Abstract:
A phase-change memory device includes a plurality of data PCM cells (13), for storing data bits; data decoding circuits (14, 27, 28a), for selectively addressing sets of data PCM cells (13); and data read/program circuits (20a), for reading and programming the selected data PCM cells (13). The device further includes a plurality of parity PCM cells (25), for storing parity bits associated to data bits stored in the data PCM cells (13); parity decoding circuits (14, 27, 28b), for selectively addressing sets of parity PCM cells (25); and parity read/program circuits (20b), for reading and programming the selected parity PCM cells (25).
Abstract:
A memory device is proposed. The memory device includes a plurality of memory cells (P,S), wherein each memory cell includes a storage element (P) and a selector (S) for selecting the corresponding storage element during a reading operation or a programming operation. The selector includes a unipolar element (M) and a bipolar element (D;B). The memory device further includes control means (110s) for prevalently enabling the unipolar element during the reading operation or the bipolar element during the programming operation.
Abstract:
A memory device (100) is proposed. The memory device includes a matrix (105) of memory cells (P h,k ,T h,k ) arranged in a plurality of rows and a plurality of columns, each memory cell including a functional element (P h,k ) with a programmable resistivity and a unidirectional conduction access element (T h,k ) connected in series, a plurality of word lines (WL h ) and a plurality of bit lines (BL k ), the memory cells of each row being connected to a corresponding word line and the memory cells of each column being connected to a corresponding bit line, means (120) for driving the bit lines to a desired voltage, means (110c,115) for selecting at least one bit line in an operative condition of the memory device, each selected bit line being connected to the means for driving and each deselected bit line being disconnected from the means for driving, and means (110r) for selecting a word line in the operative condition, each access element associated with the selected word line and the at least one selected bit line being forward biased and the other access elements being reverse biased; the memory device further includes means (Pd h ,Td h ;B k ,Bd,205,S k ,Sd;D k ,Dd,303-320) for biasing the deselected bit lines in the operative condition to prevent a leakage current of the reverse biased access elements from forward biasing the access elements associated with the selected word line and the deselected bit lines.
Abstract:
A phase-change memory device includes a plurality of data PCM cells (13), for storing data bits; data decoding circuits (14, 27, 28a), for selectively addressing sets of data PCM cells (13); and data read/program circuits (20a), for reading and programming the selected data PCM cells (13). The device further includes a plurality of parity PCM cells (25), for storing parity bits associated to data bits stored in the data PCM cells (13); parity decoding circuits (14, 27, 28b), for selectively addressing sets of parity PCM cells (25); and parity read/program circuits (20b), for reading and programming the selected parity PCM cells (25).
Abstract:
A memory device having a reading configuration and including a plurality of memory cells (3), arranged in rows and columns, memory cells (3) arranged on the same column having respective first terminals (3a) connected to a same bit line (12) and memory cells (3) arranged on the same row having respective second terminals (3b) selectively connectable to a same word line (13); a supply line (9) providing a supply voltage (V DD ); a column addressing circuit (4) and a row addressing circuit (5) for respectively addressing a bit line (12) and a word line (13) corresponding to a memory cell (3) selected for reading in the reading configuration. The column addressing circuit (4) is configured to bias the addressed bit line (12) corresponding to the selected memory cell (3) substantially at the supply voltage (V DD ) in the reading configuration. A row driving circuit (6) biases the addressed word line (13) corresponding to the selected memory cell (3) at a non-zero word line read voltage (V WL ), so that a predetermined cell voltage (V CELL ), lower than a phase change voltage (V PHC ), is applied between the first terminal (3a) and the second terminal (3b) of the selected memory cell (3) in the reading configuration.
Abstract:
A nonvolatile memory device (10'; 10") is described comprising a memory array (11), a row decoder (12) and a column selector (13) for addressing the memory cells (16) of the memory array (11), and a biasing stage (22; 36, 28) for biasing the array access device terminal of the addressed memory cell (16). The biasing stage (22; 36 28) is arranged between the column selector (13) and the memory array (11) and comprises a biasing transistor (22; 36) having a drain terminal connected to the column selector (13), a source terminal connected to the array access device terminal of the addressed memory cell (16), and a gate terminal receiving a logic driving signal, the logic levels of which are defined by precise and stable voltages and are generated by a logic block (31) and an output buffer (32) cascaded together. The output buffer (32) may be supplied with either a read voltage (VREAD) or a program voltage (VPROG) supplied by a multiplexer (33). The biasing transistor (22; 36) may be either included as part of the column selector (13) and formed by the selection transistor (22) which is closest to the addressed memory cell (16) or distinct from the selection transistors (20, 21, 22) of the column selector (13).
Abstract:
A phase change memory device with memory cells (2) formed by a phase change memory element (3) and a selection switch (4) . A reference cell (2a) formed by an own phase change memory element (3a) and an own selection switch (4a) is associated to a group (7) of memory cells to be read. An electrical quantity of the group of memory cells is compared with an analogous electrical quantity of the reference cell, thereby compensating any drift in the properties of the memory cells.
Abstract:
A phase change memory device includes a plurality of PCM cells (3), arranged in rows and columns, PCM cells (3) arranged on the same column being connected to a same bit line (10); a plurality of first selectors (12), each coupled to a respective PCM cell (3); an addressing circuit (4, 5) for selectively addressing at least one of the bit lines (10), one of the first selectors (12), and the PCM cell (3) connected to the addressed bit line (10) and to the addressed first selector (12); and a regulated voltage supply circuit (7, 14, 15), selectively connectable to the addressed bit line (10), for supplying a bit line voltage (V BL ). The bit line voltage (V BL ) is correlated to a first control voltage (V EBA ) on the addressed first selector (12), coupled to the addressed PCM cell (3).
Abstract:
The phase-change nonvolatile memory array (8) is formed by a plurality of memory cells (10, 10') extending in a first and in a second direction orthogonal to each other. A plurality of column-selection lines (11) extend parallel to the first direction. A plurality of word-selection lines (12) extend parallel to the second direction. Each memory cell (10, 10') includes a PCM storage element (15) and a selection transistor (16). A first terminal of the selection transistor is connected to a first terminal of the PCM storage element, and the control terminal of the selection transistor is connected to a respective word-selection line (12). A second terminal of the PCM storage element (15) is connected to a respective column-selection line (11), and a second terminal of the selection transistor (16) is connected to a reference-potential region (18) while reading and programming the memory cells (10, 10').