公开(公告)号：JPS59195837A

公开(公告)日：1984-11-07

申请号：JP7102083

申请日：1983-04-21

Applicant: Sharp Corp

Inventor： KONNO YOSHITSUGU ,  OZAWA KAZUHITO ,  KITANISHI KANETOMO ,  SHINO KATSUHIDE ,  INOUE YUKIHIRO ,  OOKITA YOSHINORI ,  NAKAO KAZUHIRO ,  KOMAKI SHIGEKI

IPC: H05K3/32 ,  H01B1/22 ,  H01L21/60 ,  H01L23/482

CPC classification number: H01L23/4828 ,  H01L24/27 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/3025 ,  Y10T156/1062 ,  Y10T156/1077 ,  Y10T156/1089 ,  H01L2924/00

Abstract: PURPOSE:To enable the bonding of LSI without selecting the materials for a circuit board and a wiring of the circuit board by bonding the LSI chip to the board with a heat-seal agent including conductive particles such as Ag powder. CONSTITUTION:An Al pad 2 of the LSI chip 1 and a wiring 5 on a circuit board 6 are made to be electrically communicant with each other by Ag powder 8 in a heat-seal agent 7. For example, a wafer 9 including the pads 2 is coated with the heat-seal agent 7 on which the Ag powder 8 is dispersed uniformly. After that, the Ag powder 8 precipitates in the heat-seal agent 7. At this time, thickness of the heat-seal agent is 25mum and diameter of a particle of the Ag powder is 25mum and the dispersion distribution is 300 particles/mm. . After that, the part designated by the arrow is subjected to dicing and is then bonded to the wiring 5 on the circuit board 6. For the bonding, a soldering iron heated to 150 deg.C applys a pressure of 20kgr/cm for 5sec.

Abstract translation: 目的：通过使用包含导电性粒子（如Ag粉末）的热封装置将LSI芯片与板接合，从而不需要选择电路板的材料和电路板的布线来实现LSI的接合。 构成：将LSI芯片1的Al焊盘2和电路板6上的布线5通过Ag粉末8在热密封剂7中彼此电连通。例如，包括焊盘的晶片9 2涂覆有均匀分散有Ag粉末8的热封剂7。 之后，Ag粉末8在热封剂7中析出。此时，热封剂的厚度为25μm，Ag粉末的粒径为25μm，分散分布为300个/ mm。 <2>。 之后，用箭头指定的部分进行切割，然后与电路板6上的布线5接合。对于接合，加热至150℃的烙铁施加20kgr / cm 2的压力 5秒钟