公开(公告)号：US20060113680A1

公开(公告)日：2006-06-01

申请号：US11327260

申请日：2006-01-06

Applicant: Thomas DiStefano

Inventor： Thomas DiStefano

IPC: H01L23/48 ,  H01L23/28

CPC classification number: H01L24/81 ,  H01L21/561 ,  H01L21/563 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/49805 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/742 ,  H01L24/94 ,  H01L2224/02319 ,  H01L2224/02333 ,  H01L2224/0401 ,  H01L2224/11003 ,  H01L2224/1184 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/274 ,  H01L2224/29101 ,  H01L2224/29298 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/18301 ,  H05K3/3436 ,  H05K3/363 ,  H05K2201/0215 ,  H05K2201/0248 ,  H05K2201/09427 ,  H05K2201/10977 ,  H05K2203/0465 ,  H05K2203/074 ,  H05K2203/306 ,  Y02P70/613 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: A soldered assembly for a microelectronic element includes a microelectronic element, solder columns extending from a surface of the microelectronic element and terminals connected to distal ends of the columns. The assembly can be handled and mounted using conventional surface-mount techniques, but provides thermal fatigue resistance. The solder columns may be inclined relative to the chip surface, and may contain long, columnar inclusions preferentially oriented along the lengthwise axes of the columns.

Abstract translation: 用于微电子元件的焊接组件包括微电子元件，从微电子元件的表面延伸的焊料柱和连接到柱的远端的端子。 组件可以使用传统的表面贴装技术进行处理和安装，但提供耐热疲劳性能。 焊料柱可以相对于芯片表面倾斜，并且可以包含沿着柱的纵向轴线优先取向的长的柱状夹杂物。

公开(公告)号：US20050136703A1

公开(公告)日：2005-06-23

申请号：US10742501

申请日：2003-12-19

Applicant: Koenraad Van Schuylenbergh ,  Armin Volkel ,  Thomas DiStefano ,  Michel Rosa ,  David Fork ,  Eugene Chow ,  Meng Lean

Inventor： Koenraad Van Schuylenbergh ,  Armin Volkel ,  Thomas DiStefano ,  Michel Rosa ,  David Fork ,  Eugene Chow ,  Meng Lean

IPC: H05K1/14 ,  H01B11/00 ,  H01R12/00 ,  H01R12/04 ,  H05K3/32 ,  H05K3/36

CPC classification number: H01R12/78 ,  H05K1/147 ,  H05K3/323 ,  H05K3/361 ,  H05K3/365 ,  H05K2201/044 ,  H05K2201/09845

Abstract: A data transmission interconnect assembly (e.g., a router) capable of transmission speeds in excess of 40 Gbps in which a line-card is detachably coupled to a backplane using flexible flat cables that are bent to provide a continuous, smooth curve between the connected boards, and connected by a connection apparatus that employs cable-to-cable interface members that are transparent to the transmitted signal waves. Microspring contact structures are formed on the cables, or on a contact structure pressed against the cables, to provide interface arrangements that are smaller than a wavelength of the transmitted signal. A connector apparatus uses a cam mechanism to align the cables, and then to press a contact structure, having micro spring interface members formed thereon, against the cables. An alterative contact structure uses anisotropic conductive film.

公开(公告)号：US20060130319A1

公开(公告)日：2006-06-22

申请号：US11039949

申请日：2005-01-24

Applicant: Thomas DiStefano

Inventor： Thomas DiStefano

IPC: H01H11/02 ,  H01R43/04

CPC classification number: H05K3/4092 ,  H01L23/49811 ,  H01L24/72 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H05K2201/0311 ,  Y10T29/49105 ,  Y10T29/49135 ,  Y10T29/4914 ,  Y10T29/49155 ,  Y10T29/49218

Abstract: Systems and methods are provided for fabricating compliant spring contacts for use in, for example, IC packaging and interconnection between multi-layers in stacked IC packages and electronic components. Internal stresses generated within an formed film are released to cause the film to buckle and/or bow away from a supporting terminal. A thin stressed metal film layer is selectively broken away from the substrate of the supporting terminal allowing the stressed metal film to take on a bowed and/or spring-like shaped through minute deformation based on a release of the internal stresses. The resultant thin compliant spring contact can deform a small amount as the spring contact is then pressed against a compatible mating contact surface in an overlying layer.

