公开(公告)号：EP4020547A3

公开(公告)日：2022-07-06

申请号：EP21215266.4

申请日：2021-12-16

Applicant: STMicroelectronics S.r.l.

Inventor： STELLA, Cristiano Gianluca ,  RIZZA, Roberto

IPC: H01L23/492 ,  H01L23/495

Abstract: The packaged power electronic device (1) has a bearing structure (15) including a base section (16) and a transverse section (17) extending transversely to the base section. A die (2) is bonded to the base section of the bearing structure and has a first terminal (11) on a first main face (2A) and a second and a third terminal (12, 13) on a second main face (2B). A package (5) of insulating material embeds the semiconductor die (2), the second terminal (12), the third terminal (13) and at least partially the carrying base (16). A first, a second and a third outer connection region (36, 31, 33) are electrically coupled to the first, the second and the third terminals of the die, respectively, are laterally surrounded by the package and face the second main surface (5B) of the package. The transverse section (17) of the bearing structure extends from the base section (16) towards the second main surface of the package and has a higher height with respect to the die.

公开(公告)号：EP4020547A2

公开(公告)日：2022-06-29

申请号：EP21215266.4

申请日：2021-12-16

Applicant: STMicroelectronics S.r.l.

Inventor： STELLA, Cristiano Gianluca ,  RIZZA, Roberto

IPC: H01L23/492 ,  H01L23/495

Abstract: The packaged power electronic device (1) has a bearing structure (15) including a base section (16) and a transverse section (17) extending transversely to the base section. A die (2) is bonded to the base section of the bearing structure and has a first terminal (11) on a first main face (2A) and a second and a third terminal (12, 13) on a second main face (2B). A package (5) of insulating material embeds the semiconductor die (2), the second terminal (12), the third terminal (13) and at least partially the carrying base (16). A first, a second and a third outer connection region (36, 31, 33) are electrically coupled to the first, the second and the third terminals of the die, respectively, are laterally surrounded by the package and face the second main surface (5B) of the package. The transverse section (17) of the bearing structure extends from the base section (16) towards the second main surface of the package and has a higher height with respect to the die.

公开(公告)号：EP3139407A1

公开(公告)日：2017-03-08

申请号：EP16162014.1

申请日：2016-03-23

Applicant: STMicroelectronics S.r.l.

Inventor： RIZZA, Roberto ,  MINOTTI, Agatino ,  MONTALTO, Gaetano ,  SALAMONE, Francesco

IPC: H01L23/373 ,  H01L23/498 ,  H01L23/538 ,  H01L25/07

CPC classification number: H05K1/0203 ,  H01L23/053 ,  H01L23/08 ,  H01L23/24 ,  H01L23/296 ,  H01L23/3114 ,  H01L23/34 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/3735 ,  H01L23/3737 ,  H01L23/492 ,  H01L23/49811 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/5385 ,  H01L24/27 ,  H01L24/33 ,  H01L24/83 ,  H01L25/072 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/29139 ,  H01L2224/32227 ,  H01L2224/33181 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/40225 ,  H01L2224/83192 ,  H01L2224/8384 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/15153 ,  H01L2924/19107 ,  H05K1/115 ,  H05K3/10 ,  H05K7/1427 ,  H05K13/0023 ,  H05K2201/06

Abstract: An electronic power module (20) comprising a case (22) that houses a stack (88), which includes: a first substrate (26) of a DBC type or the like; a die (27), integrating an electronic component having one or more electrical-conduction terminals, mechanically and thermally coupled to the first substrate; and a second substrate (29), of a DBC type or the like, which extends over the first substrate and over the die and presents a conductive path (32) facing the die. The die is mechanically and thermally coupled to the first substrate by a first coupling region (30) of a sintered thermoconductive paste, and the one or more conduction terminals of the electronic component are mechanically, electrically, and thermally coupled to the conductive path (32) of the second substrate (29) by a second coupling region (34) of sintered thermoconductive paste.

Abstract translation: 一种电子功率模块（20），包括一个壳体（22）做了房屋的堆叠（88），其中包括：一个DBC型等的第一基板（26）; a是（27），INTEGRA廷到具有一个或多个电传导端子，机械和热耦合到所述第一基板上的电子部件; 和第二基片（29），一个类型DBC或类似物，其延伸在所述第一基底和在所述管芯和具有面向所述模具的导电路径（32）的。 模具是机械和热耦合到由烧结导热膏的第一耦合区（30），所述第一基底和所述电子部件的所述一个或多个导电端子是机械，电和热耦合到所述导电路径（32 ）的第二基片（29）由烧结导热膏的第二联接区域（34）的。