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    DEVICE AND METHOD FOR DETECTING DEFECT OF YARN
    1.
    发明专利
    DEVICE AND METHOD FOR DETECTING DEFECT OF YARN 失效

    公开(公告)号：JPH11316196A

    公开(公告)日：1999-11-16

    申请号：JP12325898

    申请日：1998-05-06

    Applicant: TORAY INDUSTRIES

    Inventor： TANAKA HIDEHARU ,  HIRATA HAJIME ,  TORIKAI JUN

    IPC: G01N21/89 ,  D06H3/08 ,  G01N21/892 ,  G01N21/952

    Abstract: PROBLEM TO BE SOLVED: To provide a device and method for detecting defect of yarn, which can automatically detect the defect of the yarn by using the degree of dyeing power even in the case of modified cross-section yarn. SOLUTION: A dyed yarn Y is given false twist while travelling, light L including visible light and infrared ray is irradiated from a light irradiation means 5 to the travelling yarn Y which is given false twist a light receiving means 4 receives the visible light component and the infrared ray component contained in transmitted diffusion light which is transmitted through the travelling line of thread and diffused, and the defect of the line of thread is detected by measuring the degree of dyeing power.

    ELECTRONIC ELEMENT PACKAGE AND ITS PRODUCTION
    2.
    发明专利
    ELECTRONIC ELEMENT PACKAGE AND ITS PRODUCTION 失效

    公开(公告)号：JPH0845976A

    公开(公告)日：1996-02-16

    申请号：JP12001195

    申请日：1995-05-18

    Applicant: TORAY INDUSTRIES

    Inventor： TANAKA HIDEHARU ,  TAGUCHI KAZUHIRO ,  MAEDA YOSHIICHI

    IPC: B29C45/02 ,  B29C45/14 ,  H01L21/56 ,  H01L21/60 ,  H01L23/28 ,  H01L23/50

    Abstract: PURPOSE:To restrain an electronic element from inclining in a package or being exposed to the outside of the package by interposing a spacer between a lead wire and the outer edge of a protective member extending in parallel with the surface of the electronic element. CONSTITUTION:An electronic element 7 bonded with a film carrier is set in a molding die formed between upper and lower dies 8, 9 and a molding material 11 is injected through a gate 10 made in the lower die 9 before being heated. In this regard, it is urged against a surface extending in parallel with the surface of an inner lead 2 and the surface of the electronic element 7 set in the upper die 8. The gate 10 is provided on the side of the lower die 9 so that the electronic element 7 and the inner lead 2 is slightly subjected to the flow of the molding material 1 on the side of the spacer 5. This structure restrains the electronic element from inclining in the package.

    3.
    发明专利
    失效

    公开(公告)号：JPH05343478A

    公开(公告)日：1993-12-24

    申请号：JP17370992

    申请日：1992-06-09

    Applicant: TORAY INDUSTRIES

    Inventor： TAGUCHI KAZUHIRO ,  TANAKA HIDEHARU

    IPC: H01L21/56 ,  H01L21/60 ,  H01L23/10

    Abstract: PURPOSE:To obtain a molded package wherein it uses an improved TAB tape, it prevents the outflow of a molding resin in a molding operation and its working efficiency is enhanced. CONSTITUTION:A device hole 3 and an outer-lead hole 11 are made; an IC chip 4 is inserted in the device hole 3 in a film carrier 1 which uses the part between both holes as a support ring 10; the surface of the support ring 10 is coated with an adhesive; inner leads 6 are placed on it. A TAB tape in which slight gaps are left between the inner leads 6 and on which buried metals 16 having the same height as the inner leads 6 are formed is used; gaps between the leads and the buried metals 16 are filled with the adhesive on the support ring 10 by heating and pressurizing a metal mold in a transfer molding operation; the transfer molding operation is executed; a molded package is obtained.

