公开(公告)号：US20120020026A1

公开(公告)日：2012-01-26

申请号：US12842587

申请日：2010-07-23

Applicant: Vage Oganesian ,  Belgacem Haba ,  Craig Mitchell ,  Ilyas Mohammed ,  Piyush Savalia

Inventor： Vage Oganesian ,  Belgacem Haba ,  Craig Mitchell ,  Ilyas Mohammed ,  Piyush Savalia

IPC: H05K7/20 ,  H05K7/02 ,  H05K13/00

CPC classification number: H01L21/76819 ,  H01L21/76877 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/5389 ,  H01L24/18 ,  H01L24/19 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L24/97 ,  H01L25/105 ,  H01L25/117 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/24227 ,  H01L2224/24247 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/82 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01061 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15156 ,  H01L2924/15165 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/15331 ,  H01L2924/157 ,  H01L2924/15788 ,  H01L2924/18161 ,  Y10T29/49002 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/83

Abstract: A microelectronic unit includes a carrier structure having a front surface, a rear surface remote from the front surface, and a recess having an opening at the front surface and an inner surface located below the front surface of the carrier structure. The microelectronic unit can include a microelectronic element having a bottom surface adjacent the inner surface, a top surface remote from the bottom surface, and a plurality of contacts at the top surface. The microelectronic element can include terminals electrically connected with the contacts of the microelectronic element. The microelectronic unit can include a dielectric region contacting at least the top surface of the microelectronic element. The dielectric region can have a planar surface located coplanar with or above the front surface of the carrier structure. The terminals can be exposed at the surface of the dielectric region for interconnection with an external element.

Abstract translation: 微电子单元包括具有前表面，远离前表面的后表面和在前表面具有开口的凹部和位于载体结构的前表面下方的内表面的载体结构。 微电子单元可以包括具有邻近内表面的底表面，远离底表面的顶表面和在顶表面处的多个触点的微电子元件。 微电子元件可以包括与微电子元件的触点电连接的端子。 微电子单元可以包括至少与微电子元件的顶表面接触的电介质区域。 电介质区域可以具有与载体结构的前表面共面或平行的平面。 端子可以暴露在电介质区域的表面以与外部元件互连。

公开(公告)号：US20120013028A1

公开(公告)日：2012-01-19

申请号：US13246242

申请日：2011-09-27

Applicant: Ilyas Mohammed ,  Belgacem Haba

Inventor： Ilyas Mohammed ,  Belgacem Haba

IPC: H01L25/07

CPC classification number: H01L25/0657 ,  H01L21/563 ,  H01L23/3157 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L2224/05599 ,  H01L2224/06135 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/484 ,  H01L2224/49 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2224/45099 ,  H01L2924/00011

Abstract: A microelectronic assembly includes first and second microelectronic elements. Each of the microelectronic elements has oppositely-facing first and second surfaces and edges bounding the surfaces. The first microelectronic element is disposed on the second microelectronic element with the second surface of the first microelectronic element facing toward the first surface of the second microelectronic element. The first microelectronic element preferably extends beyond at least one edge of the second microelectronic element and the second microelectronic element preferably extends beyond at least one edge of the first microelectronic element. A first edge of the first microelectronic element has a length that is smaller than a first edge of the second microelectronic element. A second edge of the first microelectronic element has a length that is greater than the second edge of the second microelectronic element.

Abstract translation: 微电子组件包括第一和第二微电子元件。 每个微电子元件具有面对面的第一和第二表面和边缘。 第一微电子元件设置在第二微电子元件上，第一微电子元件的第二表面朝向第二微电子元件的第一表面。 第一微电子元件优选地延伸超过第二微电子元件的至少一个边缘，并且第二微电子元件优选地延伸超过第一微电子元件的至少一个边缘。 第一微电子元件的第一边缘具有小于第二微电子元件的第一边缘的长度。 第一微电子元件的第二边缘具有大于第二微电子元件的第二边缘的长度。

公开(公告)号：US08076788B2

公开(公告)日：2011-12-13

申请号：US12941392

申请日：2010-11-08

Applicant: Belgacem Haba ,  Ilyas Mohammed ,  Vage Oganesian ,  David Ovrutsky ,  Laura Mirkarimi

