公开(公告)号：AU2003279215A8

公开(公告)日：2004-05-04

申请号：AU2003279215

申请日：2003-10-10

Applicant: TESSERA INC

Inventor： DAMBERG PHILIP ,  GIBSON DAVID ,  WARNER MICHAEL ,  KIM YOUNG-GON ,  OSBORN PHILIP

IPC: H01L25/10 ,  H05K1/14 ,  H05K3/34 ,  H01L23/34

Abstract: An ultra thin system-in-a-package (SIP) with independent test and repair capability comprises an interposer having arranged on a top surface and a bottom surface thereof a number of packaged semiconductor chips mounted via solder bumps in accordance with a Land Grid Array (LGA) format and wherein no underfill is used on the SIP.

公开(公告)号：AU2003279215A1

公开(公告)日：2004-05-04

申请号：AU2003279215

申请日：2003-10-10

Applicant: TESSERA INC

Inventor： WARNER MICHAEL ,  DAMBERG PHILIP ,  OSBORN PHILIP ,  KIM YOUNG-GON ,  GIBSON DAVID

IPC: H01L25/10 ,  H05K1/14 ,  H05K3/34

Abstract: An ultra thin system-in-a-package (SIP) with independent test and repair capability comprises an interposer having arranged on a top surface and a bottom surface thereof a number of packaged semiconductor chips mounted via solder bumps in accordance with a Land Grid Array (LGA) format and wherein no underfill is used on the SIP.

公开(公告)号：WO2004034434A2

公开(公告)日：2004-04-22

申请号：PCT/US0332078

申请日：2003-10-10

Applicant: TESSERA INC

Inventor： KIM YOUNG-GON ,  GIBSON DAVID ,  WARNER MICHAEL ,  DAMBERG PHILIP ,  OSBORN PHILIP

IPC: H01L25/10 ,  H05K1/14 ,  H05K3/34 ,  H01L

CPC classification number: H05K1/141 ,  H01L25/105 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/3511 ,  H05K3/3436 ,  H05K2201/10719 ,  H05K2203/1572 ,  H01L2924/00 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05647

Abstract: An ultra thin system-in-a-package (SIP) with independent test and repair capability comprises an interposer (350) having arranged on a top surface (351) and a bottom surface (352) thereof a number of packaged semiconductor chips (315, 320, 325, 330) mounted via solder bumps (335) in accordance with a Land Grid Array (LGA) format and wherein no underfill is used on the SIP.

Abstract translation: 具有独立测试和修复功能的超薄系统级封装（SIP）包括布置在多个封装半导体芯片（315）的顶表面（351）和底表面（352）上的插入器（350） ，320,325,330），其经由焊盘（335）安装，所述焊料凸块（335）根据陆地网格阵列（LGA）格式，并且其中在所述SIP上不使用底部填充物。

公开(公告)号：WO2004034434A9

公开(公告)日：2005-05-26

申请号：PCT/US0332078

申请日：2003-10-10

Applicant: TESSERA INC

Inventor： KIM YOUNG-GON ,  GIBSON DAVID ,  WARNER MICHAEL ,  DAMBERG PHILIP ,  OSBORN PHILIP

IPC: H01L25/10 ,  H05K1/14 ,  H05K3/34 ,  H01L

CPC classification number: H05K1/141 ,  H01L25/105 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/3511 ,  H05K3/3436 ,  H05K2201/10719 ,  H05K2203/1572 ,  H01L2924/00 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05647

Abstract: An ultra thin system-in-a-package (SIP) with independent test and repair capability comprises an interposer (350) having arranged on a top surface (351) and a bottom surface (352) thereof a number of packaged semiconductor chips (315, 320, 325, 330) mounted via solder bumps (335) in accordance with a Land Grid Array (LGA) format and wherein no underfill is used on the SIP.

Abstract translation: 具有独立测试和修复功能的超薄系统级封装（SIP）包括布置在多个封装半导体芯片（315）的顶表面（351）和底表面（352）上的插入器（350） ，320,325,330），其经由焊盘（335）安装，所述焊料凸块（335）根据陆地网格阵列（LGA）格式，并且其中在所述SIP上不使用底部填充物。