公开(公告)号：WO2021221740A1

公开(公告)日：2021-11-04

申请号：PCT/US2021/013847

申请日：2021-01-19

Applicant: RAYTHEON COMPANY

Inventor： PEVZNER, Mikhail ,  HERSEY, Donald, G. ,  BENINATI, Gregory, G. ,  TELLINGHUISEN, Thomas, J. ,  BENEDICT, James, E.

IPC: H05K3/36 ,  H05K3/40 ,  H05K1/144 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/09845 ,  H05K2201/10287 ,  H05K2201/1031 ,  H05K2201/2036 ,  H05K2203/0415 ,  H05K2203/049 ,  H05K2203/0495 ,  H05K2203/167 ,  H05K3/3436 ,  H05K3/363 ,  H05K3/365 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4046

Abstract: Methods and apparatus for an assembly having first and second circuit cards mated together with a ball stack on the first circuit card extending into a through hole in the second circuit card. A wirebond connects the first ball stack to a bond pad on the first surface of the second circuit card forming a low profile connector-less interconnect. The ball stack comprises at least two balls stacked on top of each other and bonded to each other, wherein the balls are generated from wire.