PASTE OF POLYIMIDE PRECURSOR CONTAINING INORGANIC POWDER

    公开(公告)号:JP2002121381A

    公开(公告)日:2002-04-23

    申请号:JP2000310438

    申请日:2000-10-11

    Abstract: PROBLEM TO BE SOLVED: To solve problems such as viscosity increase and gellation of a paste containing an inorganic powder and a polyimide precursor. SOLUTION: In a paste containing an inorganic powder and a polyimide precursor, the concentration of a carboxylic acid in a polyimide precursor is less than 3.8 mmol/g, and the difference between the ionization potential of a diamine and the electronic affinity of a carboxylic anhydride, both constituting the polyimide precursor, is at least 5.4 eV but less than 5.8 eV.

    PHOTOSENSITIVE ELECTRICALLY CONDUCTIVE PASTE AND FINE ELECTRODE PATTERN FORMING METHOD

    公开(公告)号:JP2000199954A

    公开(公告)日:2000-07-18

    申请号:JP116599

    申请日:1999-01-06

    Abstract: PROBLEM TO BE SOLVED: To obtain a photosensitive electrically conductive paste which does not turn into an overhang shape in pattern formation in a thick film, does not cause the contact of adjacent patterns and can be used appropriately for a ceramic multilayered substrate and electronic components which require high resolution for forming fine electrodes. SOLUTION: This photosensitive electrically conductive paste contains an electrically conductive powder, at least an alkali-soluble polymer as a photosensitive organic component, a polyfunctional monomer having a carbon-carbon double bond in one molecule and a photopolymerization initiator as essential components. The weight proportion of the polymer to the total weight of the polymer and the monomer is 70-85%.

    PHOTOSENSITIVE CERAMIC COMPOSITION
    4.
    发明专利

    公开(公告)号:JP2003195485A

    公开(公告)日:2003-07-09

    申请号:JP2001394076

    申请日:2001-12-26

    Abstract: PROBLEM TO BE SOLVED: To provide a green sheet having high transmittance and to provide a photosensitive ceramic composition corresponding thereto. SOLUTION: The photosensitive ceramic composition comprises a photosensitive organic component containing a benzotriazole compound (component A) expressed by general formula (1) and inorganic powder. In formula (1), each of R 1 to R 4 and X 1 to X 4 represents a monovalent substituent and may be different from others or at least two of them may be same, and the substituents may form a ring. COPYRIGHT: (C)2003,JPO

    GLASS PASTE
    5.
    发明专利

    公开(公告)号:JP2001294445A

    公开(公告)日:2001-10-23

    申请号:JP2000111641

    申请日:2000-04-13

    Abstract: PROBLEM TO BE SOLVED: To solve such a problem which is caused when electronic parts are manufactured by the thick film printing method, that magnetic body powder and dielectric powder can not be sintered when the sintering is carried out at 1,000 deg.C or lower temperature since a silver electrode low in resistance is used and magnetic permeability and dielectric constant are deteriorated when a large amount of glass is incorporated as a sintering auxiliary agent. SOLUTION: This glass paste contains a binder resin and inorganic powder which contains at least one kind of powder selected from magnetic body powder and dielectric powder and glass powder having 400 deg.C or higher to lower than 520 deg.C softening point.

    PLASMA DISPLAY PANEL
    6.
    发明专利

    公开(公告)号:JP2001084912A

    公开(公告)日:2001-03-30

    申请号:JP26079699

    申请日:1999-09-14

    Abstract: PROBLEM TO BE SOLVED: To form a flat electrode without generating bulges or distortions on a metallic electrode, even if both electrodes are simultaneously burnt after a black electrode for improving display contrast and a metallic electrode for high electrical conductivity are laminated. SOLUTION: In a forming method for a front surface plate electrode of a plasma display panel, in which a black electrode 9 for reducing external light reflection is arranged between a substrate 2 and a metallic electrode 1, thermal decomposition temperature of photosensitive resin contained in black electrode forming paste 7 is set to not less than the thermal decomposition temperature of photosensitive resin contained in a metal electrode forming paste 6.

    PHOTOSENSITIVE CERAMIC COMPOSITION
    7.
    发明专利

    公开(公告)号:JP2003114527A

    公开(公告)日:2003-04-18

    申请号:JP2002223255

    申请日:2002-07-31

    Abstract: PROBLEM TO BE SOLVED: To provide a photosensitive ceramic composition capable giving a photo-cured sheet having an appropriate elastic modulus because it is necessary to ensure proper conditions after via hole formation in working of a subsequent step as well as to form high definition via holes having a high aspect ratio by photolithography so as to obtain satisfactory characteristics in a high-fre quency region. SOLUTION: The photosensitive ceramic composition comprises inorganic powders and photosensitive organic components essentially including a urethane compound containing an ethylenically unsaturated group and has 0.4-5 N/mm tensile strength.

    FORMATION OF CONDUCTOR PATTERN
    9.
    发明专利

    公开(公告)号:JP2000332379A

    公开(公告)日:2000-11-30

    申请号:JP13954699

    申请日:1999-05-20

    Abstract: PROBLEM TO BE SOLVED: To improve use efficiency of paste since paste applied to a part excepting a conductor pattern is removed by developer in a conductor pattern formation method by photosensitive conductor paste. SOLUTION: In a conductor pattern formation method wherein photosensitive conductor paste is used, after a pattern which is larger than a desired pattern is formed by partially applying photosensitive conductor paste on a substrate wherein a pattern is formed, exposure and development are carried out by using a photomask of a desired pattern and a desired pattern is formed.

    CONDUCTOR PASTE
    10.
    发明专利

    公开(公告)号:JP2000331535A

    公开(公告)日:2000-11-30

    申请号:JP13954599

    申请日:1999-05-20

    Abstract: PROBLEM TO BE SOLVED: To obtain high electric conductivity after baking without using flake or fine powder by containing metal powder and binder resin as an essential component, and a metal-containing organic compound insoluble to the binder resin component. SOLUTION: A metal-containing organic compound insoluble to binder resin is dispersed in paste, at least part of metal powder is covered with the metal- containing organic compound insoluble to the binder resin, and as the metal contained in the metal-containing organic compound, at least part of it is the same kind of metal as the metal powder contained in conductor paste, at least part of the metal-containing organic compound is an organic acid metal salt, at least part of the metal powder is silver powder, and as the binder resin, photosensitive resin is preferably contained. As the photosensitive resin, at least an alkali soluble polymer, a multifunctional monomer, and an optical initiator are preferably contained.

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