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    FABRICATION OF LEADS ON SEMICONDUCTOR CONNECTION COMPONENTS
    1.
    发明申请
    FABRICATION OF LEADS ON SEMICONDUCTOR CONNECTION COMPONENTS 审中-公开
    半导体连接部件引线的制造

    公开(公告)号：WO1996034744A1

    公开(公告)日：1996-11-07

    申请号：PCT/US1996006228

    申请日：1996-05-03

    Applicant: TESSERA, INC.

    Inventor： TESSERA, INC. ,  FJELSTAD, Joseph ,  SMITH, John, W.

    IPC: B32B31/12

    CPC classification number: H05K3/4092 ,  H01L23/4985 ,  H01L24/80 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  Y10T29/49121 ,  Y10T29/49222 ,  Y10T156/1052 ,  H01L2924/00

    Abstract: A substantially continuous layer of a first metal (137) such as copper is provided with strips of a second metal (147) such as gold by selective electroplating of the second metal, or by applying separately formed strips such as lengths of wire. A dielectric support layer (132) is provided in contact with the first metal layer, and the first metal layer is etched to leave strips of the first metal continuous with the strips of the second metal, thereby providing composite leads with the first and second metal strips connected in series. The process provides simple and economical methods of making microelectronic connection components with leads having a flexible, fatigue resistant lead portion formed from a precious metal. The leads may incorporate sections of round cross-sectional shape to facilitate engagement by a bonding tool during use of the component.

    Abstract translation: 第一金属（137）如铜的基本上连续的层通过第二金属的选择性电镀或通过施加单独形成的条（例如一段电线）而设置有诸如金的第二金属（147）的条。 提供与第一金属层接触的电介质支撑层（132），并且蚀刻第一金属层以留下与第二金属的条带连续的第一金属的条带，由此提供具有第一和第二金属的复合引线 条带串联连接。 该方法提供了简单和经济的方法来制造具有由贵金属形成的柔性耐疲劳导线部分的引线的微电子连接部件。 引线可以包括圆形横截面形状的部分，以便于在部件的使用期间通过焊接工具的接合。

    ELECTRICAL CONNECTION WITH INWARDLY DEFORMABLE CONTACTS
    5.
    发明申请
    ELECTRICAL CONNECTION WITH INWARDLY DEFORMABLE CONTACTS 审中-公开
    与连接不牢固的电气连接

    公开(公告)号：WO1998026476A1

    公开(公告)日：1998-06-18

    申请号：PCT/US1997023948

    申请日：1997-12-12

    Applicant: TESSERA, INC.

    Inventor： TESSERA, INC. ,  DISTEFANO, Thomas, H. ,  FJELSTAD, Joseph

    IPC: H01R23/68

    CPC classification number: H05K3/462 ,  H01L23/49827 ,  H01L23/5385 ,  H01L2924/0002 ,  H01R12/523 ,  H05K1/116 ,  H05K3/4623 ,  H05K2201/0195 ,  H05K2201/0382 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/10378 ,  H01L2924/00

    Abstract: An interposer (50) for interconnection between microelectronic circuit panels (80, 92) has contacts (70, 90) at its surfaces (63, 64). Each contact extends from a central conductor (72), and has a peripheral portion adapted to contract radially inwardly toward the central conductor (72) in response to a force applied by a contact pad (81, 95) defining a central hole (83) on the engaged circuit panel. Thus, when the circuit panels are compressed with the interposers, the contacts (70, 90) contract radially inwardly and wipe across the pads (81, 95). The wiping action facilitates bonding of the contacts to the pads, as by friction welding, or by a conductive bonding material carried on the contacts themselves.

    Abstract translation: 用于微电子电路板（80,92）之间的互连的插入器（50）在其表面（63,64）处具有触点（70,90）。 每个接触件从中心导体（72）延伸，并且响应由限定中心孔（83）的接触垫（81,95）施加的力，具有适于径向向内朝向中心导体（72）收缩的周边部分， 在接合的电路板上。 因此，当电路板被内插件压缩时，触头（70,90）径向向内收缩并擦拭穿过焊盘（81,95）。 擦拭动作有助于通过摩擦焊接将接触件接合到焊盘，或者通过接触件本身承载的导电接合材料。

    METHOD OF ENCAPSULATING A SEMICONDUCTOR PACKAGE
    7.
    发明申请
    METHOD OF ENCAPSULATING A SEMICONDUCTOR PACKAGE 审中-公开
    封装半导体封装的方法

    公开(公告)号：WO1997033312A1

    公开(公告)日：1997-09-12

    申请号：PCT/US1997003273

    申请日：1997-03-04

    Applicant: TESSERA, INC.

    Inventor： TESSERA, INC. ,  DISTEFANO, Thomas, H. ,  SMITH, John, W. ,  FJELSTAD, Joseph ,  MITCHELL, Craig, S. ,  KARAVAKIS, Konstantine

    IPC: H01L21/56

    CPC classification number: H01L21/568 ,  H01L21/56 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49572 ,  H01L24/32 ,  H01L24/50 ,  H01L24/97 ,  H01L2224/11003 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2224/86 ,  H01L2924/00

    Abstract: A method of encapsulating a semiconductor device. The encapsulation method includes a semiconductor chip package assembly (10) having a spacer (20) layer between a top surface of a sheet-like substrate (16) and a contact bearing surface of a semiconductor chip (12), wherein the substrate (16) has conductive leads (22) thereon, the leads (22) being electrically connected to terminals (26) on a first end and bonded to respective chip contacts (24) on a second end. Typically, the spacer layer (20) is comprised of a compliant or elastomeric material (40). A protective layer (30) is attached on a bottom surface of the substrate (16) so as to cover the terminals (26) on the substrate. A flowable, curable encapsulant material (40) is deposited around a periphery of the semiconductor chip (12) after the attachment of the protective layer (30) so as to encapsulate the leads (22). The encapsulant material (40) is then cured. Typically, this encapsulation method is performed on a plurality of chip assemblies simultaneously.

    Abstract translation: 一种封装半导体器件的方法。 封装方法包括在片状基片（16）的顶表面和半导体芯片（12）的接触支承表面之间具有间隔层（20）的半导体芯片封装组件（10），其中衬底（16） ）在其上具有导电引线（22），引线（22）在第一端上电连接到端子（26）并且在第二端上结合到相应的芯片触点（24）。 通常，间隔层（20）由顺应性或弹性体材料（40）组成。 保护层（30）安装在基板（16）的底表面上，以覆盖基板上的端子（26）。 在保护层（30）的附着之后，围绕半导体芯片（12）的周边沉积可流动的可固化的密封剂材料（40）以封装引线（22）。 密封剂材料（40）然后固化。 通常，这种封装方法同时在多个芯片组件上执行。

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