Inventor： Belgacem Haba ,  Ilyas Mohammed ,  Vage Oganesian ,  David Ovrutsky ,  Laura Mirkarimi

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L21/78 ,  H01L21/6835 ,  H01L23/5382 ,  H01L24/24 ,  H01L24/48 ,  H01L24/82 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68377 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/9202 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: A microelectronic assembly includes first and second stacked microelectronic elements, each having spaced apart traces extending along a front face and beyond at least a first edge thereof. An insulating region can contact the edges of each microelectronic element and at least portions of the traces of each microelectronic element extending beyond the respective first edges. The insulating region can define first and second side surfaces adjacent the first and second edges of the microelectronic elements. A plurality of spaced apart openings can extend along a side surface of the microelectronic assembly. Electrical conductors connected with respective traces can have portions disposed in respective openings and extending along the respective openings. The electrical conductors may extend to pads or solder balls overlying a face of one of the microelectronic elements.

Abstract translation: 微电子组件包括第一和第二堆叠的微电子元件，每个微电子元件具有沿前表面延伸并且至少其第一边缘延伸的间隔开的迹线。 绝缘区域可以接触每个微电子元件的边缘，并且每个微电子元件的迹线的至少部分延伸超过相应的第一边缘。 绝缘区域可以限定与微电子元件的第一和第二边缘相邻的第一和第二侧表面。 多个间隔开的开口可以沿着微电子组件的侧表面延伸。 与相应迹线连接的电导体可以具有设置在相应开口中并沿相应开口延伸的部分。 电导体可以延伸到覆盖在微电子元件中的一个的表面上的焊盘或焊球。

公开(公告)号：US08026611B2

公开(公告)日：2011-09-27

申请号：US11291398

申请日：2005-12-01

Applicant: Ilyas Mohammed ,  Belgacem Haba

Inventor： Ilyas Mohammed ,  Belgacem Haba

IPC: H01L23/48

CPC classification number: H01L25/0657 ,  H01L21/563 ,  H01L23/3157 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L2224/05599 ,  H01L2224/06135 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/484 ,  H01L2224/49 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2224/45099 ,  H01L2924/00011

Abstract: A microelectronic assembly including a first and second microelectronic elements. Each of the microelectronic elements have oppositely-facing first and second surfaces and edges bounding the surfaces. The first microelectronic element is disposed on the second microelectronic element with the second surface of the first microelectronic element facing toward the first surface of the second microelectronic element. The first microelectronic element preferably extends beyond at least one edge of the second microelectronic element and the second microelectronic element preferably extends beyond at least one edge of the first microelectronic element.

Abstract translation: 一种包括第一和第二微电子元件的微电子组件。 每个微电子元件具有面对面的第一和第二表面和边缘。 第一微电子元件设置在第二微电子元件上，第一微电子元件的第二表面朝向第二微电子元件的第一表面。 第一微电子元件优选地延伸超过第二微电子元件的至少一个边缘，并且第二微电子元件优选地延伸超过第一微电子元件的至少一个边缘。

公开(公告)号：US07901989B2

公开(公告)日：2011-03-08

申请号：US12143743

申请日：2008-06-20

Applicant: Belgacem Haba ,  Ilyas Mohammed ,  Vage Oganesian ,  David Ovrutsky ,  Laura Wills Mirkarimi

Inventor： Belgacem Haba ,  Ilyas Mohammed ,  Vage Oganesian ,  David Ovrutsky ,  Laura Wills Mirkarimi

IPC: H01L21/00

CPC classification number: H01L21/78 ,  H01L21/6835 ,  H01L23/5382 ,  H01L24/24 ,  H01L24/48 ,  H01L24/82 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68377 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/9202 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: A stacked microelectronic assembly is fabricated from a structure which includes a plurality of first microelectronic elements having front faces bonded to a carrier. Each first microelectronic element may have a first edge and a plurality of first traces extending along the front face towards the first edge. After exposing at least a portion of the first traces, a dielectric layer is formed over the plurality of first microelectronic elements. After thinning the dielectric layer, a plurality of second microelectronic elements are aligned and joined with the structure such that front faces of the second microelectronic elements are facing the rear faces of the plurality of first microelectronic elements. Processing is repeated to form the desirable number of layers of microelectronic elements. In one embodiment, the stacked layers of microelectronic elements may be notched at dicing lines to expose edges of traces, which may then be electrically connected to leads formed in the notches. Individual stacked microelectronic units may be separated from the stacked microelectronic assembly by any suitable dicing, sawing or breaking technique.

