公开(公告)号：EP0997944A3

公开(公告)日：2000-05-10

申请号：EP99111996.7

申请日：1995-05-12

Applicant: Texas Instruments Incorporated

Inventor： Russell, Ernest ,  Wallace, James S. ,  Baudouin, Daniel

IPC: H01L25/10 ,  H05K3/30

CPC classification number: H05K1/181 ,  H01L23/32 ,  H01L23/49555 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1082 ,  H01L2924/0002 ,  H05K3/303 ,  H05K2201/10454 ,  H05K2201/10545 ,  H05K2201/10568 ,  H05K2201/10659 ,  H05K2201/10696 ,  H05K2203/167 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00

Abstract: Two flat packages (110,111) are arranged to achieve a mirrored footprint when mounted or opposite sides of a printed circuit board by employing guides (100), which are positioned within a mounting aperture the printed circuit board. The flat packages include leads (120,121) which end from the edge of the flat package. A semiconductor chip is encapsulated by the flat packages.

公开(公告)号：EP0682366A3

公开(公告)日：1996-03-06

申请号：EP95107226.3

申请日：1995-05-12

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Russell, Ernest ,  Wallace, James S. ,  Baudouin, Daniel

IPC: H01L23/32 ,  H01L23/48 ,  H05K1/18 ,  H01L25/10 ,  H01L23/495 ,  H05K3/30

CPC classification number: H05K1/181 ,  H01L23/32 ,  H01L23/49555 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1082 ,  H01L2924/0002 ,  H05K3/303 ,  H05K2201/10454 ,  H05K2201/10545 ,  H05K2201/10568 ,  H05K2201/10659 ,  H05K2201/10696 ,  H05K2203/167 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00

Abstract: Two flat packages (110, 111) are arranged to achieve a mirrored footprint by employing guides (100), which are positioned within a mounting aperture a printed circuit board. The flat packages include leads (120,121) which extend from the edge of the flat package. A semiconductor chip is encapsulated by the flat packages.

公开(公告)号：EP0997944A2

公开(公告)日：2000-05-03

申请号：EP99111996.7

申请日：1995-05-12

Applicant: Texas Instruments Incorporated

Inventor： Russell, Ernest ,  Wallace, James S. ,  Baudouin, Daniel

IPC: H01L25/10 ,  H05K3/30

CPC classification number: H05K1/181 ,  H01L23/32 ,  H01L23/49555 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1082 ,  H01L2924/0002 ,  H05K3/303 ,  H05K2201/10454 ,  H05K2201/10545 ,  H05K2201/10568 ,  H05K2201/10659 ,  H05K2201/10696 ,  H05K2203/167 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00

Abstract: Two flat packages (110, 111) are arranged to achieve a mirrored footprint by employing guides (100), which are positioned within a mounting aperture a printed circuit board. The flat packages include leads (120,121) which extend from the edge of the flat package. A semiconductor chip is encapsulated by the flat packages.

Abstract translation: 两个扁平封装（110,111）被布置成通过采用定位在印刷电路板的安装孔内的引导件（100）来实现镜像覆盖区。 扁平封装包括从扁平封装的边缘延伸的引线（120,121）。 半导体芯片被扁平封装封装。

公开(公告)号：EP0997944B1

公开(公告)日：2003-10-29

申请号：EP99111996.7

申请日：1995-05-12

Applicant: Texas Instruments Incorporated

Inventor： Russell, Ernest ,  Wallace, James S. ,  Baudouin, Daniel

IPC: H01L25/10 ,  H05K3/30

CPC classification number: H05K1/181 ,  H01L23/32 ,  H01L23/49555 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1082 ,  H01L2924/0002 ,  H05K3/303 ,  H05K2201/10454 ,  H05K2201/10545 ,  H05K2201/10568 ,  H05K2201/10659 ,  H05K2201/10696 ,  H05K2203/167 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00

公开(公告)号：EP0682366A2

公开(公告)日：1995-11-15

申请号：EP95107226.3

申请日：1995-05-12

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Russell, Ernest ,  Wallace, James S. ,  Baudouin, Daniel

IPC: H01L23/32 ,  H01L23/48 ,  H05K1/18 ,  H01L25/10 ,  H01L23/495 ,  H05K3/30

CPC classification number: H05K1/181 ,  H01L23/32 ,  H01L23/49555 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1082 ,  H01L2924/0002 ,  H05K3/303 ,  H05K2201/10454 ,  H05K2201/10545 ,  H05K2201/10568 ,  H05K2201/10659 ,  H05K2201/10696 ,  H05K2203/167 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00

Abstract: Two flat packages (110, 111) are arranged to achieve a mirrored footprint by employing guides (100), which are positioned within a mounting aperture a printed circuit board. The flat packages include leads (120,121) which extend from the edge of the flat package. A semiconductor chip is encapsulated by the flat packages.

Abstract translation: 布置两个扁平封装（110,111）以通过使用位于印刷电路板的安装孔内的引导件（100）来实现镜像覆盖。 扁平封装包括从扁平封装的边缘延伸的引线（120,121）。 半导体芯片由扁平封装封装。