公开(公告)号：EP1394554B1

公开(公告)日：2011-11-02

申请号：EP02425539.0

申请日：2002-08-30

Applicant: STMicroelectronics Srl ,  Nokia Corporation

Inventor： Zerbini, Sarah ,  Merassi, Angelo ,  Spinola Durante, Guido ,  De Masi, Biagio

IPC: G01P15/08 ,  B81C1/00 ,  B81B3/00 ,  G01P15/06 ,  G01P15/00 ,  G01P1/02 ,  H01H1/00 ,  H04M1/725

CPC classification number: H01H1/0036 ,  G01P1/023 ,  G01P15/06 ,  G01P15/0802 ,  G01P15/0891 ,  G01P15/18 ,  G01P2015/0814 ,  H01H35/146

公开(公告)号：EP1645847B1

公开(公告)日：2014-07-02

申请号：EP04425753.3

申请日：2004-10-08

Applicant: STMicroelectronics Srl

Inventor： Lasalandra, Ernesto ,  Merassi, Angelo ,  Zerbini, Sarah

IPC: G01C19/56 ,  G01C19/5755 ,  G01P15/125 ,  G01P15/18 ,  G01P1/00 ,  H03H9/02 ,  H01L23/34 ,  B81B7/00 ,  B81B3/00

CPC classification number: B81C1/0069 ,  B81B3/0081 ,  B81B2201/025 ,  B81C1/00158 ,  B81C1/00666 ,  G01C19/56 ,  G01C19/5755 ,  G01P1/006 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/0814 ,  H03H9/02448 ,  H03H2009/02496 ,  Y10T29/43

Abstract: A micro-electromechanical device includes a semiconductor body (5), in which at least one first microstructure (2) and one second microstructure (3) of reference are integrated. The first microstructure (2) and the second microstructure (3) are arranged in the body (5) so as to undergo equal strains as a result of thermal expansions of said body (5; 105; 205; 305). Furthermore, the first microstructure (2) is provided with movable parts (6) and fixed parts (7) with respect to the body (5), and the second microstructure (3) has a shape that is substantially symmetrical to the first microstructure (2) and is fixed with respect to the body (5).

公开(公告)号：EP1626283B1

公开(公告)日：2011-03-23

申请号：EP04425630.3

申请日：2004-08-13

Applicant: STMicroelectronics Srl

Inventor： Merassi, Angelo ,  Murari, Bruno ,  Zerbini, Sarah

IPC: G01P15/125 ,  G01P15/00 ,  B81B3/00

CPC classification number: G01P15/125 ,  B81B7/0048 ,  B81B2201/0235 ,  G01P1/006 ,  G01P2015/082

公开(公告)号：EP1394554A1

公开(公告)日：2004-03-03

申请号：EP02425539.0

申请日：2002-08-30

Applicant: STMicroelectronics S.r.l. ,  Nokia Corporation

Inventor： Zerbini, Sarah ,  Merassi, Angelo ,  Spinola Durante, Guido ,  De Masi, Biagio

IPC: G01P15/08 ,  B81C1/00 ,  B81B3/00 ,  G01P15/06 ,  G01P15/00 ,  G01P1/02 ,  H01H1/00 ,  H04M1/725

CPC classification number: H01H1/0036 ,  G01P1/023 ,  G01P15/06 ,  G01P15/0802 ,  G01P15/0891 ,  G01P15/18 ,  G01P2015/0814 ,  H01H35/146

Abstract: A process for the fabrication of an inertial sensor with failure threshold, including the steps of: forming, on top of a substrate (2) of a semiconductor wafer (1), at least one sample element (6) embedded in a sacrificial region (3, 12); forming, on top of the sacrificial region (3, 12), a body (18) connected to the sample element (6); and etching the sacrificial region (3, 12), so as to free the body (18) and the sample element (6).

Abstract translation: 一种制造具有故障阈值的惯性传感器的方法，包括以下步骤：在半导体晶片（1）的衬底（2）的顶部上形成至少一个嵌入在牺牲区域（6）中的样品元件（6） 3，12）; 在所述牺牲区域（3,12）的顶部上形成连接到所述样本元件（6）的本体（18）; 以及蚀刻牺牲区域（3,12），以释放主体（18）和样品元件（6）。

公开(公告)号：EP1394555B1

公开(公告)日：2012-04-25

申请号：EP02425540.8

申请日：2002-08-30

Applicant: STMicroelectronics S.r.l. ,  Nokia Corporation

Inventor： Zerbini, Sarah ,  Merassi, Angelo ,  Spinola Durante, Guido ,  De Masi, Biagio

IPC: G01P15/08 ,  G01P15/03 ,  G01P15/06 ,  H01H1/00 ,  H04M1/725 ,  G01P15/00

CPC classification number: G01P1/127 ,  G01P15/06 ,  G01P15/0802 ,  G01P15/0891 ,  G01P15/18 ,  G01P2015/0814 ,  H01H1/0036 ,  H01H35/146

公开(公告)号：EP1394555A1

公开(公告)日：2004-03-03

申请号：EP02425540.8

申请日：2002-08-30

Applicant: STMicroelectronics S.r.l. ,  Nokia Corporation

Inventor： Zerbini, Sarah ,  Merassi, Angelo ,  Spinola Durante, Guido ,  De Masi, Biagio

IPC: G01P15/08 ,  G01P15/03 ,  G01P15/06 ,  H01H1/00 ,  H04M1/725 ,  G01P15/00

CPC classification number: G01P1/127 ,  G01P15/06 ,  G01P15/0802 ,  G01P15/0891 ,  G01P15/18 ,  G01P2015/0814 ,  H01H1/0036 ,  H01H35/146

Abstract: An inertial sensor with failure threshold includes: a first body (2) and a second body (18), which can move relatively with respect to one another and are constrained by a plurality of elastic elements; and at least one sample element (6) connected between the first body (2) and the second body (18) and shaped so as to be subjected to a stress when the second body (18) is outside of a relative resting position with respect to the first body (2). The sample element (6) has at least one weakened region (9, 10).

Abstract translation: 具有故障阈值的惯性传感器包括：第一主体（2）和第二主体（18），其能够相对于彼此移动并且被多个弹性元件约束; 和至少一个连接在第一主体（2）和第二主体（18）之间的样本元件（6），并且其形状能够在第二主体（18）处于相对静止位置之外时承受应力 到第一机体（2）。 样本元件（6）具有至少一个弱化区域（9,10）。