公开(公告)号：US20130183469A1

公开(公告)日：2013-07-18

申请号：US13740757

申请日：2013-01-14

Applicant: Nitto Denko Corporation

Inventor： Yusaku SHIMIZU ,  Eiji TOYODA ,  Takeshi MATSUMURA

IPC: B32B1/02 ,  B32B3/30

CPC classification number: B32B1/02 ,  B32B3/30 ,  B32B27/20 ,  B32B27/26 ,  B32B27/302 ,  B32B27/38 ,  B32B2270/00 ,  B32B2457/00 ,  B81C1/00269 ,  B81C2203/0118 ,  Y10T156/1052 ,  Y10T428/1397

Abstract: A resin sheet is provided for hollow encapsulation excellent in productivity, and excellent in resin strength and heat resistance as well. The resin sheet for hollow encapsulation to be used for subjecting electronic parts mounted on an aggregate substrate to hollow encapsulation includes an epoxy resin composition containing the following components (A) to (D), in which the resin sheet for hollow encapsulation has, in one surface of a sheet main body, a plurality of cavities for storing the electronic parts to subject the parts to hollow encapsulation: (A) an epoxy resin; (B) a curing agent; (C) an inorganic filler; and (D) a curing accelerator.

Abstract translation: 树脂片材的生产率优异，树脂强度和耐热性也优异。 用于将安装在集合基板上的电子部件用于中空封装的中空封装用树脂片材包括含有以下成分（A）〜（D）的环氧树脂组合物，其中中空封装用树脂片材 片状主体的表面，多个空腔，用于存放电子部件以使部件承受中空封装：（A）环氧树脂; （B）固化剂; （C）无机填料; 和（D）固化促进剂。

公开(公告)号：US20200286641A1

公开(公告)日：2020-09-10

申请号：US16646261

申请日：2018-06-25

Applicant: NITTO DENKO CORPORATION

Inventor： Eiji TOYODA ,  Naoya SUGIMOTO ,  Ryoma YOSHIOKA

IPC: H01B1/20 ,  C08K5/053 ,  C08L101/14 ,  A61B5/0408

Abstract: The electrically conductive composition includes an electrical conductive polymer, a binder resin, and at least one of a cross-linking agent and a plasticizer.

公开(公告)号：US20190254880A1

公开(公告)日：2019-08-22

申请号：US16333441

申请日：2017-08-10

Applicant: NITTO DENKO CORPORATION

Inventor： Naoya SUGIMOTO ,  Ryoma YOSHIOKA ,  Eiji TOYODA

IPC: A61F13/02 ,  A61K9/70

Abstract: A laminate patchable a living body includes a pressure-sensitive adhesive layer for patching to the living body, a substrate layer disposed on a one-side surface in a thickness direction of the pressure-sensitive adhesive layer and supporting the pressure-sensitive adhesive layer, and a protecting layer disposed on a one-side surface in the thickness direction of the substrate layer.

公开(公告)号：US20180192948A1

公开(公告)日：2018-07-12

申请号：US15741942

申请日：2016-06-01

Applicant: NITTO DENKO CORPORATION

Inventor： Keisuke OKUMURA ,  Eiji TOYODA ,  Shotaro MASUDA

IPC: A61B5/00 ,  H05K3/20 ,  H05K1/02 ,  H05K1/18

CPC classification number: A61B5/6802 ,  H05K1/02 ,  H05K1/028 ,  H05K1/189 ,  H05K3/20 ,  H05K3/22

Abstract: A wired circuit board includes an insulating layer and a conductive pattern embedded in the insulating layer. The conductive pattern has an exposed surface exposed from one surface in a thickness direction of the insulating layer and the insulating layer has the number of times of folding endurance measured in conformity with JIS P8115 (2001) of 10 times or more.

