公开(公告)号：US11766696B2

公开(公告)日：2023-09-26

申请号：US16784186

申请日：2020-02-06

Applicant: BFLY Operations, Inc.

Inventor： Lingyun Miao ,  Jianwei Liu ,  Jonathan M. Rothberg

IPC: B06B1/00 ,  B06B1/02 ,  H10N30/06

CPC classification number: B06B1/0292 ,  H10N30/06 ,  B81B2201/0271 ,  B81B2203/0315 ,  B81B2203/04 ,  B81C2201/0101 ,  B81C2201/013 ,  B81C2201/0147 ,  B81C2201/0174 ,  B81C2203/0714

Abstract: A method of forming an ultrasonic transducer device includes forming a patterned metal electrode layer over a substrate, the patterned metal electrode layer comprising a lower layer and an upper layer formed on the lower layer; forming an insulation layer over the patterned metal electrode layer; and planarizing the insulation layer to the upper layer of the patterned metal electrode layer, wherein the upper layer comprises a electrically conductive material that serves as a chemical mechanical polishing (CMP) stop layer that has CMP selectivity with respect to the insulation layer and the lower layer, and wherein the upper layer has a CMP removal rate slower than that of the insulation layer.

公开(公告)号：US11708262B2

公开(公告)日：2023-07-25

申请号：US17687230

申请日：2022-03-04

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： Yi-Hsien Chang ,  Chun-Ren Cheng ,  Wei-Cheng Shen ,  Wen-Chien Chen

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0072 ,  B81B3/0013 ,  B81C1/00476 ,  B81C1/00666 ,  B81C1/00968 ,  B81C1/00984 ,  B81B2201/0257 ,  B81B2207/012 ,  B81C2201/0105 ,  B81C2201/017 ,  B81C2201/0109 ,  B81C2201/0128 ,  B81C2201/0147 ,  B81C2201/0163 ,  B81C2201/053 ,  B81C2203/0792 ,  H04R2201/003

Abstract: A method of manufacturing a semiconductor structure includes following operations. A first substrate is provided. A plate is formed over the first substrate. The plate includes a first tensile member, a second tensile member, a semiconductive member between the first tensile member and the second tensile member, and a plurality of apertures penetrating the first tensile member, the semiconductive member and the second tensile member. A membrane is formed over and separated from the plate. The membrane include a plurality of holes. A plurality of conductive plugs passing through the plate or membrane are formed. A plurality of semiconductive pads are formed over the plurality of conductive plugs. The plate is bonded to a second substrate. The second substrate includes a plurality of bond pads, and the semiconductive pads are in contact with the bond pads.

公开(公告)号：US20170022051A1

公开(公告)日：2017-01-26

申请号：US15092234

申请日：2016-04-06

Applicant: ANALOG DEVICES, INC.

Inventor： Xiaojie Xue ,  Michael J. Zylinski ,  Thomas M. Goida ,  Kathleen O. O'Donnell

IPC: B81B7/00 ,  B81C1/00 ,  H01L23/24 ,  H01L25/065

CPC classification number: B81B7/0048 ,  B81B2207/115 ,  B81C1/00365 ,  B81C2201/0147 ,  B81C2203/0136 ,  H01L23/057 ,  H01L23/562 ,  H01L25/0657 ,  H01L2225/06575

Abstract: An integrated device package is disclosed. The package can include a carrier, such as first integrated device die, and a second integrated device die stacked on the first integrated device die. The package can include a buffer layer which coats at least a portion of an exterior surface of the first integrated device die and which is disposed between the second integrated device die and the first integrated device die. The buffer layer can comprise a pattern to reduce transmission of stresses between the first integrated device die and the second integrated device die.

Abstract translation: 公开了一种集成器件封装。 封装可以包括诸如第一集成器件管芯的载体和堆叠在第一集成器件管芯上的第二集成器件管芯。 封装可以包括缓冲层，该缓冲层涂覆第一集成器件管芯的外表面的至少一部分，并且设置在第二集成器件管芯和第一集成器件管芯之间。 缓冲层可以包括用于减少第一集成器件管芯和第二集成器件裸片之间的应力传输的图案。

公开(公告)号：US20230406698A1

公开(公告)日：2023-12-21

申请号：US18333924

申请日：2023-06-13

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Altti TORKKELI ,  Jussi OKSANEN ,  Aarni HÄRKÖNEN ,  Juha LAHDENPERÄ

IPC: B81C3/00 ,  B81B7/02

CPC classification number: B81C3/001 ,  B81B7/02 ,  B81B2201/0264 ,  B81B2203/0315 ,  B81B2203/0361 ,  B81B2207/094 ,  B81C2201/0147 ,  B81C2203/031 ,  B81C2201/013 ,  B81C2201/0156 ,  B81B2203/04

Abstract: A microelectromechanical element is provided with patterned regions of wafer material and glass material. The regions of glass material include at least a first glass region and a second glass region formed of a first glass material and a second glass material, respectively. The first glass material enables anodic bonding with the wafer material. An alkali metal content of the second glass material is less than an alkali metal content of the first glass material.

公开(公告)号：US09910269B2

公开(公告)日：2018-03-06

申请号：US14361472

申请日：2012-11-28

Applicant: Innoluce B.V.

