2006-08-24
Applicant: ST MICROELECTRONICS SRL , HYNIX SEMICONDUCTOR INC
Inventor: MICHELONI RINO , CRIPPA LUCA , RAVASIO ROBERTO , PIO FEDERICO
IPC: G11C16/34
Abstract: A method for operating a flash memory device ( 100 ) is proposed. The memory device includes a matrix of memory cells ( 110 ) each one having a programmable threshold voltage (V T ) defining a value stored in the memory cell. The method includes the steps of crasing a block ( 115 ) of memory cells, and compacting the threshold voltages of the memory cells of the block within a predefined compacting range, wherein the step of compacting includes: selecting at least one first memory cell (110 0e ) of the block for writing a target value; restoring the threshold voltage of a subset (110 0e ; 110 1o ) of the memory cells of the block to the compacting range, the subset consisting of the at least one first memory cell (110 0e ) and/or at least one second memory cell of the block (110 1o ) being adjacent to the at least one first memory cell; and at least partially writing the target value into the at least one first memory cell.
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公开(公告)号:DE602006006788D1
公开(公告)日:2009-06-25
申请号:DE602006006788
申请日:2006-03-02
Applicant: ST MICROELECTRONICS SRL
Inventor: MARELLI ALESSIA , INTINI VALERIA , RAVASIO ROBERTO , MICHELONI RINO
Abstract: A reading method for a memory device with error-correcting encoding envisages the steps of: carrying out a first reading of a plurality of memory locations (A 0 , A 1 , ..., A LS-1 ) to generate a first recovered string (S 1 ), and performing a first decoding attempt using the first recovered string (S 1 ). When the first decoding attempt fails, the memory locations are read at least one second time, and at least one second recovered string (S 2 -S N ) is generated. On the basis of a comparison between the first recovered string (S 1 ) and the second recovered string (S 2 -S N ), a modified string (S M ) is generated, in which erasures (X) are located, and at least one second decoding attempt is carried out using the modified string (S M ).
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公开(公告)号:DE602004014371D1
公开(公告)日:2008-07-24
申请号:DE602004014371
申请日:2004-09-10
Applicant: ST MICROELECTRONICS SRL , HYNIX SEMICONDUCTOR INC
Inventor: MICHELONI RINO , RAVASIO ROBERTO , BOVINO ANGELO , ALTIERI VINCENZO
IPC: G06F11/10
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公开(公告)号:DE602005006274T2
公开(公告)日:2009-05-07
申请号:DE602005006274
申请日:2005-07-28
Applicant: ST MICROELECTRONICS SRL , HYNIX SEMICONDUCTOR INC
Inventor: BOVINO ANGELO , MICHELONI RINO , RAVASIO ROBERTO
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