公开(公告)号：JPS59195837A

公开(公告)日：1984-11-07

申请号：JP7102083

申请日：1983-04-21

Applicant: Sharp Corp

Inventor： KONNO YOSHITSUGU ,  OZAWA KAZUHITO ,  KITANISHI KANETOMO ,  SHINO KATSUHIDE ,  INOUE YUKIHIRO ,  OOKITA YOSHINORI ,  NAKAO KAZUHIRO ,  KOMAKI SHIGEKI

IPC: H05K3/32 ,  H01B1/22 ,  H01L21/60 ,  H01L23/482

CPC classification number: H01L23/4828 ,  H01L24/27 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/3025 ,  Y10T156/1062 ,  Y10T156/1077 ,  Y10T156/1089 ,  H01L2924/00

Abstract: PURPOSE:To enable the bonding of LSI without selecting the materials for a circuit board and a wiring of the circuit board by bonding the LSI chip to the board with a heat-seal agent including conductive particles such as Ag powder. CONSTITUTION:An Al pad 2 of the LSI chip 1 and a wiring 5 on a circuit board 6 are made to be electrically communicant with each other by Ag powder 8 in a heat-seal agent 7. For example, a wafer 9 including the pads 2 is coated with the heat-seal agent 7 on which the Ag powder 8 is dispersed uniformly. After that, the Ag powder 8 precipitates in the heat-seal agent 7. At this time, thickness of the heat-seal agent is 25mum and diameter of a particle of the Ag powder is 25mum and the dispersion distribution is 300 particles/mm. . After that, the part designated by the arrow is subjected to dicing and is then bonded to the wiring 5 on the circuit board 6. For the bonding, a soldering iron heated to 150 deg.C applys a pressure of 20kgr/cm for 5sec.

Abstract translation: 目的：通过使用包含导电性粒子（如Ag粉末）的热封装置将LSI芯片与板接合，从而不需要选择电路板的材料和电路板的布线来实现LSI的接合。 构成：将LSI芯片1的Al焊盘2和电路板6上的布线5通过Ag粉末8在热密封剂7中彼此电连通。例如，包括焊盘的晶片9 2涂覆有均匀分散有Ag粉末8的热封剂7。 之后，Ag粉末8在热封剂7中析出。此时，热封剂的厚度为25μm，Ag粉末的粒径为25μm，分散分布为300个/ mm。 <2>。 之后，用箭头指定的部分进行切割，然后与电路板6上的布线5接合。对于接合，加热至150℃的烙铁施加20kgr / cm 2的压力 5秒钟

公开(公告)号：JPS58179821A

公开(公告)日：1983-10-21

申请号：JP6325882

申请日：1982-04-15

Applicant: Sharp Corp

Inventor： SHINO KATSUHIDE

IPC: G02F1/13 ,  G02F1/1333

CPC classification number: G02F1/133351

Abstract: PURPOSE:To reduce the occurrence rate of defect to obtain a flexible display element, by subjecting cut positions of flexible substrates having electrodes to a preprocessing preliminarily before sticking them to cut them with a small force without a cutting tool or the like. CONSTITUTION:Two flexible substrates 1 and 2 where electrodes 3 and 4 corresponding to plural elements are formed are stuck and are cut with a cutting blade 7 after processes such as sealing of a display material to obtain plural flexible display elements. In this case, preprocessings such as perforating in cut positions 8 of substrates 1 and 2 are performed before flexible substrates 1 and 2 are stuck, thereby facilitating cutting them. Said perforations 8 are formed by providing minute holes in substrates 1 and 2 with a rotary blade 9 for perforation, a mold, or the like, and substrates 1 and 2 perforated in cut positions are stuck to each other.

