公开(公告)号：US20060134820A1

公开(公告)日：2006-06-22

申请号：US11102982

申请日：2005-04-11

Applicant: Weilong Tang ,  Tseng-Yang Hsu ,  Salleh Ismail ,  Nim Tea ,  Melvin Khoo ,  Raffi Garabedian ,  Lakshmikanth Namburi

Inventor： Weilong Tang ,  Tseng-Yang Hsu ,  Salleh Ismail ,  Nim Tea ,  Melvin Khoo ,  Raffi Garabedian ,  Lakshmikanth Namburi

IPC: H01L21/00 ,  H01L21/44

CPC classification number: B81C1/00436 ,  B81C1/00666 ,  B81C2201/0107 ,  B81C2201/0197

Abstract: The present invention relates to a process for forming microstructures on a substrate. A plating surface is applied to a substrate. A first layer of photoresist is applied on top of the plating base. The first layer of photoresist is exposed to radiation in a pattern to render the first layer of photoresist dissolvable in a first pattern. The dissolvable photoresist is removed and a first layer of primary metal is electroplated in the area where the first layer of photoresist was removed. The remainder of the photoresist is then removed and a second layer of photoresist is then applied over the plating base and first layer of primary metal. The second layer of photoresist is then exposed to a second pattern of radiation to render the photoresist dissolvable and the dissolvable photoresist is removed. The second pattern is an area that surrounds the primary structure, but it does not entail the entire substrate. Rather it is an island surrounding the primary metal. The exposed surface of the secondary metal is then machined down to a desired height of the primary metal. The secondary metal is then etched away.

Abstract translation: 本发明涉及一种在基板上形成微观结构的方法。 将电镀表面施加到基板。 将第一层光致抗蚀剂施加在电镀基底上。 第一层光致抗蚀剂以图案暴露于辐射，以使第一层光致抗蚀剂以第一图案溶解。 去除可溶解的光致抗蚀剂，并且在去除第一层光致抗蚀剂的区域中电镀第一层初级金属。 然后除去光致抗蚀剂的其余部分，然后将第二层光致抗蚀剂涂覆在镀覆基底和第一层金属的第一层上。 然后将第二层光致抗蚀剂暴露于第二辐射图案，以使光致抗蚀剂可溶解并除去可溶解的光致抗蚀剂。 第二图案是围绕一次结构的区域，但不包含整个基板。 相反，它是一个围绕着主要金属的岛屿。 然后将次级金属的暴露表面加工到初级金属的期望高度。 然后将二次金属蚀刻掉。

公开(公告)号：US20040155306A1

公开(公告)日：2004-08-12

申请号：US10773312

申请日：2004-02-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eun-sung Lee ,  Chung-woo Kim ,  In-sang Song ,  Jong-seok Kim ,  Moon-chul Lee

IPC: H01L027/14

CPC classification number: B81B3/0078 ,  B81B2201/014 ,  B81B2203/0118 ,  B81B2203/0307 ,  B81B2203/04 ,  B81C2201/0107 ,  B81C2201/014 ,  H01H59/0009

Abstract: A method for fabricating a MEMS device having a fixing part fixed to a substrate, a connecting part, a driving part, a driving electrode, and contact parts, includes patterning the driving electrode on the substrate; forming an insulation layer on the substrate; patterning the insulation layer and etching a fixing region and a contact region of the insulation layer; forming a metal layer over the substrate; planarizing the metal layer until the insulation layer is exposed; forming a sacrificial layer on the substrate; patterning the sacrificial layer to form an opening exposing a portion of the insulation layer and the metal layer in the fixing region; forming a MEMS structure layer on the sacrificial layer to partially fill the opening, thereby forming sidewalls therein; and selectively removing a portion of the sacrificial layer by etching so that a portion of the sacrificial layer remains in the fixing region.

