公开(公告)号：US11929540B2

公开(公告)日：2024-03-12

申请号：US17253707

申请日：2019-06-20

Applicant: BAE Systems Australia Limited

Inventor： Michel A Ross

IPC: H01P5/18 ,  H05K1/02

CPC classification number: H01P5/185 ,  H01P5/184 ,  H05K1/0237 ,  H05K2201/09263

Abstract: An electromagnetic coupler including: a substrate; and a first conductor mounted to the substrate for receiving a first electromagnetic signal, the first conductor having a first multiple arcuate edge; a second conductor mounted to the substrate, the second conductor being spaced apart from the first conductor and having a second multiple arcuate edge that is opposed to the first edge for generating in the second conductor a second electromagnetic signal that is derived from the first electromagnetic signal.

公开(公告)号：US11849540B2

公开(公告)日：2023-12-19

申请号：US17728567

申请日：2022-04-25

Applicant: THE GOVERNORS OF THE UNIVERSITY OF ALBERTA

Inventor： Hyun-Joong Chung ,  Jana Rieger ,  Thanh-Giang La ,  Shide Qiu ,  Dylan Scott

IPC: H05K1/03 ,  H05K3/12 ,  H05K1/02 ,  A61B5/296 ,  A61B5/0205 ,  A61B5/00 ,  C09D11/10 ,  H05K1/09 ,  A61B5/291 ,  A61B5/297 ,  A61B5/28 ,  A61B5/0245 ,  A61B5/08 ,  C08K3/08

CPC classification number: H05K1/0283 ,  A61B5/02055 ,  A61B5/296 ,  A61B5/6804 ,  C09D11/10 ,  H05K1/095 ,  H05K3/125 ,  A61B5/0245 ,  A61B5/0816 ,  A61B5/28 ,  A61B5/291 ,  A61B5/297 ,  A61B2562/0209 ,  A61B2562/0247 ,  A61B2562/0261 ,  A61B2562/164 ,  A61B2562/166 ,  C08K3/08 ,  C08K2003/0806 ,  H05K1/038 ,  H05K2201/0116 ,  H05K2201/0215 ,  H05K2201/0245 ,  H05K2201/0278 ,  H05K2201/09263 ,  H05K2203/1545 ,  H05K2203/1572

Abstract: The development of stretchable, mechanically and electrically robust interconnects by printing an elastic, silver-based composite ink onto stretchable fabric. Such interconnects can have conductivity of 3000-4000 S/cm and are durable under cyclic stretching. In serpentine shape, the fabric-based conductor is enhanced in electrical durability. Resistance increases only ˜5 times when cyclically stretched over a thousand times from zero to 30% strain at a rate of 4% strain per second due to the ink permeating the textile structure. The textile fibers are ‘wetted’ with composite ink to form a conductive, stretchable cladding of the silver particles. The e-textile can realize a fully printed, double-sided electronic system of sensor-textile-interconnect integration. The double-sided e-textile can be used for a surface electromyography (sEMG) system to monitor muscles activities, an electroencephalography (EEG) system to record brain waves, and the like.

公开(公告)号：US20230397324A1

公开(公告)日：2023-12-07

申请号：US18248586

申请日：2021-09-14

Applicant: SONY GROUP CORPORATION

Inventor： TAKASHI KAWAMURA

IPC: H05K1/02 ,  H05K1/16

CPC classification number: H05K1/0218 ,  H05K1/162 ,  H05K2201/09263

Abstract: Provided is an electromagnetic wave absorber capable of further expanding applicable objects while reducing a size of a unit structure, and at the same time, improving the degree of freedom in arrangement. An electromagnetic wave absorber 201 includes a substrate 202, a first wiring pattern 203 mounted on one surface of the substrate, and a second wiring pattern 204 mounted on the other surface opposite to the one surface, the first wiring pattern 203 includes a line portion 211 extending in parallel to a direction in which an external electric field is generated, a capacitor portion 212 in which a potential difference is generated by the external electric field, and a first connecting portion 213 and a second connecting portion 214 which connect each of ends of the line portion with the capacitor portion, and the second wiring pattern 204 includes a wire portion 221 which extends in the same direction as the line portion and is arranged at a position opposite to the line portion, and extension portions 222 and 223 that are branched to be bent from ends of the wire portion.