Abstract translation: 提供了用于制造柔性弹簧触点的系统和方法，用于例如IC封装以及堆叠IC封装和电子部件中的多层之间的互连。 在成形薄膜内产生的内部应力被释放以使薄膜从支撑端子弯曲和/或翘曲。 薄的应力金属膜层从支撑端子的基板选择性地断开，允许应力金属膜基于内部应力的释放通过微小的变形而呈现弓形和/或弹簧形状。 随着弹簧接触件被压靠在上层中的相容配合接触表面上，所得到的柔性柔顺弹性接触件可以变形少量。

公开(公告)号：US20050218495A1

公开(公告)日：2005-10-06

申请号：US11142761

申请日：2005-06-01

Applicant: Igor Khandros ,  Thomas DiStefano

Inventor： Igor Khandros ,  Thomas DiStefano

IPC: H01L21/48 ,  H01L21/60 ,  H01L21/822 ,  H01L21/98 ,  H01L23/02 ,  H01L23/053 ,  H01L23/13 ,  H01L23/31 ,  H01L23/485 ,  H01L23/498 ,  H01L23/58 ,  H01L25/16

CPC classification number: H01L21/6836 ,  H01L21/822 ,  H01L22/32 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3164 ,  H01L23/485 ,  H01L23/49805 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49861 ,  H01L24/27 ,  H01L24/48 ,  H01L24/81 ,  H01L25/16 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2224/05599 ,  H01L2224/16145 ,  H01L2224/274 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/81801 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06579 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: An integrated circuit package comprises an interposer having an opening, first and second surfaces and an outline. The interposer has first terminals and second terminals. The first terminals are electrically connected to the second terminals. A semiconductor chip adhered to the second surface of the interposer has an outline that is substantially the same as the outline of the interposer. The chip has at least one contact wire bonded to at least one of the first terminals. Encapsulant fills the opening to cover the wire bonding and the at least one contact.

Abstract translation: 集成电路封装包括具有开口，第一和第二表面以及轮廓的插入器。 插入器具有第一端子和第二端子。 第一端子电连接到第二端子。 附着到插入件的第二表面的半导体芯片具有与插入件的轮廓基本相同的轮廓。 芯片具有至少一个接合线，其至少接合至第一端子之一。 密封剂填充开口以覆盖引线接合和至少一个接触。

公开(公告)号：US20070111561A1

公开(公告)日：2007-05-17

申请号：US11565715

申请日：2006-12-01

Applicant: Alan Wang ,  Kevin Olson ,  Thomas DiStefano

Inventor： Alan Wang ,  Kevin Olson ,  Thomas DiStefano

IPC: H01R12/00

CPC classification number: H05K1/0231 ,  H01L2224/16225 ,  H05K1/056 ,  H05K3/002 ,  H05K3/0052 ,  H05K3/44 ,  H05K3/4641 ,  H05K3/4644 ,  H05K2201/0166 ,  H05K2201/0397 ,  H05K2201/0909 ,  H05K2201/0919 ,  H05K2201/09309 ,  H05K2201/09554 ,  H05K2201/10446 ,  H05K2203/135 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: Provided is a method of forming a circuit board including (a) providing a first conductive sheet; (b) selectively removing one or more portions of the first conductive sheet to form a first panel having a first circuit board that is coupled to a disposable part of the first panel by at least one tab that extends from an edge of the first circuit board to an edge of the disposable part of the first panel; (c) applying an insulating coating to the first circuit board so that at least each edge of the first circuit board is covered thereby; and (d) separating the first circuit board from the disposable part in a manner whereupon at least part of the tab remains attached to the first circuit board and includes an exposed edge of the conductive sheet of the first circuit board. Circuit boards formed by the method are also provided.

Abstract translation: 提供一种形成电路板的方法，包括：（a）提供第一导电片; （b）选择性地去除所述第一导电片的一个或多个部分以形成具有第一电路板的第一面板，所述第一电路板通过从所述第一电路板的边缘延伸的至少一个接片连接到所述第一面板的一次性部分 到所述第一面板的一次性部分的边缘; （c）向第一电路板施加绝缘涂层，使得第一电路板的至少每个边缘被覆盖; 和（d）以一种方式将第一电路板与一次性部分分离，由此至少部分突片保持附接到第一电路板并且包括第一电路板的导电片的暴露边缘。 还提供了通过该方法形成的电路板。

公开(公告)号：US20060009051A1

公开(公告)日：2006-01-12

申请号：US11226186

申请日：2005-09-13

Applicant: Koenraad Schuylenbergh ,  Armin Volkel ,  Thomas DiStefano ,  Michel Rosa ,  David Fork ,  Eugene Chow ,  Meng Lean

Inventor： Koenraad Schuylenbergh ,  Armin Volkel ,  Thomas DiStefano ,  Michel Rosa ,  David Fork ,  Eugene Chow ,  Meng Lean

IPC: H01R12/00

CPC classification number: H01R12/78 ,  H05K1/147 ,  H05K3/323 ,  H05K3/361 ,  H05K3/365 ,  H05K2201/044 ,  H05K2201/09845

Abstract: A data transmission interconnect assembly capable of transmission speeds in excess of 40 Gbps in which, for example, a line-card is detachably coupled to a backplane using flexible flat cables that are bent to provide a continuous, smooth curve between the connected boards, and connected by a connection apparatus that employs cable-to-cable interface members that are transparent to the transmitted signal waves. Microspring interface members are formed on the contact structure pressed against the cables to provide interface arrangements that are smaller than a wavelength of the transmitted signal. A connector apparatus uses a cam mechanism to align the cables, and then to press the contact structure, having the microspring interface members formed thereon, against the cables. An alterative contact structure uses anisotropic conductive film.