Abstract translation: 一种用于制造具有固定到基板上的固定部件，连接部件，驱动部件，驱动电极和接触部件的MEMS器件的方法，包括在所述基板上图形化所述驱动电极; 在所述基板上形成绝缘层; 图案化绝缘层并蚀刻绝缘层的固定区域和接触区域; 在衬底上形成金属层; 使金属层平坦化直到绝缘层露出; 在所述基板上形成牺牲层; 图案化牺牲层以形成露出固定区域中绝缘层和金属层的一部分的开口; 在所述牺牲层上形成MEMS结构层以部分地填充所述开口，从而在其中形成侧壁; 并且通过蚀刻选择性地去除牺牲层的一部分，使得牺牲层的一部分保留在固定区域中。

公开(公告)号：US06720201B2

公开(公告)日：2004-04-13

申请号：US10384495

申请日：2003-03-10

Applicant: Eun-sung Lee ,  Chung-woo Kim ,  In-sang Song ,  Jong-seok Kim ,  Moon-chul Lee

Inventor： Eun-sung Lee ,  Chung-woo Kim ,  In-sang Song ,  Jong-seok Kim ,  Moon-chul Lee

IPC: H01L2100

CPC classification number: B81B3/0078 ,  B81B2201/014 ,  B81B2203/0118 ,  B81B2203/0307 ,  B81B2203/04 ,  B81C2201/0107 ,  B81C2201/014 ,  H01H59/0009

Abstract: A method for fabricating a MEMS device having a fixing part fixed to a substrate, a connecting part, a driving part, a driving electrode, and contact parts, includes patterning the driving electrode on the substrate; forming an insulation layer on the substrate; patterning the insulation layer and etching a fixing region and a contact region of the insulation layer; forming a metal layer over the substrate; planarizing the metal layer until the insulation layer is exposed; forming a sacrificial layer on the substrate; patterning the sacrificial layer to form an opening exposing a portion of the insulation layer and the metal layer in the fixing region; forming a MEMS structure layer on the sacrificial layer to partially fill the opening, thereby forming sidewalls therein; and selectively removing a portion of the sacrificial layer by etching so that a portion of the sacrificial layer remains in the fixing region.

公开(公告)号：US20030234179A1

公开(公告)日：2003-12-25

申请号：US10434315

申请日：2003-05-07

Applicant: MEMGen Corporation

Inventor： Christopher A. Bang

IPC: C25D005/02 ,  C25D001/10

CPC classification number: G01P15/0802 ,  B33Y10/00 ,  B81B2201/042 ,  B81C99/0085 ,  B81C2201/0107 ,  B81C2201/0109 ,  B81C2201/0197 ,  G01P15/125

Abstract: Molded structures, methods of and apparatus for producing the molded structures are provided. At least a portion of the surface features for the molds are formed from multilayer electrochemically fabricated structures (e.g. fabricated by the EFABnull formation process), and typically contain features having resolutions within the 1 to 100 nullm range. The layered structure is combined with other mold components, as necessary, and a molding material is injected into the mold and hardened. The layered structure is removed (e.g. by etching) along with any other mold components to yield the molded article. In some embodiments portions of the layered structure remain in the molded article and in other embodiments an additional molding material is added after a partial or complete removal of the layered structure.

Abstract translation: 提供了模制结构，制造模制结构的方法和设备。 用于模具的表面特征的至少一部分由多层电化学制造的结构（例如通过EFAB TM形成工艺制造）形成，并且通常包含具有在1至100μm范围内的分辨率的特征。 根据需要，将层状结构与其他模具部件组合，并将模塑材料注入模具中并硬化。 层压结构与任何其它模具部件一起被除去（例如通过蚀刻）以产生模塑制品。 在一些实施例中，分层结构的部分保留在模制品中，并且在其它实施例中，在部分或完全去除层状结构之后添加另外的模制材料。

公开(公告)号：US20030117257A1

公开(公告)日：2003-06-26

申请号：US10290807

申请日：2002-11-08

Applicant: Coventor, Inc.