公开(公告)号：US20140311525A1

公开(公告)日：2014-10-23

申请号：US14319416

申请日：2014-06-30

Applicant: NITTO DENKO CORPORATION

Inventor： Makoto NAMIKAWA ,  Yoshio TERADA ,  Jirou NUKAGA ,  Eiji TOYODA

IPC: A47L25/00 ,  B08B7/00

CPC classification number: A47L25/005 ,  B08B7/0028 ,  B08B13/00 ,  C11D11/0047 ,  C11D11/0058 ,  H01L21/67028 ,  Y10T156/1075 ,  Y10T428/14 ,  Y10T428/1471 ,  Y10T428/1495 ,  Y10T428/24752

Abstract: A label sheet for cleaning is formed of a label for cleaning including a cleaning layer having a 180° peeling adhesion to a silicon wafer of 0.20 N/10 mm or less after receiving an active energy and an adhesive layer provided on one of surfaces of said cleaning layer, and a separator on which the label is removably provided through the adhesive layer.

Abstract translation: 用于清洁的标签片由用于清洁的标签形成，其包括在接收到活性能之后具有0.20N / 10mm或更小的硅晶片的180°剥离粘合力的清洁层，以及设置在所述第一表面的一个表面上的粘合剂层 清洁层和分隔件，标签通过粘合剂层可拆卸地设置在其上。

公开(公告)号：US20130185934A1

公开(公告)日：2013-07-25

申请号：US13739395

申请日：2013-01-11

Applicant: NITTO DENKO CORPORATION

Inventor： Eiji TOYODA ,  Yusaku SHIMIZU ,  Takeshi MATSUMURA

IPC: H05K3/28 ,  H05K13/00

CPC classification number: H05K3/284 ,  C08G59/621 ,  C08L63/00 ,  H01L21/56 ,  H01L23/293 ,  H01L23/3121 ,  H01L2924/0002 ,  H05K13/00 ,  Y10T29/49146 ,  H01L2924/00

Abstract: A resin composition sheet for encapsulating electronic parts and a method of producing an electronic part apparatus using the sheet are provided. The method includes: loading, on a substrate, a resin composition sheet for encapsulating electronic parts including a thermosetting resin composition containing an epoxy resin, a phenol resin, an inorganic filler, and a curing accelerator, having a lowest viscosity in a specific range, and a thickness in a specific range; heating the substrate in a chamber in a decompressed state to sag an end portion of the sheet until it is in contact with a surface of the substrate; and releasing a pressure in the chamber to cause the sheet to adhere onto the substrate due to a difference between a pressure in the space between the sheet and the substrate, and the pressure in the chamber after the release, followed by thermal curing.

Abstract translation: 提供了一种用于封装电子部件的树脂组合物片材和使用该片材的电子部件装置的制造方法。 该方法包括：在基材上装载包含含有特定范围内最低粘度的环氧树脂，酚醛树脂，无机填料和固化促进剂的热固性树脂组合物的电子部件用树脂组合物片， 厚度在特定范围内; 在处于减压状态的腔室中加热衬底以使片材的端部下垂，直到其与衬底的表面接触; 并且释放室内的压力，由于片材与基板之间的间隔的压力和释放后的室内的压力之间的差异，随后进行热固化，使片材粘附到基板上。

公开(公告)号：US20130139874A1

公开(公告)日：2013-06-06

申请号：US13683673

申请日：2012-11-21

Applicant: Nitto Denko Corporation

Inventor： Hiroshi YAMAZAKI ,  Kojiro KAMEYAMA ,  Takeshi MATSUMURA ,  Eiji TOYODA

IPC: C09J9/02 ,  H01L31/0224 ,  B32B38/06

CPC classification number: C09J9/02 ,  B32B38/06 ,  B32B2307/202 ,  B32B2311/00 ,  B32B2457/12 ,  C09J7/28 ,  C09J7/29 ,  C09J2201/16 ,  C09J2201/32 ,  C09J2201/602 ,  C09J2203/322 ,  C09J2400/163 ,  H01L31/0201 ,  H01L31/0508 ,  H01L31/0512 ,  Y02E10/50 ,  Y10T156/1044 ,  Y10T428/12389 ,  Y10T428/1241 ,  Y10T428/24529 ,  Y10T428/24628

Abstract: A conductive adhesive sheet includes a conductor layer including a projecting region that projects curvedly toward at least one side in the thickness direction; a low-melting-point metal layer that is formed on at least one surface in the thickness direction of the projecting region; and an adhesive layer formed on at least one surface in the thickness direction of the low-melting-point metal layer.

