公开(公告)号：JPS58205223A

公开(公告)日：1983-11-30

申请号：JP9031682

申请日：1982-05-26

Applicant: Sharp Corp

Inventor： OOKITA YOSHINORI

IPC: G05F1/56 ,  G05F1/613 ,  H01L31/04

CPC classification number: G05F1/613

Abstract: PURPOSE:To simplify the constitution of a control circuit, by short-circuiting solar batteries properly and controlling their output voltage. CONSTITUTION:Four solar batteries SB2-SB5 of the solar batteries are fitted with a slide switch SW. Namely, this slide switch has four stages SW1-SW4; when the switch is slid by one stage, the contact SW1 is closed to form a short circuit across the solar battery SB5 and when it is slid by two stages, the contacts SW1 and SW2 are closed to form short circuits across the solar batteries SB5 and SB4 respectively. Similarly, when it is slid by four stages, short circuits across the SB2-SB5 are formed and only the output voltage of the solar battery SB1 is supplied to a CPU.

Abstract translation: 目的：简化控制电路的结构，通过正确短路太阳能电池并控制其输出电压。 规定：太阳能电池的四个太阳能电池SB2-SB5配有滑动开关SW。 即，该滑动开关具有四级SW1-SW4; 当开关滑动一级时，触点SW1闭合以在太阳能电池SB5上形成短路，并且当其滑动两级时，触点SW1和SW2闭合以在太阳能电池SB5和 SB4。 类似地，当它滑动四级时，形成SB2-SB5两端的短路，并且只有太阳能电池SB1的输出电压被提供给CPU。

公开(公告)号：JPS5936957A

公开(公告)日：1984-02-29

申请号：JP14738682

申请日：1982-08-24

Applicant: Sharp Corp

Inventor： YABE YASUSHI ,  OOKITA YOSHINORI

IPC: H01L27/04 ,  H01L21/822 ,  H01L23/66 ,  H01L27/00 ,  H03K3/03

CPC classification number: H01L23/66 ,  H01L2224/48 ,  H01L2224/48247 ,  H01L2224/49 ,  H01L2224/49171 ,  H01L2924/00

Abstract: PURPOSE:To facilitate the adjustment of oscillation frequencies, facilitate the mounting, restrain the increase the consumed power, and enhance the rate of non-defectives by a method wherein the oscillation frequency of an oscillation circuit is set within a fixed range by the wiring process out of chips. CONSTITUTION:The oscillation frequency is previously measured by the unit body of chips, when pads of the semiconductor chip 1 are connected to lead terminals 2 by means of wires 3. The measured content is memorized in a bonding machine. The oscillation frequency of the built-in oscillator of the chip 1 is adjusted by short-circuiting or opening built-in each oscillation resistor utilizing the lead terminals 2 connected from the pads A, B, and C of the chip by means of the wires 3. Therefore, it is not necessary to lead out lead wires for oscillation control directly to the outside of the chip 1.

Abstract translation: 目的：为了便于调整振荡频率，便于安装，通过布线过程将振荡电路的振荡频率设定在固定范围内的方法，抑制消耗功率的增加，提高非缺陷率 出了芯片。 构成：当半导体芯片1的焊盘通过导线3连接到引线端子2时，振荡频率预先由芯片的单元体测量。测量的内容被存储在粘合机中。 芯片1的内置振荡器的振荡频率通过利用从芯片的焊盘A，B和C与芯片的焊盘A，B和C连接的引线端子2通过短路或断开内置的每个振荡电阻来调节 因此，不需要将用于振荡控制的引线直接引导到芯片1的外部。

公开(公告)号：JPS59195837A

公开(公告)日：1984-11-07

申请号：JP7102083

申请日：1983-04-21

Applicant: Sharp Corp

Inventor： KONNO YOSHITSUGU ,  OZAWA KAZUHITO ,  KITANISHI KANETOMO ,  SHINO KATSUHIDE ,  INOUE YUKIHIRO ,  OOKITA YOSHINORI ,  NAKAO KAZUHIRO ,  KOMAKI SHIGEKI

IPC: H05K3/32 ,  H01B1/22 ,  H01L21/60 ,  H01L23/482

CPC classification number: H01L23/4828 ,  H01L24/27 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/3025 ,  Y10T156/1062 ,  Y10T156/1077 ,  Y10T156/1089 ,  H01L2924/00

Abstract: PURPOSE:To enable the bonding of LSI without selecting the materials for a circuit board and a wiring of the circuit board by bonding the LSI chip to the board with a heat-seal agent including conductive particles such as Ag powder. CONSTITUTION:An Al pad 2 of the LSI chip 1 and a wiring 5 on a circuit board 6 are made to be electrically communicant with each other by Ag powder 8 in a heat-seal agent 7. For example, a wafer 9 including the pads 2 is coated with the heat-seal agent 7 on which the Ag powder 8 is dispersed uniformly. After that, the Ag powder 8 precipitates in the heat-seal agent 7. At this time, thickness of the heat-seal agent is 25mum and diameter of a particle of the Ag powder is 25mum and the dispersion distribution is 300 particles/mm. . After that, the part designated by the arrow is subjected to dicing and is then bonded to the wiring 5 on the circuit board 6. For the bonding, a soldering iron heated to 150 deg.C applys a pressure of 20kgr/cm for 5sec.

Abstract translation: 目的：通过使用包含导电性粒子（如Ag粉末）的热封装置将LSI芯片与板接合，从而不需要选择电路板的材料和电路板的布线来实现LSI的接合。 构成：将LSI芯片1的Al焊盘2和电路板6上的布线5通过Ag粉末8在热密封剂7中彼此电连通。例如，包括焊盘的晶片9 2涂覆有均匀分散有Ag粉末8的热封剂7。 之后，Ag粉末8在热封剂7中析出。此时，热封剂的厚度为25μm，Ag粉末的粒径为25μm，分散分布为300个/ mm。 <2>。 之后，用箭头指定的部分进行切割，然后与电路板6上的布线5接合。对于接合，加热至150℃的烙铁施加20kgr / cm 2的压力 5秒钟