Inventor： Shawn Jay Cunningham

IPC: H01C010/50

CPC classification number: B81B3/0024 ,  B81B3/0051 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/0015 ,  B81C2201/0107 ,  B81C2201/0108 ,  B81C2201/0109 ,  H01H1/04 ,  H01H1/504 ,  H01H59/0009 ,  H01H61/04 ,  H01H2001/0042 ,  H01H2001/0063 ,  H01H2001/0089 ,  H01H2059/0072 ,  H01H2061/006 ,  H01L23/3735 ,  H01L23/522 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/09701 ,  H02N1/006 ,  H02N10/00 ,  Y10T29/49222 ,  H01L2924/00

Abstract: Electrothermal Self-Latching MEMS Switch and Method. According to one embodiment, a microscale switch having a movable microcomponent is provided and includes a substrate having a stationary contact. The switch can also include a structural layer having a movable contact positioned for contacting the stationary contact when the structural layer moves toward the substrate. An electrothermal latch attached to the structural layer and having electrical communication with the movable contact to provide current flow between the electrothermal latch and the stationary contact when the movable contact contacts the stationary contact for maintaining the movable contact in contact with the stationary contact.

Abstract translation: 电热自锁式MEMS开关及方法。 根据一个实施例，提供具有可移动微组件的微型开关，并且包括具有固定触点的基板。 该开关还可以包括具有可移动触点的结构层，该结构层定位成当结构层向衬底移动时与固定触点接触。 一个电热锁定件，其连接到结构层并且当可动触点接触固定触点以便使可动触点与固定触点接触时，与可动触头电连通以提供电热闩和固定触点之间的电流。

公开(公告)号：US06365442B1

公开(公告)日：2002-04-02

申请号：US09679582

申请日：2000-10-04

Applicant: Dean Tran ,  John Joseph Berenz ,  Luis M. Rochin ,  Thomas J. Roth ,  Ronald A. DePace

Inventor： Dean Tran ,  John Joseph Berenz ,  Luis M. Rochin ,  Thomas J. Roth ,  Ronald A. DePace

IPC: H01L2182

CPC classification number: B81C1/00396 ,  B81B2203/0315 ,  B81B2203/0338 ,  B81C2201/0107 ,  H01H1/0036 ,  H01H35/14 ,  H01H59/0009

Abstract: A method of making a micro-miniature switch device (10), which has at least one member (68) movable relative to a substrate (12) upon which the device is provided, includes providing a layer of sacrificial non-photolithography material upon a stratum connected to the substrate. A template is provided via photolithographing step that uses a photoresist material upon a stratum connected to the substrate. A layer is provided to include at least a portion of the movable member. The photoresist material and the sacrificial non-photolithography material are removed using photoresist developer. Preferably, at least two photolithography process steps utilize a single photolithographic mask. Also preferably, substrate material is removed to create a recess and at least one channel into the substrate, wherein the channel intersects the recess. At least a portion of the movable member is provided at a location within the recess and at least a portion of the movable member is provided at a location within the channel.

Abstract translation: 一种制造微型开关装置（10）的方法，该微型开关装置（10）具有至少一个可相对于其上提供该装置的基板（12）移动的构件（68），包括在一个 层与基板连接。 通过光刻步骤提供模板，其在连接到衬底的层上使用光致抗蚀剂材料。 提供层以包括可移动构件的至少一部分。 使用光致抗蚀剂显影剂除去光致抗蚀剂材料和牺牲非光刻材料。 优选地，至少两个光刻工艺步骤使用单个光刻掩模。 还优选地，去除衬底材料以产生凹陷和至少一个通道进入衬底，其中沟道与凹部相交。 可移动部件的至少一部分设置在凹部内的位置处，并且可移动部件的至少一部分设置在通道内的位置处。