Abstract translation: 导电性粘合片包括导体层，导体层包括在厚度方向上朝向至少一侧弯曲地突出的突出区域; 形成在所述突出区域的厚度方向的至少一个面上的低熔点金属层; 以及在低熔点金属层的厚度方向的至少一个面上形成的粘合剂层。

公开(公告)号：US20190247534A1

公开(公告)日：2019-08-15

申请号：US16333432

申请日：2017-08-10

Applicant: NITTO DENKO CORPORATION

Inventor： Eiji TOYODA ,  Ryoma YOSHIOKA ,  Naoya SUGIMOTO ,  Yu TACHIKAWA

IPC: A61L15/20 ,  A61K47/14 ,  A61K47/32 ,  A61L15/24 ,  A61K9/70 ,  A61L15/26 ,  C09J11/06 ,  C09J7/20

CPC classification number: A61L15/20 ,  A61K9/70 ,  A61K47/14 ,  A61K47/32 ,  A61L15/24 ,  A61L15/26 ,  C09J7/20 ,  C09J11/06 ,  C09J201/00

Abstract: A laminate patchable a living body includes a pressure-sensitive adhesive layer for patching to the living body and a substrate layer disposed on a one-side surface in a thickness direction of the pressure-sensitive adhesive layer and supporting the pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer contains a first carboxylic acid ester and the substrate layer contains a second carboxylic acid ester.

公开(公告)号：US20180199443A1

公开(公告)日：2018-07-12

申请号：US15741940

申请日：2016-06-01

Applicant: NITTO DENKO CORPORATION

Inventor： Keisuke OKUMURA ,  Eiji TOYODA ,  Shotaro MASUDA

IPC: H05K3/20 ,  H05K3/22

CPC classification number: H05K3/20 ,  H05K1/0283 ,  H05K3/108 ,  H05K3/22 ,  H05K2201/0133 ,  H05K2201/0376

Abstract: A method for producing a wired circuit board includes a step (1) of forming a seed layer on one surface in a thickness direction of a peeling layer, a step (2) of forming a conductive pattern on one surface in the thickness direction of the seed layer, a step (3) of covering the seed layer and the conductive pattern with an insulating layer, a step (4) of peeling the peeling layer from the seed layer, and a step (5) of removing the seed layer. The insulating layer has the number of times of folding endurance measured in conformity with JIS P8115 (2001) of 10 times or more.

公开(公告)号：US20140311666A1

公开(公告)日：2014-10-23

申请号：US14319411

申请日：2014-06-30

Applicant: NITTO DENKO CORPORATION

Inventor： Makoto NAMIKAWA ,  Yoshio TERADA ,  Jirou NUKAGA ,  Eiji TOYODA

IPC: B08B13/00

CPC classification number: A47L25/005 ,  B08B7/0028 ,  B08B13/00 ,  C11D11/0047 ,  C11D11/0058 ,  H01L21/67028 ,  Y10T156/1075 ,  Y10T428/14 ,  Y10T428/1471 ,  Y10T428/1495 ,  Y10T428/24752

Abstract: A label sheet for cleaning is formed of a label for cleaning including a cleaning layer having a 180° peeling adhesion to a silicon wafer of 0.20 N/10 mm or less after receiving an active energy and an adhesive layer provided on one of surfaces of said cleaning layer, and a separator on which the label is removably provided through the adhesive layer.