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公开(公告)号：US11932533B2
公开(公告)日：2024-03-19
申请号：US17128638
申请日：2020-12-21
Applicant: Infineon Technologies AG
Inventor： Marc Fueldner , Andreas Wiesbauer , Athanasios Kollias
CPC classification number: B81C1/0023 , B81B7/02 , B81C1/00158 , B81C1/00182 , B81C1/00293 , B81B2201/0257 , B81B2203/0127 , B81B2207/012 , B81B2207/03 , B81C2201/0174 , B81C2203/0792
Abstract: A triple-membrane MEMS device includes a first membrane, a second membrane and a third membrane spaced apart from one another, wherein the second membrane is between the first membrane and the third membrane, a sealed low pressure chamber between the first membrane and the third membrane, a first stator and a second stator in the sealed low pressure chamber, and a signal processing circuit configured to read-out output signals of the triple-membrane MEMS device.
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公开(公告)号：US20160148880A1
公开(公告)日：2016-05-26
申请号：US14852711
申请日：2015-09-14
Applicant: STMicroelectronics (Grenoble 2) SAS
Inventor： Romain Coffy , Julien Pruvost
IPC: H01L23/00 , H01L25/00 , H01L23/498 , H01L21/56 , H01L23/31 , H01L23/14 , H01L25/065 , H01L21/48
CPC classification number: H01L23/562 , B81B2207/098 , B81C3/001 , B81C2201/0174 , B81C2203/0771 , H01L21/4853 , H01L21/561 , H01L21/563 , H01L23/14 , H01L23/3114 , H01L23/315 , H01L23/3157 , H01L23/49811 , H01L23/49838 , H01L23/564 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2224/16225 , H01L2225/06513 , H01L2225/06555 , H01L2924/15311 , H01L2924/18161
Abstract: An electronic device includes a first and a second integrated-circuit chip that are stacked at a distance from one another, and a plurality of electrical connection pillars and at least one protective barrier interposed between the chips. The protective barrier delimits a free space between mutually opposing local regions of the chips, and an encapsulation block extends around the chip that has the smaller mounting face and over the periphery of the mounting face of the other chip. The electrical connection pillars and the protective barrier are made of at least one identical metallic material with a view to simultaneous fabrication.
Abstract translation: 电子设备包括彼此间隔地堆叠的第一和第二集成电路芯片，以及插入在芯片之间的多个电连接柱和至少一个保护屏障。 保护屏障限定了芯片的相互相对的局部区域之间的自由空间，并且封装块围绕具有较小安装面的芯片延伸，并且在另一芯片的安装面的周边上延伸。 电连接柱和保护屏障由至少一种相同的金属材料制成，以同时制造。
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公开(公告)号：US08975104B2
公开(公告)日：2015-03-10
申请号：US14185160
申请日：2014-02-20
Inventor： Mourad El-Gamal , Frederic Nabki , Paul-Vahe Cicek
CPC classification number: B81C1/00666 , B81B3/0021 , B81B7/008 , B81B2201/01 , B81B2201/0235 , B81B2201/0271 , B81B2201/03 , B81B2207/015 , B81B2207/03 , B81C1/00063 , B81C1/00246 , B81C1/00396 , B81C1/00587 , B81C2201/014 , B81C2201/0169 , B81C2201/0174 , B81C2203/0721 , B81C2203/0735
Abstract: A method of providing microelectromechanical structures (MEMS) that are compatible with silicon CMOS electronics is provided. The method providing for processes and manufacturing sequences limiting the maximum exposure of an integrated circuit upon which the MEMS is manufactured to below 350° C., and potentially to below 250° C., thereby allowing direct manufacturing of the MEMS devices onto electronics, such as Si CMOS circuits. The method further providing for the provisioning of MEMS devices with multiple non-conductive structural layers such as silicon carbide separated with small lateral gaps. Such silicon carbide structures offering enhanced material properties, increased environmental and chemical resilience while also allowing novel designs to be implemented taking advantage of the non-conductive material of the structural layer. The use of silicon carbide being beneficial within the formation of MEMS elements such as motors, gears, rotors, translation drives, etc where increased hardness reduces wear of such elements during operation.
