公开(公告)号：US20240090137A1

公开(公告)日：2024-03-14

申请号：US18259780

申请日：2021-12-06

Applicant: SKC CO., LTD.

Inventor： Il Hwan YOO ,  Joo Young JUNG ,  Myung Ok KYUN ,  Ji Yeon RYU ,  Seung Bae OH

IPC: H05K3/02 ,  H05K1/02

CPC classification number: H05K3/022 ,  H05K1/0284 ,  H05K2201/09054 ,  H05K2201/09972 ,  H05K2203/0405

Abstract: A surface-treated copper foil according to exemplary embodiments includes a copper foil layer and a protrusion layer formed on one surface of the copper foil layer. Pores are formed inside the protrusion layer or around a boundary between the copper foil layer and the protrusion layer. Abnormal growth of the protrusions may be prevented through the pores and thus a bonding force with the insulation layer may be improved.

公开(公告)号：US11864348B2

公开(公告)日：2024-01-02

申请号：US17875596

申请日：2022-07-28

Applicant: Gerald Ho Kim

Inventor： Gerald Ho Kim

IPC: H05K7/20 ,  H05K1/02 ,  H01L23/367 ,  H01L23/427 ,  H01L23/467 ,  H01L29/06 ,  F28F3/04 ,  H05K5/03 ,  H05K5/04 ,  H01L23/13

CPC classification number: H05K7/2029 ,  F28F3/048 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/427 ,  H01L23/4275 ,  H01L23/467 ,  H01L29/0657 ,  H05K1/0204 ,  H05K1/0206 ,  H05K1/0209 ,  H05K5/03 ,  H05K5/04 ,  H01L23/13 ,  H01L2924/0002 ,  H05K2201/066 ,  H05K2201/09054 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A thermal management unit includes a heat sink, which includes a base portion having a first side and a second side opposite the first side. The heat sink also includes a first protrusion structure and a second protrusion structure. The first protrusion structure protrudes from the first side of the base portion, and the first protrusion structure includes a plurality of fins. The second protrusion structure protrudes from the second side of the base portion, and the second protrusion structure includes a plurality of ribs.

公开(公告)号：US20180206411A1

公开(公告)日：2018-07-26

申请号：US14892563

申请日：2015-10-14

Applicant: STARLIGHT LED INC.

Inventor： Pao Chen ,  Sang Han

IPC: A01G7/04 ,  H01L25/075 ,  H01L33/50 ,  H01L33/62 ,  H01L33/64 ,  F21K9/64 ,  F21V29/70 ,  F21V19/00

CPC classification number: A01G7/045 ,  F21K9/64 ,  F21V19/0015 ,  F21V29/70 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/32 ,  H01L33/502 ,  H01L33/504 ,  H01L33/62 ,  H01L33/642 ,  H01L33/647 ,  H05B33/0803 ,  H05B33/0857 ,  H05K1/05 ,  H05K3/284 ,  H05K2201/09054 ,  H05K2201/10106 ,  Y02P60/149

Abstract: Techniques for providing plant growth lights with improved performance and cost are discussed herein. Some embodiments may provide for a light emitting diode (LED) flip chip chip-on-board (COB) module for optimizing plant growth, including: a circuit board; ultraviolet (UV) LED flip chips connected to the circuit board; a royal-blue phosphor or fluorescent layer covering a first portion of the UV LED flip chips; and a deep-red phosphor or fluorescent layer covering a second portion of the UV LED flip chips. The royal-blue phosphor or fluorescent layer absorbs UV light generated by the first portion of the UV LED flip chips and converts the UV light into broad-band light in royal-blue spectrums. The a deep-red phosphor or fluorescent layer absorbs UV light generated by the second portion of the UV LED flip chips and converts the UV light into broad-band light in deep-red spectrums.

公开(公告)号：US20180010775A1

公开(公告)日：2018-01-11

申请号：US15104299

申请日：2016-01-29

Applicant: SEJONG MATERIALS CO., LTD

Inventor： Jaedeok SUNG

IPC: F21V19/00 ,  H05K1/02 ,  H05K3/00 ,  H05K3/04

CPC classification number: F21S43/00 ,  F21S43/14 ,  F21S43/15 ,  F21S43/19 ,  F21S43/195 ,  F21V19/0015 ,  F21Y2107/50 ,  F21Y2115/10 ,  H05K1/0278 ,  H05K1/056 ,  H05K3/0044 ,  H05K3/041 ,  H05K2201/09036 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2201/10409 ,  H05K2201/10522 ,  H05K2203/0108 ,  H05K2203/1327 ,  H05K2203/302

Abstract: The present invention relates to a manufacturing method of a metal PCB assembly for a vehicle lamp and the metal PCB assembly made by the method. The manufacturing method of a metal PCB assembly for a vehicle lamp comprises a step S100 in which a material of a metal PCB 14 is prepared, a step S110 in which a circuit pattern 22 and a plurality of unit patterns 16 are formed and cut from the material of a metal PCB 14 to form a metal PCB 14, a step S120 in which a bending groove 24 is formed on a bottom surface of the metal PCB 14, a step S130 in which each of the unit patterns 16 is protruded forward around the bending groove 24 of the metal PCB 14 such that each of the unit patterns 16 is bent to be inclined from the metal PCB 14, and a step S140 in which a stepwise injection molded products 12 is coupled with the metal PCB 14 while the unit pattern 16 is protruded.