Inventor： Hendrikus Wilhelmus Leonardus Antonius Maria van Lierop ,  Matthijs Alexander Gerard Suijlen

IPC: G02B26/08 ,  G02B26/10 ,  G02B26/12 ,  B81B3/00 ,  B81C1/00

CPC classification number: G02B26/10 ,  B81B3/007 ,  B81B2201/042 ,  B81B2203/0109 ,  B81C1/00134 ,  B81C1/00666 ,  B81C2201/0147 ,  G02B26/0833 ,  G02B26/0841

Abstract: A MEMS-micro-mirror (30) is provided comprising a mirror body (50) that is rotatably arranged in a mirror frame (60) around a rotation axis (58) extending in a plane defined by the mirror body. The rotation axis extends through a first and a second mutually opposite end-portion (51, 53) of the mirror body. The mirror has a reflective first main surface (55) and opposite said first main surface a second main surface (57) provided with a first and a second pair of reinforcement beams. The pair of reinforcement beams (91a, 91b) extends from the first end-portion (51) in mutually opposite directions away from the rotation axis. The second pair of reinforcement beams (93a, 93b) extends from the second end-portion (53) in mutually opposite directions away from the rotation axis. Reinforcement beams of said first pair extend towards respective ones of said second pair.

公开(公告)号：US20240351864A1

公开(公告)日：2024-10-24

申请号：US18136556

申请日：2023-04-19

Applicant: InvenSense, Inc.

Inventor： Roberto Martini ,  Matthew Julian Thompson ,  Giacomo Gafforelli ,  Luca Coronato ,  Luigi Esposito

IPC: B81C1/00 ,  B81B3/00

CPC classification number: B81C1/00349 ,  B81B3/0018 ,  B81B2201/0235 ,  B81B2203/0109 ,  B81B2203/03 ,  B81B2203/04 ,  B81C2201/0109 ,  B81C2201/0132 ,  B81C2201/0147

Abstract: An actuator layer of a MEMS sensor is be fabricated to include multi-level features, such as additional sense electrodes, vertical bump stops, or weighted proof masses. A sacrificial layer is deposited on the actuator layer such that locations are provided for the multi-level features to extend vertically from the actuator layer. After the multi-layer features are fabricated on the actuator layer the sacrificial layer is removed. Additional processing such as patterning of the actuator layer may be performed to provide desired functionality and electrical signals to portions of the actuator layer, including to the multi-level features.

公开(公告)号：US12070307B2

公开(公告)日：2024-08-27

申请号：US17132165

申请日：2020-12-23

Applicant: International Business Machines Corporation

Inventor： Neil Ebejer ,  Ute Drechsler ,  Patrick Ruch

IPC: A61B5/145 ,  A61B5/00 ,  A61B5/1473 ,  H05K3/00 ,  A61B10/00

CPC classification number: A61B5/14514 ,  A61B5/1473 ,  A61B5/685 ,  H05K3/0014 ,  A61B2010/008 ,  A61B2562/125 ,  B81C2201/0101 ,  B81C2201/0108 ,  B81C2201/013 ,  B81C2201/0147 ,  B81C2201/056

Abstract: A sensor device, such as a biosensor, may comprise a polymer substrate, which is structured so as to form sets of microneedles and respective vias. The microneedles extend, each, from a base surface of the substrate. Each of the vias extends through a thickness of the substrate, thereby forming a corresponding set of apertures on the base surface. Each of the apertures is adjacent to a respective one of the microneedles. The device further may comprise two or more electrodes, these including a sensing electrode and a reference electrode. Each electrode may comprise an electrically conductive material layer that coats a region of the substrate, so as to coat at least some of the microneedles and neighboring portions of said base surface. Related devices, apparatuses, and methods of fabrication and use of such devices may be provided.

公开(公告)号：US20140327946A1

公开(公告)日：2014-11-06

申请号：US14361472

申请日：2012-11-28

Applicant: Innoluce B.V.

Inventor： Hendrikus Wilhelmus Leonardus Antonius Maria van Lierop ,  Matthijs Alexander Gerard Suijlen

IPC: G02B26/10 ,  B81C1/00 ,  G02B26/08

CPC classification number: G02B26/10 ,  B81B3/007 ,  B81B2201/042 ,  B81B2203/0109 ,  B81C1/00134 ,  B81C1/00666 ,  B81C2201/0147 ,  G02B26/0833 ,  G02B26/0841

Abstract: A MEMS-micro-mirror (30) is provided comprising a mirror body (50) that is rotatably arranged in a mirror frame (60) around a rotation axis (58) extending in a plane defined by the mirror body. The rotation axis extends through a first and a second mutually opposite end-portion (51, 53) of the mirror body. The mirror has a reflective first main surface (55) and opposite said first main surface a second main surface (57) provided with a first and a second pair of reinforcement beams. The pair of reinforcement beams (91a, 91b) extends from the first end-portion (51) in mutually opposite directions away from the rotation axis. The second pair of reinforcement beams (93a, 93b) extends from the second end-portion (53) in mutually opposite directions away from the rotation axis. Reinforcement beams of said first pair extend towards respective ones of said second pair.

Abstract translation: 提供了一种MEMS微镜（30），其包括镜体（50），所述镜体围绕围绕由镜主体限定的平面延伸的旋转轴线（58）可旋转地布置在镜框架（60）中。 旋转轴线延伸穿过镜体的第一和第二相互相对的端部（51,53）。 反射镜具有反射的第一主表面（55）并且与第一主表面相对，第二主表面（57）设置有第一和第二对加强梁。 一对加强梁（91a，91b）从远离旋转轴线的相反方向从第一端部（51）延伸。 第二对加强梁（93a，93b）从第二端部（53）沿与旋转轴线相反的相反方向延伸。 所述第一对的加强梁朝向所述第二对中的相应的一对延伸。