公开(公告)号：WO2021037808A2

公开(公告)日：2021-03-04

申请号：PCT/EP2020/073651

申请日：2020-08-24

Applicant: X-CELEPRINT LIMITED ,  LEONHARD KURZ STIFTUNG & CO. KG

Inventor： COK, Ronald, S. ,  ROITHMEIER, Gabriele ,  SCHULZ, Christian ,  SCHARFENBERG, Michael

IPC: H01L23/48 ,  H01L21/60 ,  H01L23/498 ,  H01L23/538 ,  H01L21/683 ,  H01L25/16 ,  H01L25/065 ,  H01L23/13 ,  G02B6/10 ,  G02B6/42 ,  G02B6/4281 ,  H01L2224/16225 ,  H01L2224/24225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81897 ,  H01L2224/81898 ,  H01L2224/81901 ,  H01L2224/81904 ,  H01L2224/82105 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/95136 ,  H01L23/49833 ,  H01L23/4985 ,  H01L23/49866 ,  H01L23/5387 ,  H01L23/5389 ,  H01L23/562 ,  H01L23/58 ,  H01L24/16 ,  H01L24/24 ,  H01L24/72 ,  H01L24/73 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L25/0652 ,  H01L25/167 ,  H01L2924/35 ,  H05K1/0271 ,  H05K1/0274 ,  H05K1/189 ,  H05K2201/0133 ,  H05K2201/09845 ,  H05K2201/2009 ,  H05K3/301

Abstract: A variable-stiffness module comprises a rigid structure (10) having a first stiffness, an intermediate substrate (20) having a second stiffness less than the first stiffness, and a flexible substrate (30) having a third stiffness less than the second stiffness. The rigid structure (10) is disposed on the intermediate substrate (20) and the intermediate substrate (20) is disposed on the flexible substrate (30). A conductor (40) is disposed partially on the intermediate substrate (21) and partially on the flexible substrate (30) and connected to the rigid structure (10). The conductor (40) extends from the rigid structure (10) to the intermediate substrate (21) to the flexible substrate (30). In some embodiments, a variable-stiffness module comprises any combination of multiple rigid structures, multiple intermediate substrates, and multiple conductors. The conductor (40) can be an optical conductor or an electrical conductor and can be disposed over the rigid structure (10) or between the rigid structure (10) and the intermediate substrate (21).

公开(公告)号：WO2021198317A1

公开(公告)日：2021-10-07

申请号：PCT/EP2021/058389

申请日：2021-03-31

Applicant: KONINKLIJKE PHILIPS N.V. ,  NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO

Inventor： VUGTS, Marinus Arnoldus Martinus ,  BLOEMEN, Pascal Jean Henri ,  KATSIORCHIS, Aristeidis ,  JANSEN, Johannes Antonius ,  THACKRAY, Donald ,  VAN EEK, Christian Steven ,  RAO GANESH, Ramachandra ,  HARKEMA, Stephan

IPC: H05K1/18 ,  H05K3/28 ,  H05K1/02 ,  H05K1/0274 ,  H05K1/0283 ,  H05K1/186 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10977 ,  H05K2203/1311 ,  H05K2203/1327 ,  H05K3/284

Abstract: In an embodiment, a method of manufacturing (100) is described. The method comprises providing (102) a first layer defining a first inner surface (203a) and a first outer surface (203b), a second layer defining a second inner surface (205a) and a second outer surface (205b), and an electrical component (206) positioned on the first inner surface or the second inner surface. The method further comprises attaching (104) the first and second layers together to create a device (200) comprising the first and second layers, wherein the first outer surface and the second outer surface define an external surface of the device. The device further comprises a sealed portion (208) defined by liquid-tight attachment between the first and second inner surfaces. In use of the device, the sealed portion prevents liquid ingress into the device between the first and second layers towards the electrical component.