公开(公告)号：US20180348317A1

公开(公告)日：2018-12-06

申请号：US15992280

申请日：2018-05-30

Applicant: Siemens Healthcare GmbH

Inventor： Andreas FACKELMEIER

IPC: G01R33/36 ,  G01R33/341 ,  G01R33/34

CPC classification number: G01R33/3692 ,  A61B6/56 ,  B60L53/34 ,  G01R33/34007 ,  G01R33/341 ,  G01R33/3642 ,  H01F38/14 ,  H01Q1/273 ,  H01Q1/36 ,  H01Q5/40 ,  H01Q9/42 ,  H04B5/0031 ,  H04B5/0037 ,  H04B5/0081 ,  H04B5/0093 ,  H05K1/165 ,  H05K2201/09263 ,  H05K2201/10098 ,  Y02T10/7088 ,  Y02T90/122

Abstract: A coupler includes a first and second coupler element, with a respective first and second transmission element. In an embodiment, a first signal contact for connection to a signal conductor is arranged on a first end of the first transmission element; a second signal contact for connection to a signal conductor is arranged on a first end of the second transmission element; the first transmission element forms a plurality of first U-shaped curves between the first end and a second end; and the second transmission element forms a plurality of second U-shaped curves between the first end and a second end. The first transmission element is configured, in operation, to transmit a signal supplied at the first signal contact to the second transmission element via directional coupling and the second transmission element is configured, in operation, to receive and output the signal via the second signal contact.

公开(公告)号：US20180333571A1

公开(公告)日：2018-11-22

申请号：US15597187

申请日：2017-05-17

Applicant: Verily Life Sciences LLC

Inventor： Brian Pepin ,  Shiv Sabesan ,  Bo Lu

IPC: A61N1/05 ,  H01B3/30

CPC classification number: A61N1/0551 ,  A61N1/0526 ,  A61N1/0553 ,  A61N1/0556 ,  A61N1/056 ,  A61N1/3606 ,  H01B3/306 ,  H01B3/307 ,  H05K1/0283 ,  H05K2201/09263

Abstract: The present disclosure relates to implantable neuromodulation devices and methods of fabrication, and in particular to a thin-film electrode assemblies and methods of fabricating the thin-film electrode assembly to include a soft overmold. Particularly, aspects of the present invention are directed to a thin-film electrode assembly that includes an overmold and a supporting structure formed within a portion of the overmold. The overmold includes a first polymer and the supporting structure includes a second polymer, different from the first polymer. The thin-film electrode assembly also includes a wire formed within a portion of the supporting structure, and an electrode formed on a top surface of the supporting structure and in electrical contact with the wire. The electrode has a top surface that is raised above a top surface of the overmold by a predetermined distance.

公开(公告)号：US10075573B2

公开(公告)日：2018-09-11

申请号：US15509835

申请日：2014-09-29

Applicant: LG Display Co., Ltd.

Inventor： Zhen Zhang ,  Paul Stephen Drzaic ,  Seyeoul Kwon ,  Sangcheon Youn ,  Heeseok Yang ,  Chanwoo Lee ,  Soyoung Jo ,  Anna Ha ,  Dongyoon Kim ,  Saemleenuri Lee ,  Yoondong Cho

IPC: H01L23/52 ,  H04M1/02 ,  G09F9/30 ,  G06F1/16 ,  H01L51/56

CPC classification number: H04M1/0268 ,  G06F1/1652 ,  G09F9/301 ,  H01L27/3276 ,  H01L51/0097 ,  H01L51/56 ,  H01L2251/5338 ,  H05K1/028 ,  H05K1/0283 ,  H05K2201/09263 ,  H05K2201/09727 ,  H05K2201/10128

Abstract: A conductive trace design is described that minimizes the possibility of crack initiation and propagation in conductive traces during bending. The conductive trace design has a winding trace pattern that is more resistant to the formation of cracks at high stress points in the conductive traces. The conductive trace design includes a cap that helps ensure electrical connection of the conductive trace even though one or more cracks may begin to form in the conductive portion of the conductive trace.

公开(公告)号：US10064270B2

公开(公告)日：2018-08-28

申请号：US15174677

申请日：2016-06-06

Applicant: North Carolina State University

Inventor： Jesse S. Jur ,  Murat Yokus ,  Rachel Foote ,  Amanda Caton Myers ,  Raj Pravinbhai Bhakta

IPC: H05K1/02 ,  H01L23/498 ,  H05K1/18 ,  H05K1/03 ,  H05K3/36 ,  G01N33/36

CPC classification number: H05K1/0283 ,  G01N33/367 ,  H01L23/4985 ,  H01L23/49883 ,  H01L33/62 ,  H05K1/038 ,  H05K1/189 ,  H05K3/361 ,  H05K2201/0129 ,  H05K2201/09263 ,  H05K2201/10106 ,  H05K2201/10219

Abstract: Provided herein are flexible interconnects, systems containing one or more flexible interconnects, and textiles including one or more flexible interconnects.