公开(公告)号：US6020215A

公开(公告)日：2000-02-01

申请号：US844971

申请日：1997-04-28

Applicant: Takayuki Yagi ,  Masatake Akaike

Inventor： Takayuki Yagi ,  Masatake Akaike

IPC: B81B3/00 ,  B81C1/00 ,  G03F7/00 ,  H01H59/00 ,  H01L23/00 ,  H02N1/00 ,  H02N2/00 ,  H02N2/02 ,  H01L21/311

CPC classification number: B81C1/0092 ,  B81C1/00936 ,  H01H59/0009 ,  H02N1/006 ,  B81B2203/0118 ,  B81C2201/0107 ,  B81C2201/0109 ,  B81C2203/031

Abstract: A microstructure comprising a substrate (1), a patterned structure (beam member) (2) suspended over the substrate (1) with an air-space (4) therebetween and supporting structure (3) for suspending the patterned structure (2) over the substrate (1). The microstructure is prepared by using a sacrificial layer (7) which is removed to form the space between the substrate (1) and the patterned structure (2) adhered to the sacrificial layer. In the case of using resin as the material of the sacrificial layer, the sacrificial layer can be removed without causing sticking, and an electrode can be provided on the patterned structure. The microstructure can have application as electrostatic actuator, etc., depending on choice of shape and composition.

Abstract translation: 一种微结构，其包括衬底（1），悬挂在衬底（1）上的图案化结构（梁构件）（2），其间具有空气空间（4）和用于将图案化结构（2）悬挂在其上的支撑结构（3） 基板（1）。 通过使用牺牲层（7）来制备微结构，所述牺牲层被除去以形成衬底（1）和附着到牺牲层的图案化结构（2）之间的空间。 在使用树脂作为牺牲层的材料的情况下，可以除去牺牲层而不引起粘附，并且可以在图案化结构上提供电极。 根据形状和组成的选择，微结构可以用作静电致动器等。

公开(公告)号：US4681403A

公开(公告)日：1987-07-21

申请号：US877696

申请日：1986-06-19

Applicant: Ties S. Te Velde ,  Joannes L. M. Van de Venne

Inventor： Ties S. Te Velde ,  Joannes L. M. Van de Venne

IPC: G02F1/133 ,  B81B3/00 ,  G02F1/01 ,  G02F1/1362 ,  G02F1/15 ,  G02F1/163 ,  G02F1/17 ,  G09F9/30 ,  G09G3/20 ,  G09G3/38 ,  H01H1/00 ,  H01H59/00

CPC classification number: B81C1/00333 ,  G02F1/0102 ,  G02F1/1362 ,  G02F1/163 ,  G09G3/38 ,  H01H59/0009 ,  B81C2201/0107 ,  B81C2203/0136 ,  G09G2300/08 ,  G09G3/20 ,  H01H1/0036

Abstract: A layer of liquid crystal is present between two supporting plates with a large number of picture electrodes arranged in rows and columns on at least one of the supporting plates. Strip-shaped row electrodes and strip-shaped column electrodes are provided between the respective rows and columns of the picture electrodes. The picture electrodes arranged in rows can be contacted with a respective row electrode by way of at least one micromechanical leaf spring which provides the liquid crystal with a sufficiently steep threshold with respect to the applied voltage, and provides the liquid crystal with a memory when the picture electrodes form picture elements of a display device. Because of this arrangement, the number of lines to be driven of the display device can be extended.

Abstract translation: 在两个支撑板之间存在一层液晶，其中至少一个支撑板上具有排列成行和列的大量图像电极。 带状行电极和带状列电极设置在图象电极的各列和列之间。 排列成行的图像电极可以通过至少一个微机械板簧与相应的行电极接触，其提供相对于所施加的电压的足够陡峭的阈值的液晶，并且当液晶具有存储器时 图像电极形成显示装置的图像元素。 由于这种布置，可以延长显示装置的被驱动的行数。