公开(公告)号：US08413507B2

公开(公告)日：2013-04-09

申请号：US12801405

申请日：2010-06-08

Applicant: Tetsuo Fujii ,  Hisanori Yokura ,  Hirofumi Higuchi

Inventor： Tetsuo Fujii ,  Hisanori Yokura ,  Hirofumi Higuchi

IPC: G01C19/56 ,  G01P15/125

CPC classification number: H01L27/1203 ,  B81B2201/025 ,  B81B2201/0257 ,  B81B2201/0285 ,  B81B2201/047 ,  B81C1/00182 ,  G01C19/5755 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/0814 ,  H01L21/84

Abstract: A semiconductor dynamic quantity sensor has a substrate including a semiconductor substrate, an insulation layer on a main surface of the semiconductor substrate, and a semiconductor layer on the insulation layer. The main surface has a projection that is trapezoidal or triangular in cross section. The semiconductor layer is divided by a through hole into a movable portion. A tip of the projection is located directly below the movable portion and spaced from the movable portion by a predetermined distance in a thickness direction of the substrate. A width of the tip of the projection is less than a width of the movable portion in a planar direction of the substrate. The distance between the tip of the projection and the movable portion is equal to a thickness of the insulation layer.

Abstract translation: 半导体动态量传感器具有包括半导体衬底，半导体衬底的主表面上的绝缘层和绝缘层上的半导体层的衬底。 主表面具有横截面为梯形或三角形的突起。 半导体层由通孔分割成可动部。 突出部的尖端位于可动部的正下方，与基板的厚度方向与可动部隔开预定的距离。 突起的尖端的宽度小于基板的平面方向上的可动部的宽度。 突起的尖端和可动部之间的距离等于绝缘层的厚度。

公开(公告)号：US08350346B1

公开(公告)日：2013-01-08

申请号：US13541306

申请日：2012-07-03

Applicant: Kegang Huang ,  Martin Lim ,  Steven S. Nasiri

Inventor： Kegang Huang ,  Martin Lim ,  Steven S. Nasiri

IPC: H01L29/84

CPC classification number: B81B3/0051 ,  B81B7/02 ,  B81B2201/025 ,  B81B2201/0271 ,  B81C1/00293 ,  H01L29/0657

Abstract: An integrated MEMS device comprises a wafer where the wafer contains two or more cavities of different depths. The MEMS device includes one movable structure within a first cavity of a first depth and a second movable structure within a second cavity of a second depth. The cavities are sealed to maintain different pressures for the different movable structures for optimal operation. MEMS stops can be formed in the same multiple cavity depth processing flow. The MEMS device can be integrated with a CMOS wafer.

公开(公告)号：US20130001550A1

公开(公告)日：2013-01-03

申请号：US13536798

申请日：2012-06-28

Applicant: Joseph SEEGER ,  Igor TCHERTKOV ,  Hasan AKYOL ,  Goksen G. YARALIOGLU ,  Steven S. NASIRI ,  Ilya GURIN

Inventor： Joseph SEEGER ,  Igor TCHERTKOV ,  Hasan AKYOL ,  Goksen G. YARALIOGLU ,  Steven S. NASIRI ,  Ilya GURIN

IPC: H01L29/84 ,  H01L21/66 ,  H01L21/50

CPC classification number: G01L9/0073 ,  B81B7/02 ,  B81B2201/025 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2207/015 ,  B81C99/0045 ,  B81C2203/0771 ,  G01L1/142 ,  G01L5/223 ,  G01L19/0636 ,  G01L27/007 ,  G01P15/125 ,  G01P2015/084 ,  H01L2924/16235

Abstract: A system and method for providing a MEMS device with integrated electronics are disclosed. The MEMS device comprises an integrated circuit substrate and a MEMS subassembly coupled to the integrated circuit substrate. The integrated circuit substrate includes at least one circuit coupled to at least one fixed electrode. The MEMS subassembly includes at least one standoff formed by a lithographic process, a flexible plate with a top surface and a bottom surface, and a MEMS electrode coupled to the flexible plate and electrically coupled to the at least one standoff. A force acting on the flexible plate causes a change in a gap between the MEMS electrode and the at least one fixed electrode.