公开(公告)号：US20180192952A1

公开(公告)日：2018-07-12

申请号：US15741081

申请日：2016-07-01

Applicant: The Board of Trustees of the University of Illinois ,  Washington University in St. Louis

Inventor： John A. ROGERS ,  Gunchul SHIN ,  Sung Il PARK ,  Robert GEREAU ,  Clinton MORGAN ,  Daniel BRENNER ,  Michael BRUCHAS ,  Jordan McCALL

IPC: A61B5/00 ,  A61B5/01 ,  A61B5/04 ,  A61B5/07 ,  A61B5/03 ,  A61F7/12 ,  A61N1/05 ,  A61N1/372 ,  A61M31/00 ,  A61N1/378 ,  A61N5/06 ,  A61N1/375

CPC classification number: A61B5/686 ,  A61B5/0031 ,  A61B5/0084 ,  A61B5/01 ,  A61B5/036 ,  A61B5/04 ,  A61B5/04001 ,  A61B5/042 ,  A61B5/076 ,  A61B5/1459 ,  A61B5/1473 ,  A61B5/407 ,  A61B5/4839 ,  A61B5/6868 ,  A61B5/6877 ,  A61B2503/40 ,  A61B2503/42 ,  A61B2560/0219 ,  A61B2562/0209 ,  A61B2562/0233 ,  A61B2562/164 ,  A61B2562/222 ,  A61F7/12 ,  A61F2007/126 ,  A61M31/002 ,  A61M2205/3515 ,  A61M2205/3523 ,  A61M2205/8243 ,  A61N1/05 ,  A61N1/0529 ,  A61N1/0553 ,  A61N1/37229 ,  A61N1/37518 ,  A61N1/3787 ,  A61N5/0601 ,  A61N5/062 ,  A61N5/0622 ,  A61N2005/0612 ,  A61N2005/0651 ,  A61N2005/0652 ,  H01Q1/273 ,  H01Q5/35 ,  H01Q9/42 ,  H02J7/025 ,  H02J50/27 ,  H02J50/80 ,  H04B5/0037 ,  H05K1/0283 ,  H05K2201/09263 ,  H05K2201/10098

Abstract: Provided are fully implantable soft medical devices and related methods. The devices comprise stretchable electronic devices between on an elastomeric substrate and an elastomeric super-state. Electronic components of the electronic device are configured to interface with tissue. Wireless power and control systems provide wireless power and control of the electronic components, thereby providing the fully implantable functionality. The devices may have a plurality of independently addressable electronic components, such as LEDs. In this manner, wireless control of a single implanted device may still provide multi-functional capabilities, including in a multiplexed configuration.

公开(公告)号：US10009995B2

公开(公告)日：2018-06-26

申请号：US14649848

申请日：2013-12-06

Applicant: Cryptera A/S

Inventor： Mathias Tannebæk Enevoldsen ,  Thomas Trabolt West ,  Erling Wesselhoff ,  Jan Rasmussen ,  Dennis Bruun Mikkelsen

IPC: H05K1/02 ,  G06F21/87 ,  G01R27/02 ,  H05K7/14 ,  G09C1/00 ,  H04L9/00 ,  H05K1/14

CPC classification number: H05K1/0275 ,  G01R27/02 ,  G06F21/87 ,  G09C1/00 ,  H04L9/004 ,  H05K1/02 ,  H05K1/0268 ,  H05K1/141 ,  H05K7/1422 ,  H05K2201/09263 ,  H05K2201/10409 ,  H05K2201/2018

Abstract: There is provided a security module for protecting circuit components from unauthorized access. The security module comprises a base printed circuit board, base PCB, for supporting circuit components to be protected, a frame printed circuit board, frame PCB, where the frame PCB is secured on top of the base PCB and defining a protective space for circuit components supported by the base PCB, and a lid printed circuit board, lid PCB, which is secured on top of the frame PCB, thereby providing a top closure to the protective space. First and third meshes are provided in the frame PCB, and a second mesh is provided in the lid PCB. The first, second and third meshes have a number of electrically conductive tracks, and one or more tamper detection paths are formed comprising a serial connection of one track from each of the first, second and third meshes. The security module may further comprise security circuitry arranged on the base PCB within the protective space, and for each tamper detection path the security circuitry has a pair of electrical signal input/outputs being electrically connected to the tamper detection path.

公开(公告)号：US09967973B2

公开(公告)日：2018-05-08

申请号：US14584291

申请日：2014-12-29

Applicant: GWANGJU INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Sohee Kim ,  Namsun Chou

IPC: H05K1/02 ,  H05K3/38

CPC classification number: H05K1/0283 ,  H05K3/38 ,  H05K2201/0133 ,  H05K2201/0162 ,  H05K2201/09263 ,  H05K2203/1105

Abstract: An electrode arrangement which is based on elastomer and has elasticity and flexibility may include: an elastomer substrate; first and second pads arranged over the substrate; and a conductive wire connecting the first and second pads. One or more regions of the conductive wire may be bent in a vertical or horizontal direction with respect to the substrate.