Abstract translation: 堆叠的微电子组件由包括多个第一微电子元件的结构制成，所述第一微电子元件具有接合到载体的前表面。 每个第一微电子元件可以具有第一边缘和沿前表面朝向第一边缘延伸的多个第一迹线。 在暴露至少一部分第一迹线之后，在多个第一微电子元件上形成介电层。 在使介电层变薄之后，多个第二微电子元件与该结构对准并接合，使得第二微电子元件的正面面对多个第一微电子元件的后表面。 重复处理以形成所需数量的微电子元件层。 在一个实施例中，微电子元件的堆叠层可以在切割线处切口以暴露迹线的边缘，其可以然后电连接到形成在凹口中的引线。 可以通过任何合适的切割，锯切或断裂技术将单个堆叠的微电子单元与堆叠的微电子组件分开。

公开(公告)号：US07605479B2

公开(公告)日：2009-10-20

申请号：US10487482

申请日：2002-08-22

Applicant: Ilyas Mohammed

Inventor： Ilyas Mohammed

IPC: H01L23/48

CPC classification number: H01L23/3128 ,  H01L21/563 ,  H01L23/16 ,  H01L23/49816 ,  H01L23/4985 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/50 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A microelectronic subassembly 210 includes a substrate 215 having a top surface 216 and at least one peripheral region 219, a microelectronic element 201 mounted over the substrate 215, a plurality of leads 218, 222 electrically connected to the microelectronic element 201 having outer ends overlying the at least one peripheral region 219 of the substrate 215, and vertical conductors 208 electrically connected with the outer ends of the leads. The subassembly includes an encapsulant layer 204 provided over the top surface 216 of the substrate 215 and around the microelectronic element 201 and the vertical conductors 208 for stiffening the substrate 215 at the at least one peripheral region 219 of the substrate for facilitating handling and testing of the subassembly.

Abstract translation: 微电子子组件210包括具有顶表面216和至少一个外围区域219的基板215，安装在基板215上的微电子元件201，与微电子元件201电连接的多个引线218,222，其外端覆盖 衬底215的至少一个外围区域219以及与引线的外端电连接的垂直导体208。 子组件包括设置在衬底215的顶表面216上并围绕微电子元件201和垂直导体208的密封剂层204，用于在衬底的至少一个周边区域219处加强衬底215，以便于处理和测试 子组件。

公开(公告)号：US20080150114A1

公开(公告)日：2008-06-26

申请号：US11645242

申请日：2006-12-21

Applicant: Ilyas Mohammed ,  Chung-Chuan Tseng

Inventor： Ilyas Mohammed ,  Chung-Chuan Tseng

IPC: H01L23/02 ,  H01L21/58

CPC classification number: H01L25/50 ,  H01L25/105 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1082 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A stacked microelectronic assembly is disclosed, as are different embodiments related to the same. The stacked microelectronic assembly includes a plurality of stackable microelectronic units each having a semiconductor element mounted on a substrate, and also includes alignment elements which align and stack the units one atop another. The aligned assembly may be heated to melt or to reflow the conductive bonding material between the units, thereby electrically coupling and bonding corresponding conductive terminals on each unit.

Abstract translation: 公开了堆叠的微电子组件，以及与其相关的不同实施例。 堆叠的微电子组件包括多个可堆叠微电子单元，每个单元具有安装在基板上的半导体元件，并且还包括对准元件，其将单元对准并堆叠在另一个上。 对准的组件可以被加热以熔化或者回流单元之间的导电接合材料，从而电耦合并结合每个单元上相应的导电端子。

公开(公告)号：US20080150113A1

公开(公告)日：2008-06-26

申请号：US11645016

申请日：2006-12-21

Applicant: Belgacem Haba ,  Ilyas Mohammed

Inventor： Belgacem Haba ,  Ilyas Mohammed

IPC: H01L23/02 ,  H01L21/00

CPC classification number: H01L25/105 ,  H01L23/3121 ,  H01L23/3128 ,  H01L25/50 ,  H01L2224/16 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/3511

Abstract: A stacked semiconductor chip assembly is disclosed, as are different embodiments relating to same. The stacked chip assembly preferably includes a plurality of units which include a substrate with microelectronic components mounted on each. The individual units desirably are thin and directly abut one another so as to provide a low-height assembly and uniform spacing. Warping of the stacked package is desirably limited by placing bumpers between adjacent units to provide a balanced support, while applying a downward pressure on the units during reflow to control height tolerances.

