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    MICROELECTRONIC ADAPTORS, ASSEMBLIES AND METHODS
    1.
    发明专利
    MICROELECTRONIC ADAPTORS, ASSEMBLIES AND METHODS 未知

    公开(公告)号：AU2003265340A1

    公开(公告)日：2004-02-23

    申请号：AU2003265340

    申请日：2003-07-31

    Applicant: TESSERA INC

    Inventor： DAMBERG PHILIP

    IPC: H01L23/538 ,  H01L25/065 ,  H05K1/14 ,  H05K1/18 ,  H05K3/32 ,  H05K3/36 ,  H01L23/02

    Abstract: A first microelectronic element such as a semiconductor chip is mounted to a circuit board using an adaptor which has a region extending beneath the first microelectronic element and an additional region which may be folded over the first microelectronic element or which may project laterally from the first microelectronic element. The adaptor includes a functional element in the additional region, such as a further microelectronic element or an array of terminals for mounting another element. The assembly provides the benefits of a stacked chip assembly or other mustachio module, but can be made without the need for a special prepackaged stacked chip assembly. The adaptor can be configured so that it does not materially increase the height of the first microelectronic element above the circuit board.

    MICRO PIN GRID ARRAY WITH PIN MOTION ISOLATION
    6.
    发明申请
    MICRO PIN GRID ARRAY WITH PIN MOTION ISOLATION 审中-公开
    带PIN码隔离的微型鼠标阵列

    公开(公告)号：WO2005065238A3

    公开(公告)日：2009-03-26

    申请号：PCT/US2004043049

    申请日：2004-12-21

    Applicant: TESSERA INC ,  DAMBERG PHILIP ,  HABA BELGACEM ,  TUCKERMAN DAVID B ,  KANG TECK-GYU

    Inventor： DAMBERG PHILIP ,  HABA BELGACEM ,  TUCKERMAN DAVID B ,  KANG TECK-GYU

    IPC: H01L23/48 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/498 ,  H01L23/52 ,  H01L29/40 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34

    CPC classification number: H01L23/4985 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/118 ,  H05K3/326 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/10674 ,  H01L2924/00

    Abstract: A microelectronic package (20) includes a microelectronic element (22) having faces and contacts (26), a flexible substrate (30) overlying and spaced from a first face (24) of the microelectronic element (22), and a plurality of conductive terminals (42) exposed at a surface of the flexible substrate. The conductive terminals (42) are electrically interconnected with the microelectronic element (22) and the flexible substrate (30) includes a gap (50) extending at least partially around at least one of the conductive terminals (42). In certain embodiments, the package includes a support layer, such as a compliant layer (48), disposed between the first face (24) of the microelectronic element (22) and the flexible substrate (30). In other embodiments, the support layer includes at least one opening that is at least partially aligned with one of the conductive terminals.

    Abstract translation: 微电子封装（20）包括具有面和触点（26）的微电子元件（22），覆盖并与微电子元件（22）的第一面（24）隔开的柔性衬底（30），以及多个导电 端子（42）暴露在柔性基板的表面。 导电端子（42）与微电子元件（22）电互连，并且柔性基板（30）包括至少部分地围绕至少一个导电端子（42）延伸的间隙（50）。 在某些实施例中，封装包括设置在微电子元件（22）的第一面（24）和柔性基板（30）之间的支撑层，例如顺应层（48）。 在其他实施例中，支撑层包括至少一个与导电端子之一至少部分对准的开口。

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