Abstract:
A method for high rate assembly of nanoelements into two-dimensional void patterns on a non-conductive substrate surface utilizes an applied electric field to stabilize against forces resulting from pulling the substrate through the surface of a nanoelement suspension. The electric field contours emanating from a conductive layer in the substrate, covered by an insulating layer, are modified by a patterned photoresist layer, resulting in an increased driving force for nanoelements to migrate from a liquid suspension to voids on a patterned substrate having a non-conductive surface. The method can be used for the production of microscale and nanoscale circuits, sensors, and other electronic devices.
Abstract:
A technique for rapid large-scale assembly of monolayers and multilayers of nanoelements on a variety of different substrates is provided. The technique is based on self-assembly of nanoelements suspended at the interface between a polar solvent and a nonpolar solvent. The layer of nanoelements is collected onto a substrate at a shallow angle, forming a continuous monolayer or multilayer of nanoparticles which can be optionally patterned or can be transferred to other substrates to form components of nanoelectronics, optical devices, and sensors.
Abstract:
A method for high rate assembly of nanoelements into two-dimensional void patterns on a non-conductive substrate surface utilizes an applied electric field to stabilize against forces resulting from pulling the substrate through the surface of a nanoelement suspension. The electric field contours emanating from a conductive layer in the substrate, covered by an insulating layer, are modified by a patterned photoresist layer, resulting in an increased driving force for nanoelements to migrate from a liquid suspension to voids on a patterned substrate having a non-conductive surface. The method can be used for the production of microscale and nanoscale circuits, sensors, and other electronic devices.