公开(公告)号：US20230335466A1

公开(公告)日：2023-10-19

申请号：US18337438

申请日：2023-06-20

Applicant: Unimicron Technology Corp.

Inventor： Chin-Sheng Wang ,  Ra-Min Tain ,  Chih-Kai Chan ,  Jun-Ho Chen

IPC: H01L23/48 ,  H01L23/66 ,  H05K1/18 ,  H05K3/46 ,  H05K1/02

CPC classification number: H01L23/481 ,  H01L23/66 ,  H05K1/189 ,  H05K3/4691 ,  H05K3/4697 ,  H05K1/0216 ,  H01L2223/6677 ,  H05K2201/10098 ,  H05K2201/0154 ,  H05K2201/09809

Abstract: An electronic packaging structure including a first circuit structure, a second circuit structure and at least one electronic device is provided. The bottom side of the first circuit structure has at least one cavity. The first circuit structure is disposed on the second circuit structure. The first circuit structure and the second circuit structure are electrically connected to each other. The electronic device is disposed on the second circuit structure. The electronic device is disposed corresponding to the cavity of the first circuit structure.

公开(公告)号：US20230268257A1

公开(公告)日：2023-08-24

申请号：US17902902

申请日：2022-09-05

Applicant: Unimicron Technology Corp.

Inventor： Chin-Sheng Wang ,  Ra-Min Tain ,  Wen-Yu Lin ,  Tse-Wei Wang ,  Jun-Ho Chen ,  Guang-Hwa Ma

IPC: H01L23/498 ,  H01L23/66 ,  H01Q1/38 ,  H01L21/48

CPC classification number: H01L23/49811 ,  H01L23/66 ,  H01Q1/38 ,  H01L23/49822 ,  H01L23/49833 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L24/16

Abstract: An electronic package structure and its manufacturing method are provided. The electronic package structure includes an interposer, a circuit board, a chip, and a circuit structure. The interposer includes an interposer substrate and a coaxial conductive element located in the interposer substrate. The interposer substrate includes a cavity. The coaxial conductive element includes a first conductive structure, a second conductive structure surrounding the first conductive structure, and a first insulation structure. The first insulation structure is disposed between the first and second conductive structures. The circuit board is disposed on a lower surface of the interposer substrate and electrically connected to the coaxial conductive element. The chip is disposed in the cavity and located on the circuit board, so as to be electrically connected to the circuit board. The circuit structure is disposed on an upper surface of the interposer substrate and electrically connected to the coaxial conductive element.

公开(公告)号：US20230268256A1

公开(公告)日：2023-08-24

申请号：US17890279

申请日：2022-08-18

Applicant: Unimicron Technology Corp.

Inventor： Chin-Sheng Wang ,  Ra-Min Tain ,  Wen-Yu Lin ,  Tse-Wei Wang ,  Jun-Ho Chen ,  Guang-Hwa Ma

IPC: H01L23/498 ,  H01L23/66 ,  H01L23/13 ,  H01L23/552 ,  H01L21/48 ,  H05K1/14 ,  H05K1/11

CPC classification number: H01L23/49811 ,  H01L23/66 ,  H01L23/13 ,  H01L23/49838 ,  H01L23/552 ,  H01L23/49833 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H05K1/145 ,  H05K1/113 ,  H05K1/144 ,  H01L23/49822 ,  H01L2223/6622 ,  H01L2223/6677 ,  H01L24/16

Abstract: An electronic package structure and manufacturing method thereof. The electronic package structure includes a circuit board, an interposer, a chip, a circuit structure, and a coaxial conductive element. The interposer is disposed on the circuit board. The interposer has a through groove. The chip is disposed in the through groove and located on the circuit board to electrically connect with the circuit board. The circuit structure is disposed on the interposer. The coaxial conductive element penetrates the interposer to electrically connect the circuit structure and the circuit board. The coaxial conductive element includes a first conductive structure, a second conductive structure, and a first insulating structure. The second conductive structure surrounds the first conductive structure. The first insulating structure is disposed between the first conductive structure and the second conductive structure.