Abstract translation: 公开了堆叠的半导体芯片组件，以及与之相关的不同实施例。 堆叠式芯片组件优选地包括多个单元，其包括安装在每个单元上的具有微电子部件的基板。 各个单元理想地是薄的并且彼此直接邻接，以便提供低高度的组合和均匀的间隔。 希望通过在相邻单元之间放置缓冲器来提供平衡的支撑，同时在回流期间向单元施加向下的压力以控制高度公差来限制堆叠封装的翘曲。

公开(公告)号：US20080105963A1

公开(公告)日：2008-05-08

申请号：US11881743

申请日：2007-07-27

Applicant: William Carlson ,  Michael Warner ,  Salvador Tostado ,  John Riley ,  Ronald Green ,  Ilyas Mohammed ,  Michael Nystrom ,  Rolfe Gustus ,  David Baker

Inventor： William Carlson ,  Michael Warner ,  Salvador Tostado ,  John Riley ,  Ronald Green ,  Ilyas Mohammed ,  Michael Nystrom ,  Rolfe Gustus ,  David Baker

IPC: H01L23/02

CPC classification number: H05K1/144 ,  H01L23/49811 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/162 ,  H01L2224/16 ,  H01L2924/19107 ,  H01L2924/3011 ,  H05K1/181 ,  H05K3/284 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/10265 ,  H05K2201/2036

Abstract: A stackable chip assembly is disclosed, as are many different embodiments relating to same. The chip assembly preferably includes at least two substrates with components mounted on each. The substrates are preferably situated with respect to one another such that components on one substrate extend towards the other substrate and vice versa. The components of each substrate preferably extend between each other. In addition various connections between the substrates are disclosed, as well as methods of constructing such chip assemblies.

Abstract translation: 公开了可堆叠的芯片组件，与其相关的许多不同的实施例也是公开的。 芯片组件优选地包括至少两个具有安装在其上的部件的基板。 衬底优选地相对于彼此定位，使得一个衬底上的部件朝向另一个衬底延伸，反之亦然。 每个基板的部件优选彼此延伸。 此外，公开了基板之间的各种连接以及构造这种芯片组件的方法。

公开(公告)号：US07335995B2

公开(公告)日：2008-02-26

申请号：US11062413

申请日：2005-02-22

Applicant: L. Elliott Pflughaupt ,  David Gibson ,  Young-Gon Kim ,  Craig S. Mitchell ,  Wael Zohni ,  Ilyas Mohammed

Inventor： L. Elliott Pflughaupt ,  David Gibson ,  Young-Gon Kim ,  Craig S. Mitchell ,  Wael Zohni ,  Ilyas Mohammed

IPC: H01L23/48

CPC classification number: H01L23/50 ,  H01L23/528 ,  H01L23/66 ,  H01L24/10 ,  H01L24/13 ,  H01L24/14 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/06505 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/14 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/14505 ,  H01L2224/16 ,  H01L2224/4824 ,  H01L2224/78301 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/023 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A microelectronic assembly and a fabrication method are provided which includes a microelectronic element such as a chip or element of a package. A plurality of surface-mountable contacts are arranged in an array exposed at a major surface of the microelectronic element. One or more passive elements, e.g., a resistor, inductor, capacitor, or combination of the same are mounted to the microelectronic element, with an inner terminal of the passive element conductively mounted to an exposed surface of one contact and an outer terminal displaced vertically from the major surface of the microelectronic element.

Abstract translation: 提供了一种微电子组件和制造方法，其包括诸如封装的芯片或元件的微电子元件。 多个可表面安装的触点以暴露于微电子元件的主表面的阵列布置。 将一个或多个无源元件（例如电阻器，电感器，电容器或其组合）安装到微电子元件，其中无源元件的内部端子导电地安装到一个触点的暴露表面，并且外部端子垂直移位 从微电子元件的主表面。