Abstract:
A memory device (100) is proposed. The memory device includes a matrix (105) of memory cells (P h,k ,T h,k ) arranged in a plurality of rows and a plurality of columns, each memory cell including a functional element (P h,k ) with a programmable resistivity and a unidirectional conduction access element (T h,k ) connected in series, a plurality of word lines (WL h ) and a plurality of bit lines (BL k ), the memory cells of each row being connected to a corresponding word line and the memory cells of each column being connected to a corresponding bit line, means (120) for driving the bit lines to a desired voltage, means (110c,115) for selecting at least one bit line in an operative condition of the memory device, each selected bit line being connected to the means for driving and each deselected bit line being disconnected from the means for driving, and means (110r) for selecting a word line in the operative condition, each access element associated with the selected word line and the at least one selected bit line being forward biased and the other access elements being reverse biased; the memory device further includes means (Pd h ,Td h ;B k ,Bd,205,S k ,Sd;D k ,Dd,303-320) for biasing the deselected bit lines in the operative condition to prevent a leakage current of the reverse biased access elements from forward biasing the access elements associated with the selected word line and the deselected bit lines.
Abstract:
A phase change memory device includes a plurality of PCM cells (3), arranged in rows and columns, PCM cells (3) arranged on the same column being connected to a same bit line (10); a plurality of first selectors (12), each coupled to a respective PCM cell (3); an addressing circuit (4, 5) for selectively addressing at least one of the bit lines (10), one of the first selectors (12), and the PCM cell (3) connected to the addressed bit line (10) and to the addressed first selector (12); and a regulated voltage supply circuit (7, 14, 15), selectively connectable to the addressed bit line (10), for supplying a bit line voltage (V BL ). The bit line voltage (V BL ) is correlated to a first control voltage (V EBA ) on the addressed first selector (12), coupled to the addressed PCM cell (3).
Abstract:
A phase change memory (20) has an array (1) formed by a plurality of cells (2), each including a memory element (3) of calcogenic material and a selection element (4) connected in series to the memory element; a plurality of address lines (11) connected to the cells; a write stage (24) and a reading stage (25) connected to the array. The write stage (24) is formed by current generators (45), which supply preset currents to the selected cells (2) so as to modify the resistance of the memory element (3). Reading takes place in voltage, by appropriately biasing the selected cell and comparing the current flowing therein with a reference value.
Abstract:
A memory device having a reading configuration and including a plurality of memory cells (3), arranged in rows and columns, memory cells (3) arranged on the same column having respective first terminals (3a) connected to a same bit line (12) and memory cells (3) arranged on the same row having respective second terminals (3b) selectively connectable to a same word line (13); a supply line (9) providing a supply voltage (V DD ); a column addressing circuit (4) and a row addressing circuit (5) for respectively addressing a bit line (12) and a word line (13) corresponding to a memory cell (3) selected for reading in the reading configuration. The column addressing circuit (4) is configured to bias the addressed bit line (12) corresponding to the selected memory cell (3) substantially at the supply voltage (V DD ) in the reading configuration. A row driving circuit (6) biases the addressed word line (13) corresponding to the selected memory cell (3) at a non-zero word line read voltage (V WL ), so that a predetermined cell voltage (V CELL ), lower than a phase change voltage (V PHC ), is applied between the first terminal (3a) and the second terminal (3b) of the selected memory cell (3) in the reading configuration.
Abstract:
A semiconductor memory device ( 100 ), including a plurality of programmable memory cells ( MC ) each one adapted to be brought into one among at least a first status and a second status, said plurality of memory cells including memory cells intended to store data, and means for accessing ( 115,130,135 ) the memory cells for reading/modifying their status. At least one memory cell ( FMC ) in said plurality is used as detector memory cell, and control means ( 145 ) operatively associated with the at least one detector memory cell are provided, said control means being adapted to establishing a potential loss of the data stored in the memory cells of said plurality based on a detected first status of the at least one detector memory cell.
Abstract:
A nonvolatile phase change memory device (1) including a memory array (2) formed by memory cells (3) arranged in rows and columns, word lines (4) connected to first terminals of memory cells (3) arranged on the same row, and bit lines (5) connected to second terminals of memory cells (3) arranged on the same column, a row decoder (6) coupled to the memory array (2) to bias the word lines (4), a column decoder (7) coupled to the memory array (2) to bias the bit lines (5), and a biasing circuit (8) coupled to the row decoder (6) and to the column decoder (7) to supply a first biasing voltage ( V A ) and a second biasing voltage ( V SS ) to the terminals of an addressed memory cell (3), wherein the first biasing voltage ( V A ) is a positive biasing voltage and the second biasing voltage ( V SS ) is a negative biasing voltage.
Abstract:
A memory device (20) of a phase change type, wherein a memory cell (2) has a memory element (3) of calcogenic material switcheable between at least two phases associated with two different states of the memory cell. A write stage (24) is connected to the memory cell and has a capacitive circuit (35) configured to generate a discharge current used as write current having no constant portion and causing the memory cell (2) to change state.
Abstract:
In a nonvolatile memory device, data stored in a memory cell (21a, 21b) are associated to whether or not the memory cell is switchable between a first state and a second state. Memory cells are irreversibly programmed by applying an irreversible programming signal (I IRP ), such that the nonvolatile memory cells (21a) are made not switchable between the first state and the second state in response to the irreversible programming signal (I IRP ). Reading memory cells includes: assessing (100, 110, 120, 140, 150, 160) whether a memory cell (21a, 21b) is switchable between a first state and a second state; determining that a first irreversible logic value ("1") is associated to the memory cell (21a), if the memory cell (21a) is not switchable between the first state and the second state (130); and determining that a second irreversible logic value ("0") is associated to the memory cell (21b), if the memory cell (21b) is switchable between the first state and the second state (170).