Abstract translation: 公开了一种用于向MEMS器件提供集成电子器件的系统和方法。 MEMS器件包括集成电路基板和耦合到集成电路基板的MEMS子组件。 集成电路基板包括耦合到至少一个固定电极的至少一个电路。 MEMS子组件包括由光刻工艺形成的至少一个支座，具有顶表面和底表面的柔性板，以及耦合到柔性板并电耦合到至少一个支座的MEMS电极。 作用在柔性板上的力导致MEMS电极与至少一个固定电极之间的间隙的变化。

公开(公告)号：US20120299127A1

公开(公告)日：2012-11-29

申请号：US13479393

申请日：2012-05-24

Applicant: Tetsuo FUJII ,  Keisuke GOTOH ,  Kenichi AO

Inventor： Tetsuo FUJII ,  Keisuke GOTOH ,  Kenichi AO

IPC: H01L27/20 ,  H01L21/70

CPC classification number: G01L9/0073 ,  B60C23/0488 ,  B81B7/02 ,  B81B2201/025 ,  B81B2207/015 ,  G01L9/0085 ,  G01L19/0092 ,  G01P1/023 ,  G01P15/08 ,  G01P15/125

Abstract: A dynamic quantity sensor device includes: first and second dynamic quantity sensors having first and second dynamic quantity detecting units; and first and second substrates, which are bonded to each other to provide first and second spaces. The first and second units are air-tightly accommodated in the first and second spaces, respectively. A SOI layer of the first substrate is divided into multiple semiconductor regions by trenches. First and second parts of the semiconductor regions provide the first and second units, respectively. The second part includes: a second movable semiconductor region having a second movable electrode, which is provided by a sacrifice etching of the embedded oxide film; and a second fixed semiconductor region having a second fixed electrode. The second sensor detects the second dynamic quantity by measuring a capacitance between the second movable and fixed electrodes, which is changeable in accordance with the second dynamic quantity.

Abstract translation: 动态量传感器装置包括：具有第一和第二动态量检测单元的第一和第二动态量传感器; 以及彼此结合以提供第一和第二空间的第一和第二基板。 第一和第二单元分别气密地容纳在第一和第二空间中。 第一衬底的SOI层被沟槽分成多个半导体区域。 半导体区域的第一和第二部分分别提供第一和第二单元。 第二部分包括：具有第二可移动电极的第二可移动半导体区域，其通过对嵌入的氧化膜的牺牲蚀刻而提供; 以及具有第二固定电极的第二固定半导体区域。 第二传感器通过测量可根据第二动态量改变的第二可动电极和固定电极之间的电容来检测第二动态量。

公开(公告)号：US20120297876A1

公开(公告)日：2012-11-29

申请号：US13479770

申请日：2012-05-24

Applicant: Christoph GAUGER ,  Markus Heitz

Inventor： Christoph GAUGER ,  Markus Heitz

IPC: F16F15/04 ,  H02N1/00 ,  G01P15/00

CPC classification number: B81B3/0078 ,  B81B2201/025 ,  B81B2203/0163 ,  G01P1/003 ,  G01P15/08 ,  G01P2015/084 ,  G01P2015/0857

Abstract: A micromechanical component including a mass structure which may be deflected with respect to a substrate with the aid of at least one spiral spring in a direction of deflection. The spiral spring includes at least one folding section, which is formed by two spring legs which are situated essentially in parallel to each other and are connected to each other with the aid of a connecting bar. A damping device for oscillating movements of the folding section in the direction of deflection is provided in the area of the connecting bar.

Abstract translation: 一种微机械部件，其包括质量结构，所述质量结构可以借助于沿偏转方向的至少一个螺旋弹簧而相对于基板偏转。 螺旋弹簧包括至少一个折叠部分，其由两个基本上彼此平行地定位并且通过连接杆彼此连接的弹簧腿形成。 在连接杆的区域中设置有用于使折叠部在偏转方向上摆动的阻尼装置。

公开(公告)号：US20120256307A1

公开(公告)日：2012-10-11

申请号：US13440337

申请日：2012-04-05

Applicant: Yugo KOYAMA

Inventor： Yugo KOYAMA

IPC: H01L23/538 ,  H01L21/50 ,  H01L23/02

CPC classification number: G01C19/5783 ,  B81B7/0074 ,  B81B2201/025 ,  G01C19/5621 ,  H01L23/055 ,  H01L23/3192 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

