公开(公告)号：WO2021221740A1

公开(公告)日：2021-11-04

申请号：PCT/US2021/013847

申请日：2021-01-19

Applicant: RAYTHEON COMPANY

Inventor： PEVZNER, Mikhail ,  HERSEY, Donald, G. ,  BENINATI, Gregory, G. ,  TELLINGHUISEN, Thomas, J. ,  BENEDICT, James, E.

IPC: H05K3/36 ,  H05K3/40 ,  H05K1/144 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/09845 ,  H05K2201/10287 ,  H05K2201/1031 ,  H05K2201/2036 ,  H05K2203/0415 ,  H05K2203/049 ,  H05K2203/0495 ,  H05K2203/167 ,  H05K3/3436 ,  H05K3/363 ,  H05K3/365 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4046

Abstract: Methods and apparatus for an assembly having first and second circuit cards mated together with a ball stack on the first circuit card extending into a through hole in the second circuit card. A wirebond connects the first ball stack to a bond pad on the first surface of the second circuit card forming a low profile connector-less interconnect. The ball stack comprises at least two balls stacked on top of each other and bonded to each other, wherein the balls are generated from wire.

公开(公告)号：WO2021134003A1

公开(公告)日：2021-07-01

申请号：PCT/US2020/066998

申请日：2020-12-24

Applicant: LUMILEDS LLC

Inventor： HIN, Tze Yang ,  WONG, Hung Khin

IPC: H01L25/075 ,  H01L27/15 ,  H01L33/64 ,  H01L33/62 ,  H01L25/16 ,  H05K1/18 ,  F21S41/141 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/156 ,  H01L2933/0066 ,  H01L33/647 ,  H05K1/141 ,  H05K1/184 ,  H05K2201/09845 ,  H05K2201/10106 ,  H05K2201/1053

Abstract: A light-emitting diode (LED) package assembly (100) includes a substrate (102). The substrate includes a top surface, a bottom surface (122) and an opening formed through the substrate (102). The opening includes a first portion (104) adjacent the top surface and a second portion (106) adjacent the bottom surface (122) that is wider than the first portion (104) such that portions of the substrate (102) overhang the second portion (106) of the opening. Pads (124) are provided on a bottom surface of the portions of the substrate (102) that overhang the second portion (106) of the opening (102). The assembly also includes a hybridized device (210) in the opening. The hybridized device (210) includes a silicon backplane (214) that has a top surface, a bottom surface and interconnects on the top surface. The interconnects (148) are electrically coupled to the pads (124). The hybridized device also includes an LED array (212) on the top surface of the silicon backplane (214).

公开(公告)号：WO2021037808A2

公开(公告)日：2021-03-04

申请号：PCT/EP2020/073651

申请日：2020-08-24

Applicant: X-CELEPRINT LIMITED ,  LEONHARD KURZ STIFTUNG & CO. KG

Inventor： COK, Ronald, S. ,  ROITHMEIER, Gabriele ,  SCHULZ, Christian ,  SCHARFENBERG, Michael

IPC: H01L23/48 ,  H01L21/60 ,  H01L23/498 ,  H01L23/538 ,  H01L21/683 ,  H01L25/16 ,  H01L25/065 ,  H01L23/13 ,  G02B6/10 ,  G02B6/42 ,  G02B6/4281 ,  H01L2224/16225 ,  H01L2224/24225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81897 ,  H01L2224/81898 ,  H01L2224/81901 ,  H01L2224/81904 ,  H01L2224/82105 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/95136 ,  H01L23/49833 ,  H01L23/4985 ,  H01L23/49866 ,  H01L23/5387 ,  H01L23/5389 ,  H01L23/562 ,  H01L23/58 ,  H01L24/16 ,  H01L24/24 ,  H01L24/72 ,  H01L24/73 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L25/0652 ,  H01L25/167 ,  H01L2924/35 ,  H05K1/0271 ,  H05K1/0274 ,  H05K1/189 ,  H05K2201/0133 ,  H05K2201/09845 ,  H05K2201/2009 ,  H05K3/301

Abstract: A variable-stiffness module comprises a rigid structure (10) having a first stiffness, an intermediate substrate (20) having a second stiffness less than the first stiffness, and a flexible substrate (30) having a third stiffness less than the second stiffness. The rigid structure (10) is disposed on the intermediate substrate (20) and the intermediate substrate (20) is disposed on the flexible substrate (30). A conductor (40) is disposed partially on the intermediate substrate (21) and partially on the flexible substrate (30) and connected to the rigid structure (10). The conductor (40) extends from the rigid structure (10) to the intermediate substrate (21) to the flexible substrate (30). In some embodiments, a variable-stiffness module comprises any combination of multiple rigid structures, multiple intermediate substrates, and multiple conductors. The conductor (40) can be an optical conductor or an electrical conductor and can be disposed over the rigid structure (10) or between the rigid structure (10) and the intermediate substrate (21).