    4.
    发明专利
    失效

    公开(公告)号：JPH05343459A

    公开(公告)日：1993-12-24

    申请号：JP17371092

    申请日：1992-06-09

    Applicant: TORAY INDUSTRIES

    Inventor： TOMIYAMA YASUNAO ,  TANAKA HIDEHARU

    IPC: H01L21/56 ,  H01L21/60

    Abstract: PURPOSE:To prevent that the outer surface of an IC chip comes into contact with an inner lead and to manufacture the chip whose thickness is thin after a molding operation has been completed by a method wherein the surface near the bonding point of the IC chip to the inner lead is covered with a covering resin. CONSTITUTION:The surface near the bonding point of an IC chip 4 to an inner lead 6 is covered with a covering resin 9; the inner lead 6 is bent in the direction of the IC chip 4; in a state that the inner lead is situated within the thickness range of the IC chip 4, a transfer molding operation is executed. For example, an IC chip 4 is bonded to an inner lead 6 by a method which is the same as that in conventional cases. Then, the surface from the bonding part of the IC chip 4 to the inner lead 6 up to a chip terminal is coated with a resin 9; the resin is hardened. Then, the inner lead 6 which has been bent to the upper side is pressed to the lower side; the inner lead 6 is bent in such a way that it is put within the range of the upper and lower width of the IC chip 4. In this state, a TAB tape to which the IC, chip has been bonded is transfer-molded.

    OXYGEN SENSOR USING SOLID ELECTROLYTIC MATERIAL
    6.
    发明专利
    OXYGEN SENSOR USING SOLID ELECTROLYTIC MATERIAL 失效

    公开(公告)号：JPS5566751A

    公开(公告)日：1980-05-20

    申请号：JP13996578

    申请日：1978-11-14

    Applicant: TORAY INDUSTRIES

    Inventor： TANAKA HIDEHARU ,  NAGATO TAIJI ,  NAKAYAMA TAKAO

    IPC: G01N27/409

    Abstract: PURPOSE:To preserve for a long time the initial performance of oxygen sensor making use of oxygen concentration cell of solid electrolytic material, by maintaining the electric current which flows in the external circuit during measuring due to an electromotive force under a predetermined level. CONSTITUTION:A cylindrical solid electrolytic tube 6 having a U-shaped cross- section and closed at its one end is charged with a reference gas 9 the oxygen concentration of which is known. The other end of the tube 6 is closed by a tabular sealing member 4 to form a closed container. The object gas is made to contact the outer surface of the container 8 so that an electromotive force is generated between porous electrodes 1, 2 disposed inside and outside the solid electrolytic tube 6. The electromotive force is detected by an external circuit 7 through lead wires 5, 3. The value of the electric current flowing in the external circuit 7 is limited to be smaller than 1nA per 1cm of the reference gas. The inside volume of the closed container 8 preferably falls between 0.001 and 10cm .

    INSPECTING APPARATUS FOR TAB PACKAGE AND MANUFACTURE THEREOF
    8.
    发明专利
    INSPECTING APPARATUS FOR TAB PACKAGE AND MANUFACTURE THEREOF 失效

    公开(公告)号：JPH0922928A

    公开(公告)日：1997-01-21

    申请号：JP16991395

    申请日：1995-07-05

    Applicant: TORAY INDUSTRIES

    Inventor： TANAKA HIDEHARU ,  MAEDA YOSHIICHI

    IPC: G01R31/26 ,  H01L21/66

    Abstract: PROBLEM TO BE SOLVED: To provide an inspecting apparatus preventing the erroneous discrimination by preventing the photoelectric effect when an electronic element is electrically inspected while emitting an illumination light to an electronic element bonded TAB tape. SOLUTION: A prober 7 and the test pad 6 of an electronic element connected TAB tape 1 are aligned while emitting an alignment illumination light cut at the light having a longer wavelength than the wavelength corresponding to the energy gap of a substance for forming an IC chip 5 and monitor illumination light by optical fibers 16, 17, and the chip 5 is electrically inspected.

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