公开(公告)号：US20170208704A1

公开(公告)日：2017-07-20

申请号：US15358687

申请日：2016-11-22

Applicant: MDM Inc.

Inventor： Ku Yong KIM

IPC: H05K7/20 ,  H05K3/30 ,  H05K3/46 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K7/209 ,  H05K1/0204 ,  H05K1/0207 ,  H05K1/021 ,  H05K1/0263 ,  H05K1/181 ,  H05K3/0061 ,  H05K3/303 ,  H05K3/4608 ,  H05K2201/09054 ,  H05K2201/10166 ,  H05K2201/10242

Abstract: The present disclosure relates to a layered structure of a multi-layer PCB, and more particularly, to a structure of a high-power multi-layer PCB which can use a high current by efficiently dissipating heat generated from the inside of the multi-layered PCB and heat generated from a power semiconductor module package mounted on the PCB, and a production method thereof. The multi-layer PCB includes: a conductive plate having a plurality of heat poles protruding from at least one of a top surface and a bottom surface thereof; PCBs which are disposed on the top surface and the bottom surface of the conductive plate, and have a plurality of penetrating holes formed therethrough to allow the heat poles of the conductive plate to be inserted thereinto; and an insulation layer which is attached between the conductive plate and the PCBs in order to electrically insulate.

公开(公告)号：US20170082277A1

公开(公告)日：2017-03-23

申请号：US15246515

申请日：2016-08-24

Applicant: Prism Projection, Inc.

Inventor： Garrett Joseph Young ,  Andrew Stangeland

IPC: F21V29/51 ,  F21V19/00 ,  H05K1/18 ,  F21V29/60 ,  H05K1/02 ,  F21V29/56 ,  F21K9/62

CPC classification number: F21V29/51 ,  F21K9/00 ,  F21K9/62 ,  F21V19/0025 ,  F21V29/56 ,  F21V29/58 ,  F21V29/60 ,  F21V29/677 ,  F21V29/83 ,  F21Y2113/13 ,  F21Y2115/10 ,  H05B33/0845 ,  H05B33/0857 ,  H05B37/0227 ,  H05K1/0204 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106

Abstract: Various system embodiments comprise a substrate of high thermal conductivity, a solid state light emitting device, an electric circuit, and an electric dielectric. The device has a die and a connection point to the die with a low thermal resistance. The connection point is in contact with the substrate. The electric circuit is electrically connected to the light emitting device, and separated from the substrate by the electrical dielectric. Various system embodiments comprise at least four color sources; and a contoller configured to calculate a solution to form a target color using the color sources when the target is outside of a gamut formed by the color sources. The controller is configured to find an equivalent target color with reduced saturation.

公开(公告)号：US09307675B2

公开(公告)日：2016-04-05

申请号：US13878637

申请日：2011-10-10

Applicant: Hyun Gyu Park ,  Eun Jin Kim ,  Hae Yeon Kim ,  Jae Man Park ,  Yun Ho An ,  Hyuk Soo Lee ,  In Hee Cho

Inventor： Hyun Gyu Park ,  Eun Jin Kim ,  Hae Yeon Kim ,  Jae Man Park ,  Yun Ho An ,  Hyuk Soo Lee ,  In Hee Cho

IPC: F21V29/00 ,  H05K7/20 ,  H01L23/367 ,  H01L25/075 ,  H01L33/64 ,  H05K3/30 ,  H05K13/00 ,  G02F1/1335 ,  H05K1/02 ,  H05K3/46 ,  F21V29/70 ,  H05K1/05 ,  H05K1/11

CPC classification number: H05K7/205 ,  F21V29/70 ,  G02F1/133615 ,  H01L23/3677 ,  H01L25/0753 ,  H01L33/647 ,  H01L2224/16225 ,  H05K1/0204 ,  H05K1/056 ,  H05K1/113 ,  H05K3/30 ,  H05K3/4608 ,  H05K13/00 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2201/10969 ,  Y10T29/4913

Abstract: Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate comprising an integrated metal projection to which the plurality of heat generating devices are attached, an insulation member exposing the integrated metal projection, the insulation member comprising a plurality of insulation layers disposed on the metal plate, and first and second electrode pads disposed on the insulation member, the first and second electrode pads disposed being electrically separated from each other. The first and second electrode pads receives a voltage from circuit wires disposed on the insulation layers different from each other of the insulation member. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.

