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公开(公告)号:EP2020835B1
公开(公告)日:2012-07-25
申请号:EP08009013.7
申请日:2008-05-15
Applicant: Unimicron Technology Corp.
Inventor: Hsu, Shih-Ping
CPC classification number: H05K3/3473 , H01L2224/05001 , H01L2224/05022 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/05567 , H01L2224/05644 , H01L2224/05671 , H01L2224/13109 , H05K3/243 , H05K3/3452 , H05K2201/0367 , H05K2201/0989 , H05K2203/043 , H05K2203/0542 , H01L2924/00014
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2.Substrate for pre-soldering material and fabrication method thereof 有权
Title translation: 一种制造材料的基板和产生vorbelötenen封装基板为此的方法。公开(公告)号:EP1621278B1
公开(公告)日:2014-09-17
申请号:EP04018152.1
申请日:2004-07-30
Applicant: Unimicron Technology Corp.
Inventor: Hsu, Shih-Ping , Hu, Chu-Chin
CPC classification number: H01L23/49816 , B23K3/0623 , B23K2201/42 , H01L21/4853 , H01L21/563 , H01L24/28 , H01L24/81 , H01L2224/0401 , H01L2224/05568 , H01L2224/11462 , H01L2224/1147 , H01L2224/131 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81193 , H01L2224/81801 , H01L2224/83102 , H01L2224/92125 , H01L2924/00013 , H01L2924/0002 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/15787 , H01L2924/1579 , H01L2924/351 , H05K3/1216 , H05K3/28 , H05K3/3473 , H05K3/3484 , H05K2201/09881 , H05K2203/043 , H05K2203/054 , H05K2203/0723 , H01L2924/00014 , H01L2224/13099 , H01L2924/00 , H01L2224/05552
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