Abstract translation: 提供了一种提供与硅CMOS电子器件兼容的微机电结构（MEMS）的方法。 该方法提供了将MEMS制造的集成电路的最大曝光限制在低于350℃并可能低于250℃的工艺和制造顺序，从而允许将MEMS器件直接制造到电子器件上，例如 作为Si CMOS电路。 该方法进一步提供具有多个非导电结构层的MEMS器件，例如用小的侧向间隙分离的碳化硅。 这种碳化硅结构提供了增强的材料性能，增加了环境和化学弹性，同时还允许利用结构层的非导电材料实现新颖的设计。 在形成MEMS元件（例如马达，齿轮，转子，平移驱动器等）中使用碳化硅是有益的，其中增加的硬度降低了操作期间这些元件的磨损。
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公开(公告)号：US11906727B2
公开(公告)日：2024-02-20
申请号：US16761294
申请日：2018-08-02
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor： Tatsuya Sugimoto , Tomofumi Suzuki , Kyosuke Kotani , Yutaka Kuramoto , Daiki Suzuki
CPC classification number: G02B26/0841 , B81C1/00555 , G02B7/1821 , G02B26/105 , H02N1/008 , B81B2201/042 , B81C2201/013 , B81C2201/0174 , B81C2201/0198
Abstract: A method for manufacturing an optical device includes: preparing a semiconductor substrate that includes a portion corresponding to a base, a movable unit, and an elastic support portion; forming a first resist layer in a region corresponding to the base on a surface of a first semiconductor layer which is opposite to an insulating layer; forming a depression in the first semiconductor layer by etching the first semiconductor layer using the first resist layer as a mask; forming a second resist layer in a region corresponding to a rib portion on a bottom surface of the depression, a side surface of the depression, and the surface of the first semiconductor layer which is opposite to the insulating layer; and forming the rib portion by etching the first semiconductor layer until reaching the insulating layer using the second resist layer as a mask.
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公开(公告)号：US11693230B2
公开(公告)日：2023-07-04
申请号：US16762174
申请日：2018-09-04
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor： Tatsuya Sugimoto , Tomofumi Suzuki , Kyosuke Kotani
CPC classification number: G02B26/0841 , B81C1/00555 , G02B7/1821 , G02B26/105 , H02N1/008 , B81B2201/042 , B81C2201/013 , B81C2201/0174 , B81C2201/0198
Abstract: In an optical device, when viewed from a first direction, first, second, third, and fourth movable comb electrodes are respectively disposed between a first support portion and a first end of a movable unit, between a second support portion and a second end of the movable unit, between a third support portion and the first end, and between a fourth support portion and the second end of the movable unit. The first and second support portions respectively include first and second rib portions formed so that the thickness of each of the first and second support portions becomes greater than the thickness of the first torsion bar. The third and fourth support portions respectively include third and fourth rib portions formed so that the thickness of each of the third and fourth support portions becomes greater than the thickness of the second torsion bar.
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Patent Agency Ranking
公开(公告)号：US09890040B2
公开(公告)日：2018-02-13
申请号：US14533947
申请日：2014-11-05
Applicant: Texas Instruments Incorporated
Inventor： YungShan Chang , Ricky A. Jackson , Jeff W. Ritchison , Neng Jiang
CPC classification number: B81C1/00523 , B81B3/0021 , B81B3/0072 , B81B7/02 , B81C1/00349 , B81C2201/0174 , G02B13/14 , G02B26/06
Abstract: An apparatus includes a lens material forming a lens. The apparatus also includes a piezoelectric capacitor over the lens material, where the piezoelectric capacitor is configured to change a shape of the lens material in response to a voltage across the piezoelectric capacitor to thereby change a focus of the lens. The apparatus further includes at least one stress compensation ring over a portion of the lens material and over at least a portion of the piezoelectric capacitor. The at least one stress compensation ring is configured to at least partially reduce bending of the lens material caused by stress on or in the lens material.
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公开(公告)号：US20240192483A1
公开(公告)日：2024-06-13
申请号：US18584740
申请日：2024-02-22
Applicant: Hamamatsu Photonics K.K.
Inventor： Tatsuya SUGIMOTO , Tomofumi SUZUKI , Kyosuke KOTANI , Yutaka KURAMOTO , Daiki SUZUKI
CPC classification number: G02B26/0841 , B81B3/0045 , B81C1/00555 , G02B7/1821 , G02B26/105 , H02N1/008 , B81B2201/042 , B81C2201/013 , B81C2201/0174 , B81C2201/0198
Abstract: An optical device includes a support portion, a movable portion; and a pair of torsion bars. An optical function portion is provided on one surface of the movable portion and a rib portion is provided on the other surface of the movable portion. The rib portion includes eight extending portions of first to eighth extending portions. When setting directions in which the first to eighth extending portions extend as first to eighth extending directions respectively, and setting an angle between the first and second extending directions as a first angle, an angle between the third and fourth extending directions as a second angle, an angle between the fifth and sixth extending directions as a third angle, and an angle between the seventh and eighth extending directions as a fourth angle, each of the first and second angle is larger than each of the third and fourth angle.