Abstract translation: 提供一种用于安装多个发热装置的辐射热电路板。 辐射热电路板包括金属板，该金属板包括集成的金属突起，多个发热装置附接到该金属突起，暴露一体金属突起的绝缘构件，绝缘构件包括设置在金属板上的多个绝缘层，以及 布置在绝缘构件上的第一和第二电极焊盘，布置的第一和第二电极焊盘彼此电分离。 第一和第二电极焊盘从设置在绝缘层彼此不同的绝缘层上的电路线接收电压。 因此，可以在发热装置之间设置辐射突起以改善热辐射。

公开(公告)号：US20150230328A1

公开(公告)日：2015-08-13

申请号：US14583227

申请日：2014-12-26

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Yasuyoshi HORIKAWA ,  Tatsuaki DENDA ,  Hiroshi SHIMIZU ,  Kazutaka KOBAYASHI

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0207 ,  H01L21/486 ,  H01L23/145 ,  H01L23/367 ,  H01L33/64 ,  H01L33/642 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H05K1/0204 ,  H05K1/0206 ,  H05K3/0061 ,  H05K2201/09054 ,  H01L2924/00

Abstract: A wiring substrate includes a heat spreader; a first insulating layer provided on the heat spreader via an adhesion layer, the first insulating layer; a plurality of through wirings formed to fill through holes provided at the first insulating layer, respectively; a thermal diffusion wiring provided on the first insulating layer so as to be connected to the through wirings, the thermal diffusion wiring being configured not to be electrically connected to a semiconductor device; an electrical connection wiring provided on the first insulating layer, the electrical connection wiring being configured to be electrically connected to the semiconductor device, wherein the heat spreader is provided with a projection portion, made of a composition same as the heat spreader, at a surface of the heat spreader on which the adhesion layer is formed, the projection portion being formed at least at an area overlapping the through wirings in a plan view.

Abstract translation: 布线基板包括散热器; 第一绝缘层，其经由粘合层设置在散热器上，第一绝缘层; 多个贯通布线，分别形成为填充设置在第一绝缘层上的通孔; 设置在所述第一绝缘层上以与所述贯通布线连接的热扩散布线，所述热扩散布线被配置为不与半导体器件电连接; 设置在所述第一绝缘层上的电连接布线，所述电连接布线被配置为电连接到所述半导体器件，其中所述散热器在表面上设置有由散热器组成相同的突起部分 在其上形成有粘合层的散热器上，突出部至少形成在俯视图中与通过布线重叠的区域。

公开(公告)号：US09022613B2

公开(公告)日：2015-05-05

申请号：US14328638

申请日：2014-07-10

Applicant: Shimane Prefectural Government ,  Shimane Electronic Imafuku Works Co., Ltd.

Inventor： Satoshi Komatsubara ,  Kenichi Fukuda ,  Shinobu Otao ,  Toru Furuta

IPC: F21V29/00 ,  H01L33/64 ,  H01L25/075 ,  H01L33/60 ,  H05K1/02 ,  H01L33/48 ,  H01L33/62 ,  F21K99/00 ,  F21Y101/02 ,  F21Y105/00

CPC classification number: H01L33/644 ,  F21K9/00 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2105/16 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/483 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/181 ,  H05K1/021 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0323 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Provided are a semiconductor light emitting module and a method of manufacturing the same, which allow achieving high luminance light emission as well as lightweight and compact features. In a semiconductor light emitting module (101), a projecting portion (202) serving as a reflecting member is formed on a metal thin plate (102) to surround a semiconductor light emitting element (104). The semiconductor light emitting element (104) is connected to a printed board (103) by using a wire (201), for example. The projecting portion (202) is formed by pressing and bending the metal thin plate (102) from a back surface, for example, to surround the element and to be higher than the semiconductor light emitting element (104).

Abstract translation: 提供了一种半导体发光模块及其制造方法，其可实现高亮度发光以及轻量且紧凑的特征。 在半导体发光模块（101）中，在金属薄板（102）上形成用作反射部件的突出部（202），以围绕半导体发光元件（104）。 半导体发光元件（104）例如通过使用导线（201）与印刷电路板（103）连接。 突出部（202）通过例如从后表面压入和弯曲金属薄板（102）而形成，以围绕元件并且高于半导体发光元件（104）。

公开(公告)号：US09018667B2

公开(公告)日：2015-04-28

申请号：US12758040

申请日：2010-04-12

Applicant: Charles W. C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

Inventor： Charles W. C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

IPC: H01L23/367 ,  H01L21/48 ,  H01L23/495 ,  H05K1/02 ,  H01L33/48 ,  H01L33/64 ,  H05K3/00 ,  H05K3/38

CPC classification number: H01L21/486 ,  H01L23/3677 ,  H01L23/49575 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K3/0061 ,  H05K3/386 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2201/10969 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and first and second adhesives. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader includes a post and a base. The post extends upwardly from the base through an opening in the first adhesive, and the base extends laterally from the post. The first adhesive extends between the base and the conductive trace and the second adhesive extends between the post and the conductive trace. The conductive trace provides signal routing between a pad and a terminal.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，导电迹线以及第一和第二粘合剂。 半导体器件电连接到导电迹线并热连接到散热器。 散热器包括一个柱子和一个底座。 柱从基部穿过第一粘合剂中的开口向上延伸，并且基部从柱横向延伸。 第一粘合剂在基部和导电迹线之间延伸，并且第二粘合剂在柱和导电迹线之间延伸。 导电迹线提供焊盘和端子之间的信号路由。