公开(公告)号：US20070197099A1

公开(公告)日：2007-08-23

申请号：US11670340

申请日：2007-02-01

Applicant: Thomas DiStefano

Inventor： Thomas DiStefano

IPC: H01R13/66

CPC classification number: H01R13/2407 ,  H01L2224/16225 ,  H01L2924/15312

Abstract: A socket connector for connecting a post or ball wherein the female element grips the post with resilient prongs with end tips at low insertion force but positive contact is maintained and wherein attempted withdrawal is normally inhibited by increasing force applied to the post by the female element in response to the withdrawal force. The female element comprises a tube of resilient conductive material that has been sliced or helically partitioned into opposing helical prongs so as to allow the prongs of the connector to spirally open around the post or ball-like bump and mechanically grip the post or bump as the post or bump is inserted along the longitudinal axis of the tube. The tubular element may be made by forming helical prongs in the end of a tube in helical cuts from about a mid section to one end of the tube.

Abstract translation: 一种用于连接柱或球的插座连接器，其中，母构件用低插入力的端尖用弹性插脚夹住柱，但保持正接触，并且其中通常通过增加由阴元件施加到柱上的力来阻止尝试拔出 对撤军的回应。 阴元件包括弹性导电材料管，其已被切片或螺旋地分隔成相对的螺旋插脚，以便允许连接器的插脚螺旋地围绕柱或球状凸起打开，并机械地夹持柱或凸块 柱或凸块沿着管的纵向轴线插入。 管状元件可以通过在管的端部中形成螺旋形尖头而制成，其中螺旋形尖头以大约中间部分至管的一端为螺旋形切口。

公开(公告)号：US20060049498A1

公开(公告)日：2006-03-09

申请号：US11259398

申请日：2005-10-26

Applicant: Zlata Kovac ,  Craig Mitchell ,  Thomas DiStefano ,  John Smith

Inventor： Zlata Kovac ,  Craig Mitchell ,  Thomas DiStefano ,  John Smith

IPC: H01L23/02

CPC classification number: H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/29 ,  H01L24/72 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2203/063 ,  H01L2224/81 ,  H01L2924/3512 ,  H01L2924/00

Abstract: An assembly includes a structure, a plurality of terminals and a plurality of compliant pads disposed between said terminals and said structure. The terminals are aligned with at least some of said pads, with the pads providing a standoff between the structure and the terminals. The compliant pads are preferably made of a non-conductive material such as a silicone elastomer.

Abstract translation: 组件包括设置在所述端子和所述结构之间的结构，多个端子和多个柔性焊盘。 端子与至少一些所述焊盘对准，焊盘在结构和端子之间提供间隔。 柔性衬垫优选地由诸如硅氧烷弹性体的非导电材料制成。

公开(公告)号：US20050275662A1

公开(公告)日：2005-12-15

申请号：US10868312

申请日：2004-06-15

Applicant: Thomas DiStefano

Inventor： Thomas DiStefano

IPC: G06F17/21 ,  G06F17/24 ,  G09G5/00

CPC classification number: G06F17/24 ,  G06F17/212

Abstract: A method of designing a plurality of elements to be implemented on at least one web page of a website is provided. The method includes providing a first display region on a user interface, the first display region being capable of displaying the plurality of elements; providing a second display region on the user interface, the second display region being capable of displaying the plurality of elements; and displaying a first element in the second display region. The method further includes receiving a first command to modify the first element in the second display region; modifying the first element in response to the first command; and displaying the modified first element in the first display region. The modified first element forms at least part of a first web page of the website that is displayed in the first display region, and the first display region is capable of displaying the first web page in an interactive manner.

Abstract translation: 提供了一种设计要在网站的至少一个网页上实现的多个元素的方法。 该方法包括在用户界面上提供第一显示区域，第一显示区域能够显示多个元素; 在所述用户界面上提供第二显示区域，所述第二显示区域能够显示所述多个元素; 以及在所述第二显示区域中显示第一元素。 该方法还包括接收修改第二显示区域中的第一元素的第一命令; 响应于第一命令修改第一元素; 以及在第一显示区域中显示修改的第一元素。 修改的第一元素形成在第一显示区域中显示的网站的第一网页的至少一部分，并且第一显示区域能够以交互方式显示第一网页。