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公开(公告)号:CN102668250A
公开(公告)日:2012-09-12
申请号:CN201080054185.4
申请日:2010-09-29
Applicant: 索尼化学&信息部件株式会社
CPC classification number: C09J9/02 , C08K9/02 , C09J7/10 , C09J2201/36 , C09J2203/326 , C09J2205/102 , H01L24/29 , H01L24/83 , H01L2224/29082 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29298 , H01L2224/838 , H01L2924/00011 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01067 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01R4/04 , H01R12/62 , H01R12/7076 , H05K3/323 , H05K3/361 , H05K2203/1189 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
Abstract: 高精度地同时安装大小不同的电子部件。各向异性导电膜为具有200kPa以上粘着力的第1树脂层(11)和含有导电性粒子的第2树脂层(12)的2层构造。通过在第1树脂层(11)上搭载电子部件,能共用于IC、FPC及SMD,同时能高精度地安装。