Abstract: A sensor module includes a support member having a first flat surface, a second flat surface orthogonally connected to the first flat surface, a third flat surface orthogonally connected to the first flat surface and the second flat surface, and a fourth flat surface opposed to the first flat surface as an attachment surface to an external member, the first flat surface having a support surface depressed from the first flat surface, IC chips having connection terminals on active surface sides with inactive surface sides along the active surfaces respectively attached to the respective surfaces of the support member, and vibration gyro elements having connection electrodes, and the vibration gyro elements are provided on the active surface sides of the IC chips and the connection electrodes are attached to the connection terminals of the IC chips so that principal surfaces are respectively along the respective surfaces of the support member.

Abstract translation: 传感器模块包括具有第一平坦表面的支撑构件，与第一平坦表面正交连接的第二平坦表面，与第一平坦表面和第二平坦表面正交连接的第三平坦表面和与第一平坦表面相对的第四平坦表面 所述第一平面具有从所述第一平面凹下的支撑面，所述第一平面具有从所述第一平面凹下的支撑面，所述IC芯片具有在所述有源面侧的连接端子，所述IC芯片沿着所述有源面分别具有不平坦的表面侧， 和具有连接电极的振动陀螺元件，并且振动陀螺元件设置在IC芯片的有源面侧，并且连接电极附接到IC芯片的连接端子，使得主表面分别沿着 支撑构件的各个表面。

公开(公告)号：US08276446B2

公开(公告)日：2012-10-02

申请号：US12657751

申请日：2010-01-26

Applicant: Markus Ulm ,  Michael Struchholz ,  Tristan Jobert ,  Klaus Offterdinger ,  Thomas Klaus ,  Christian Gerhardt ,  Florian Grabmaier ,  Dirk Dittmann

Inventor： Markus Ulm ,  Michael Struchholz ,  Tristan Jobert ,  Klaus Offterdinger ,  Thomas Klaus ,  Christian Gerhardt ,  Florian Grabmaier ,  Dirk Dittmann

IPC: G01D11/10

CPC classification number: G01P1/023 ,  B81B7/0012 ,  B81B2201/025 ,  B81B2207/07 ,  G01C19/56 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A sensor device includes a housing base part, a bearer part, a chip structure situated on the bearer part, and a spring/damper combination via which the housing base part and the bearer part are elastically connected to one another. In the sensor device, the housing base part, the spring/damper combination and the bearer part are situated one over the other.

Abstract translation: 传感器装置包括壳体基部，承载部分，位于承载部分上的芯片结构，以及弹簧/阻尼器组合，壳体基部和承载部分经由该弹簧/阻尼器组合彼此弹性连接。 在传感器装置中，壳体基部，弹簧/阻尼器组合和承载部分彼此重叠。

公开(公告)号：US08227879B2

公开(公告)日：2012-07-24

申请号：US12846088

申请日：2010-07-29

Applicant: Mark Eskridge

Inventor： Mark Eskridge

IPC: G01P15/08 ,  H04R23/00

CPC classification number: G01P1/023 ,  B81B7/0074 ,  B81B2201/0235 ,  B81B2201/025 ,  G01C19/5783 ,  G01P15/0802 ,  G01P15/18 ,  H01L2224/16225 ,  H01L2924/1461 ,  H01L2924/00

Abstract: Systems and methods for mounting inertial sensors on a board. On a wafer containing one or more sensor packages having a substrate layer, a sensor layer and an insulator layer located between the sensor layer and the substrate layer, a V-groove is anisotropically etched into one of the substrate layer. The substrate layer is in the 100 crystal plane orientation. The sensor package is then separated from the wafer. Then, a surface of the substrate layer formed by the etching is attached to a board. In one example, three sensor packages are mounted to the board so that their sense axis are perpendicular to each other.