Abstract translation: 目的：为了减少缺陷的发生率以获得柔性显示元件，通过在不用切割工具等的情况下，用小的力将具有电极的柔性基板的切割位置预先进行预处理，然后再进行预处理。 构成：在形成有与多个元件相对应的电极3和4的两个柔性基板1和2被卡住，并且在诸如密封显示材料的处理之后用切割刀片7切割以获得多个柔性显示元件。 在这种情况下，在柔性基板1和2被卡住之前执行诸如在基板1和2的切割位置8中穿孔的预处理，从而便于切割它们。 所述穿孔8是通过在基板1和2中设置用于穿孔用旋转刀片9，模具等的微小孔而形成的，并且在切割位置上穿孔的基板1和2彼此粘合。

公开(公告)号：JPS58181022A

公开(公告)日：1983-10-22

申请号：JP6412182

申请日：1982-04-16

Applicant: Sharp Corp

Inventor： SHINO KATSUHIDE ,  KITANISHI KANETOMO

IPC: G02F1/13 ,  G02F1/1333

CPC classification number: G02F1/133351

Abstract: PURPOSE:To cut a titled display element from one direction without damaging an electrode part, by cutting a part of a cutting part in advance by a Thomson die, a metallic die, etc., before sticking a substrate having upper and lower electrodes, and cutting each piece at one time after sticking it. CONSTITUTION:A flexible display element is constituted of flexible substrate 1, 2 such as a plastic film substrate, etc., a sealing material 3, electrodes 4, 5, and a liquid crystal 6. Before sticking the flexible substrate 1, notches 8, 9 are made on a part of the cutting part in advance by a metallic die, a Thomson die, etc., by which it can be cut to each piece by executing the cutting only once from the upper or lower part in the final process, the continuous production is executed easily, and the manufacture can be performed without damaging the electrode.

Abstract translation: 目的：为了从一个方向切割标题显示元件而不损坏电极部件，在粘贴具有上电极和下电极的基板之前，通过在汤姆逊模具，金属模具等预先切割切割部分的一部分，以及 坚持一次切割每一块。 构成：柔性显示元件由诸如塑料膜基板等的柔性基板1,2，密封材料3，电极4,5和液晶6构成。在粘贴柔性基板1之前， 预先通过金属模具，汤姆逊模具等在切割部分的一部分上制造出9，通过在最终工艺中从上部或下部执行一次切割，可以将切割部分切割成每一个， 可以容易地执行连续生产，并且可以在不损坏电极的情况下进行制造。

公开(公告)号：JPS59145163A

公开(公告)日：1984-08-20

申请号：JP2121583

申请日：1983-02-09

Applicant: Sharp Corp

Inventor： SHINO KATSUHIDE

IPC: H05B3/42 ,  B41J2/335 ,  B41J2/345

CPC classification number: B41J2/345

Abstract: PURPOSE:To prevent the oozing generation of a character while obtaining high quality printing by rapidly dissipating heat of a heat generator, by constituting a thermal head by forming the heat generator and an electrode to a glass cylinder being a substrate. CONSTITUTION:Heat generators 2 each comprising Ta2N or NiCr are formed to a part of the outer wall of a cylindrical glass substrate 1 by a vapor deposition method and strip like Al electrodes 3 are further formed so as to connect the one ends thereof to the heat generators 2 by the same vapor deposition method. External lead wires 4 are connected to one ends of the aforementioned Al electrodes 3 and SiC or Ta2O5 is vapor deposited in order to prevent abrasion due to the contact with paper to form an anti-wear layer 5. In the thermal head constituted as mentioned above, because the heat generated from each heat generator 2 is transferred to the inside of the glass substrate 1 and heat is dissipated to the outside therefrom, heat dissipating effect can be enhanced.

Abstract translation: 目的：为了通过快速耗散发热体的热量来获得高品质的印刷，通过将热发生器和电极组合成作为基板的玻璃圆筒构成热敏头来防止产生渗墨。 构成：通过气相沉积法将圆柱形玻璃基板1的外壁的一部分形成为Ta 2 N或NiCr的发热体2，进一步形成为Al电极3的带状，以将其一端连接到热 发电机2采用相同的气相沉积法。 外部引线4连接到上述Al电极3的一端，并且将SiC或Ta 2 O 5气相沉积以防止由于与纸接触而产生的磨损而形成耐磨层5.在如上所述构成的热敏头 由于从每个发热体2产生的热量转移到玻璃基板1的内部，所以散热到外部，从而可以提高散热效果。