公开(公告)号：US20240426867A1

公开(公告)日：2024-12-26

申请号：US18214187

申请日：2023-06-26

Applicant: InvenSense, Inc.

Inventor： Matthew Julian Thompson ,  Roberto Martini

IPC: G01P15/125 ,  G01P21/00

Abstract: A MEMS sensor may include multiple sense electrodes located relative to respective portions of one or more proof masses of a MEMS layer of the sensor. Individual sense electrodes are capable of individual calibration within the drive and/or sense path for the sense electrode. A distance between each individual sense electrode relative to a proof mass is determined for the at-rest state of the sensor. Calibration values are determined based on these distances, and individual drive and/or sense signals associated with each sense electrode are modified to adjust for changes in distance, such as are caused by shifting, tilting, or bending of the MEMS layer or substrate.

公开(公告)号：US20240351864A1

公开(公告)日：2024-10-24

申请号：US18136556

申请日：2023-04-19

Applicant: InvenSense, Inc.

Inventor： Roberto Martini ,  Matthew Julian Thompson ,  Giacomo Gafforelli ,  Luca Coronato ,  Luigi Esposito

IPC: B81C1/00 ,  B81B3/00

CPC classification number: B81C1/00349 ,  B81B3/0018 ,  B81B2201/0235 ,  B81B2203/0109 ,  B81B2203/03 ,  B81B2203/04 ,  B81C2201/0109 ,  B81C2201/0132 ,  B81C2201/0147

Abstract: An actuator layer of a MEMS sensor is be fabricated to include multi-level features, such as additional sense electrodes, vertical bump stops, or weighted proof masses. A sacrificial layer is deposited on the actuator layer such that locations are provided for the multi-level features to extend vertically from the actuator layer. After the multi-layer features are fabricated on the actuator layer the sacrificial layer is removed. Additional processing such as patterning of the actuator layer may be performed to provide desired functionality and electrical signals to portions of the actuator layer, including to the multi-level features.

公开(公告)号：US20240425354A1

公开(公告)日：2024-12-26

申请号：US18214195

申请日：2023-06-26

Applicant: InvenSense, Inc.

Inventor： Roberto Martini ,  Luca Coronato ,  Matthew Julian Thompson

IPC: B81B3/00 ,  G01P15/08 ,  G01P21/00

Abstract: A microelectromechanical system (MEMS) accelerometer incorporates deformation sensing with a plurality of sense electrodes positioned to facilitate determining a deformation pattern (e.g., asymmetric or symmetric) of an underlying substrate layer relative to a MEMS layer. The deformation pattern of the substrate layer contributes to offset and/or sensitivity of the accelerometer, so the determination of the deformation pattern enables processing circuitry to compensate and improve offset and/or sensitivity stability. Tilt sense electrodes and/or comparison electrodes may be incorporated alongside the plurality of sense electrodes to monitor deformation of the substrate layer relative to a fixed portion of the MEMS layer.

公开(公告)号：US20240302405A1

公开(公告)日：2024-09-12

申请号：US18119492

申请日：2023-03-09

Applicant: InvenSense, Inc.

Inventor： Roberto Martini ,  Luca Coronato ,  Xian Huang

IPC: G01P15/18 ,  B81B7/02 ,  G01P15/125

CPC classification number: G01P15/18 ,  B81B7/02 ,  G01P15/125 ,  B81B2201/0235 ,  G01P2015/0848

Abstract: A dual axis accelerometer with a single proof mass measures in-plane acceleration (e.g., either along an x-axis or a y-axis), out-of-plane acceleration (e.g., normal to an x-y plane), and tilt of a fixed portion of a MEMS layer (e.g., normal to the x-y plane). In response to a tilt measurement, the dual-axis accelerometer compensates any offset (e.g., variability) of the out-of-plane accelerometer in order to maintain offset stability. In some embodiments, multiple dual axis accelerometers, perpendicularly configured, may be implemented via processing circuitry to offer three axis sensitivity capability.

公开(公告)号：US11231441B2

公开(公告)日：2022-01-25

申请号：US16842619

申请日：2020-04-07

Applicant: INVENSENSE, INC.

Inventor： Giacomo Laghi ,  Matthew Julian Thompson ,  Luca Coronato ,  Roberto Martini

IPC: G01P15/125 ,  B81B7/00 ,  G01P15/08

Abstract: Exemplary embodiment of a tilting z-axis, out-of-plane sensing MEMS accelerometers and associated structures and configurations are described. Disclosed embodiments facilitate improved offset stabilization. Non-limiting embodiments provide exemplary MEMS structures and apparatuses characterized by one or more of having a sensing MEMS structure that is symmetric about the axis orthogonal to the springs or flexible coupling axis, a spring or flexible coupling axis that is aligned to one of the symmetry axes of the electrodes pattern, a different number of reference electrodes and sense electrodes, a reference MEMS structure having at least two symmetry axes, one which is along the axis of the springs or flexible coupling, and/or a reference structure below the spring or flexible coupling axis.

公开(公告)号：US20200233011A1

公开(公告)日：2020-07-23

申请号：US16842619

申请日：2020-04-07

Applicant: INVENSENSE, INC.

Inventor： Giacomo Laghi ,  Matthew Julian Thompson ,  Luca Coronato ,  Roberto Martini

IPC: G01P15/125 ,  B81B7/00

Abstract: Exemplary embodiment of a tilting z-axis, out-of-plane sensing MEMS accelerometers and associated structures and configurations are described. Disclosed embodiments facilitate improved offset stabilization. Non-limiting embodiments provide exemplary MEMS structures and apparatuses characterized by one or more of having a sensing MEMS structure that is symmetric about the axis orthogonal to the springs or flexible coupling axis, a spring or flexible coupling axis that is aligned to one of the symmetry axes of the electrodes pattern, a different number of reference electrodes and sense electrodes, a reference MEMS structure having at least two symmetry axes, one which is along the axis of the springs or flexible coupling, and/or a reference structure below the spring or flexible coupling axis.

公开(公告)号：US10551191B2

公开(公告)日：2020-02-04

申请号：US15963257

申请日：2018-04-26

Applicant: INVENSENSE, INC.

Inventor： Giacomo Laghi ,  Luca Coronato ,  Jaakko Ruohio ,  Roberto Martini

IPC: G01C19/5712 ,  G01C19/5747

Abstract: An exemplary sensor may include a MEMS layer anchored to a cap and a substrate by anchoring portions of the MEMS layer. A suspended spring-mass system may include springs, at least one rigid mass, and at least one movable mass. The anchoring springs may be torsionally compliant about one or more axes and coupled to the rigid mass such that forces imparted by the anchoring portions are not transmitted to the movable mass.

公开(公告)号：US20180245920A1

公开(公告)日：2018-08-30

申请号：US15963257

申请日：2018-04-26

Applicant: INVENSENSE, INC.

Inventor： Giacomo Laghi ,  Luca Coronato ,  Jaakko Ruohio ,  Roberto Martini

IPC: G01C19/5712

CPC classification number: G01C19/5712 ,  G01C19/5747

Abstract: An exemplary sensor may include a MEMS layer anchored to a cap and a substrate by anchoring portions of the MEMS layer. A suspended spring-mass system may include springs, at least one rigid mass, and at least one movable mass. The anchoring springs may be torsionally compliant about one or more axes and coupled to the rigid mass such that forces imparted by the anchoring portions are not transmitted to the movable mass.