公开(公告)号：EP4520716A1

公开(公告)日：2025-03-12

申请号：EP24195132.6

申请日：2024-08-19

Applicant: STMicroelectronics International N.V.

Inventor： NOMELLINI, Andrea ,  GELMI, Ilaria ,  CAPRA, Federica ,  VIMERCATI, Michele ,  LAMAGNA, Luca

IPC: B81B3/00

Abstract: A process for manufacturing a microelectromechanical device (10) includes: on a body (13) containing semiconductor material, forming a sacrificial layer (18) of dielectric material having a first surface (18a), opposite to the body (13); conferring a sacrificial surface roughness to the first surface (18a) of the sacrificial layer (18); on the first surface (18a) of the sacrificial layer (18), forming a structural layer (112) of semiconductor material having a second surface (112a) in contact with the first surface (18a) of the sacrificial layer (18). Conferring sacrificial surface roughness to the first surface (18a) of the sacrificial layer (18) includes: on the sacrificial layer (18), forming a transfer layer (19) of semiconductor material with intrinsic porosity; and partially removing the sacrificial layer (18) through the transfer layer (19).

公开(公告)号：EP4005972A1

公开(公告)日：2022-06-01

申请号：EP21211139.7

申请日：2021-11-29

Applicant: STMicroelectronics S.r.l. ,  STMicroelectronics International N.V.

Inventor： DUQI, Enri ,  BALDO, Lorenzo ,  FERRARI, Paolo ,  VIGNA, Benedetto ,  VILLA, Flavio Francesco ,  CASTOLDI, Laura Maria ,  GELMI, Ilaria

IPC: B81C1/00 ,  H04R1/08

Abstract: A semiconductor device includes: a substrate (2); a transduction microstructure (3) integrated in the substrate (2); a cap (5) joined to the substrate (2) and having a first face (5a) adjacent to the substrate (2) and a second, outer, face (5b); and a channel (15) extending through the cap (5) from the second face (5b) to the first face (5a) and communicating with the transduction microstructure (3). A protective membrane (17) made of porous polycrystalline silicon permeable to aeriform substances is set across the channel (15).