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公开(公告)号：US20240174514A1
公开(公告)日：2024-05-30
申请号：US18435500
申请日：2024-02-07
Applicant: Infineon Technologies AG
Inventor： Marc Fueldner , Andreas Wiesbauer , Athanasios Kollias
CPC classification number: B81C1/0023 , B81B7/02 , B81C1/00158 , B81C1/00182 , B81C1/00293 , B81B2201/0257 , B81B2203/0127 , B81B2207/012 , B81B2207/03 , B81C2201/0174 , B81C2203/0792
Abstract: A triple-membrane MEMS device includes a first membrane, a second membrane and a third membrane spaced apart from one another, wherein the second membrane is between the first membrane and the third membrane, a sealed low pressure chamber between the first membrane and the third membrane, a first stator and a second stator in the sealed low pressure chamber, and a signal processing circuit configured to read-out output signals of the triple-membrane MEMS device.
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公开(公告)号：US09502361B2
公开(公告)日：2016-11-22
申请号：US14852711
申请日：2015-09-14
Applicant: STMicroelectronics (Grenoble 2) SAS
Inventor： Romain Coffy , Julien Pruvost
IPC: H01L23/488 , H01L23/00 , B81C3/00 , H01L23/31 , H01L25/065 , H01L21/48 , H01L21/56 , H01L23/14 , H01L23/498 , H01L25/00
CPC classification number: H01L23/562 , B81B2207/098 , B81C3/001 , B81C2201/0174 , B81C2203/0771 , H01L21/4853 , H01L21/561 , H01L21/563 , H01L23/14 , H01L23/3114 , H01L23/315 , H01L23/3157 , H01L23/49811 , H01L23/49838 , H01L23/564 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2224/16225 , H01L2225/06513 , H01L2225/06555 , H01L2924/15311 , H01L2924/18161
Abstract: An electronic device includes a first and a second integrated-circuit chip that are stacked at a distance from one another, and a plurality of electrical connection pillars and at least one protective barrier interposed between the chips. The protective barrier delimits a free space between mutually opposing local regions of the chips, and an encapsulation block extends around the chip that has the smaller mounting face and over the periphery of the mounting face of the other chip. The electrical connection pillars and the protective barrier are made of at least one identical metallic material with a view to simultaneous fabrication.
Abstract translation: 电子设备包括彼此间隔地堆叠的第一和第二集成电路芯片，以及插入在芯片之间的多个电连接柱和至少一个保护屏障。 保护屏障限定了芯片的相互相对的局部区域之间的自由空间，并且封装块围绕具有较小安装面的芯片延伸，并且在另一芯片的安装面的周边上延伸。 电连接柱和保护屏障由至少一种相同的金属材料制成，以同时制造。
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公开(公告)号：US20160337762A1
公开(公告)日：2016-11-17
申请号：US15202368
申请日：2016-07-05
Applicant: Apple Inc.
Inventor： Janhavi S. Agashe , Jae H. Lee
CPC classification number: H04R23/008 , B81C1/00158 , B81C1/00341 , B81C2201/0174 , B81C2203/0785 , G01N21/01 , G01N21/4788 , G01N21/55 , G01N2201/0612 , H04R1/04 , H04R2201/003 , Y10T29/413
Abstract: A micro-electro-mechanical system (MEMS) optical sensor, method of detecting sound using the MEMS optical sensor and method of manufacturing. The MEMS optical sensor including a substrate having a base portion and a vertically extending support portion. The sensor further including a top plate having a compliant membrane configured to vibrate in response to acoustic waves, the top plate connected to the support portion and having a reflective surface. The sensor also includes a back plate connected to the support portion, the back plate having a grating portion positioned below the reflective surface portion and a base plate connected to the support portion at a position below the back plate. A light emitter, a light detector and circuitry operable to tilt the top plate and the back plate with respect to the base plate so as to direct the reflected laser light toward the light detector are further provided.
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