Abstract:
A method of connecting elements (102-106) of a plurality of elements (102-106) to one another is described. The method comprises applying solder material (110) on a first element (102) of the plurality of elements (102-106). The solder material (110) comprises a liquidus temperature. The method comprises applying sinter material (108) on a second element (103) of the plurality of elements (102-104). The sinter material (108) comprises a sintering temperature. The method comprises assembling the first element (102) and a third element (104, 504) of the plurality of elements (102-106), assembling the second element (103) and a fourth element (106) of the plurality of elements (102-106), soldering the first element (102) and the third element (104) to one another, and sintering the second element (103) and the fourth element (106) to one another. In order to accomplish short process duration, reduced costs and an increased throughput, the sintering and the soldering are simultaneously executed.