Abstract translation: 将惯性传感器安装在电路板上的系统和方法。 在包含一个或多个具有衬底层，传感器层和位于传感器层和衬底层之间的绝缘体层的传感器封装的晶片上，V型槽被各向异性蚀刻到衬底层之一中。 基底层的晶体取向为100。 然后将传感器封装与晶片分离。 然后，通过蚀刻形成的基板层的表面附着在基板上。 在一个示例中，三个传感器封装被安装到板，使得它们的感测轴线彼此垂直。

公开(公告)号：US08216882B2

公开(公告)日：2012-07-10

申请号：US12861509

申请日：2010-08-23

Applicant: Yizhen Lin ,  Woo Tae Park ,  Mark E. Schlarmann ,  Hemant D. Desai

Inventor： Yizhen Lin ,  Woo Tae Park ,  Mark E. Schlarmann ,  Hemant D. Desai

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L28/60 ,  B81B7/02 ,  B81B2201/025 ,  B81B2201/0264 ,  G01L9/0073 ,  G01L19/0092 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/0814 ,  G01P2015/088 ,  H01G5/18

Abstract: A device (20, 90) includes sensors (28, 30) that sense different physical stimuli. A pressure sensor (28) includes a reference element (44) and a sense element (52), and an inertial sensor (30) includes a movable element (54). Fabrication (110) entails forming (112) a first substrate structure (22, 92) having a cavity (36, 100), forming a second substrate structure (24) to include the sensors (28, 30), and coupling (128) the substrate structures so that the first sensor (28) is aligned with the cavity (36, 100) and the second sensor (30) is laterally spaced apart from the first sensor (28). Forming the second structure (24) includes forming (118) the sense element (52) from a material layer (124) of the second structure (24) and following coupling (128) of the substrate structures, concurrently forming (132) the reference element (44) and the movable element (54) in a wafer substrate (122) of the second structure (24).

Abstract translation: 装置（20,90）包括感测不同物理刺激的传感器（28,30）。 压力传感器（28）包括参考元件（44）和感测元件（52），惯性传感器（30）包括可移动元件（54）。 制造（110）需要形成（112）具有空腔（36,100）的第一衬底结构（22,92），形成包括传感器（28,30）的第二衬底结构（24）和耦合（128） 所述基板结构使得所述第一传感器（28）与所述空腔（36,100）对准，并且所述第二传感器（30）与所述第一传感器（28）横向间隔开。 形成第二结构（24）包括从第二结构（24）的材料层（124）和衬底结构的耦合（128）形成（118）感测元件（52），同时形成（132）参考 元件（44）和第二结构（24）的晶片衬底（122）中的可移动元件（54）。

公开(公告)号：US20120130672A1

公开(公告)日：2012-05-24

申请号：US13301172

申请日：2011-11-21

Applicant: Robert D. Horning ,  Ryan Supino

Inventor： Robert D. Horning ,  Ryan Supino

IPC: G06F15/00 ,  H01R43/00 ,  G01C19/56

CPC classification number: B81B3/0086 ,  B81B2201/025 ,  B81B2203/0136 ,  Y10T29/49117

Abstract: A MEMS sensor comprises a substrate and at least one proof mass having a first plurality of combs. The proof mass is coupled to the substrate via one or more suspension beams such that the proof mass and the first plurality of combs are movable. The MEMS sensor also comprises at least one anchor having a second plurality of combs. The anchor is coupled to the substrate such that the anchor and second plurality of combs are fixed in position relative to the substrate. The first plurality of combs are interleaved with the second plurality of combs. Each of the combs comprises a plurality of conductive layers electrically isolated from each other by one or more non-conductive layers. Each conductive layer is individually coupled to a respective electric potential such that capacitance between the combs varies approximately linearly with displacement of the movable combs in an out-of-plane direction.

Abstract translation: MEMS传感器包括基板和至少一个具有第一多个梳子的检测质量块。 检测质量通过一个或多个悬架梁耦合到基板，使得检验质量块和第一组多个梳子可移动。 MEMS传感器还包括具有第二多个梳子的至少一个锚固件。 锚固件联接到基板，使得锚固件和第二多个梳子相对于基板固定在适当位置。 第一组多个梳子与第二组梳子交错。 每个梳子包括通过一个或多个非导电层彼此电隔离的多个导电层。 每个导电层单独地耦合到相应的电位，使得梳子之间的电容随着可移动梳状体在平面外方向上的位移而近似线性地变化。