公开(公告)号：US20060254709A1

公开(公告)日：2006-11-16

申请号：US11126714

申请日：2005-05-11

Applicant: Marvin Bone ,  David Bone

Inventor： Marvin Bone ,  David Bone

IPC: B32B37/00

CPC classification number: C09J5/06 ,  C09J2201/602 ,  H05B6/105

Abstract: Alternating magnetic flux is directed through a high permeability flux guide to an area of overlapped electrically-conductive sheets between which a heat-curable adhesive material is positioned. Energy from the flux creates eddy currents in the overlapped sheets which dissipate power as heat, and the heat cures the adhesive to bond the sheets together. In addition to bonding, energy consumption is reduced and more uniformity in heating and curing of the adhesive material results from using the flux guide.

Abstract translation: 交替磁通通过高磁导率磁通引导到重叠导电片的区域，在该区域之间放置可热固化的粘合剂材料。 来自助焊剂的能量在重叠的片材中产生涡流，其以热量消散功率，并且热固化粘合剂以将片材粘合在一起。 除了粘合之外，能量消耗降低，并且粘合剂材料的加热和固化的更均匀性是由于使用助焊剂导致的。

公开(公告)号：US20060243958A1

公开(公告)日：2006-11-02

申请号：US11116537

申请日：2005-04-28

Applicant: Daewoong Suh ,  Amram Eitan ,  Yongki Min

Inventor： Daewoong Suh ,  Amram Eitan ,  Yongki Min

IPC: H01L29/06 ,  H01L29/12 ,  H01L21/00

CPC classification number: H01L23/49827 ,  B82Y10/00 ,  C09J7/22 ,  C09J9/02 ,  C09J2201/128 ,  C09J2201/602 ,  C09J2203/326 ,  H01L23/49877 ,  H01L23/5384 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05657 ,  H01L2224/0566 ,  H01L2224/05676 ,  H01L2224/0568 ,  H01L2224/11452 ,  H01L2224/1182 ,  H01L2224/1191 ,  H01L2224/13022 ,  H01L2224/13193 ,  H01L2224/13562 ,  H01L2224/13582 ,  H01L2224/136 ,  H01L2224/13611 ,  H01L2224/13666 ,  H01L2224/16145 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/29 ,  H01L2224/29076 ,  H01L2224/29078 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29193 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/81193 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2224/83203 ,  H01L2225/06527 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H05K3/323 ,  H05K2201/026 ,  Y10S977/848 ,  Y10S977/932 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01015 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: A method of interconnecting and an interconnect is provided to connect a first component and a second component of an integrated circuit. The interconnect includes a plurality of Carbon Nanotubes (CNTs), which provide a conducting path between the first component and the second component. The interconnect further includes a passivation layer to fill the gaps between adjacent CNTs. A method of producing Anisotropic Conductive Film (ACF) and an ACF is provided. The ACF includes a plurality of CNTs, which provide a conducting path between a first side of the ACF and a second side of the ACF. The sides of the ACF can also include a conductive curable adhesive layer. In an embodiment, the conductive curable adhesive layer can incorporate a B-stage cross-linkable polymer and silver particles.

公开(公告)号：US20030236362A1

公开(公告)日：2003-12-25

申请号：US10602424

申请日：2003-06-24

Applicant: 3M Innovative Properties Company

Inventor： Gregory L. Bluem ,  Christopher A. Haak ,  Fred B. McCormick JR. ,  Stanley F. Tead

IPC: C08F283/00

CPC classification number: H05K3/321 ,  C08L2666/04 ,  C09J4/00 ,  C09J7/35 ,  C09J9/02 ,  C09J163/00 ,  C09J2201/602 ,  C09J2433/00 ,  C09J2463/00 ,  H05K3/1216 ,  H05K3/386 ,  Y10T428/28 ,  Y10T428/2813 ,  Y10T428/2852 ,  Y10T428/2891 ,  C08F220/12 ,  C08F220/18 ,  C08F220/10

Abstract: A screen-printable adhesive composition capable of being applied to a substrate at room temperature comprising at least one alkyl acrylate; at least one reinforcing comonomer, a polyepoxide resin, and a polyepoxide resin curing agent; wherein said composition is substantially solvent free and said composition has a yield point of greater than 3 Pascals and a viscosity of less than 6000 centipoise. In another aspect, the invention provides heat-curable electrically and/or thermally conductive adhesive films that are substantially solvent-free acrylic polymers further containing a polyepoxide resin, a polyepoxide resin curing agent, and an electrically conductive material and/or a thermally conductive material.

Abstract translation: 一种能够在室温下涂覆于基材上的丝网印刷性粘合剂组合物，其包含至少一种丙烯酸烷基酯; 至少一种增强共聚单体，聚环氧树脂和聚环氧树脂固化剂; 其中所述组合物基本上是无溶剂的，并且所述组合物的屈服点大于3帕斯卡，粘度小于6000厘泊。 另一方面，本发明提供了可热固化的导电和/或导热粘合剂膜，其基本上是无溶剂的丙烯酸类聚合物，其进一步含有聚环氧化物树脂，聚环氧化物树脂固化剂以及导电材料和/或导热材料 。

公开(公告)号：US06566422B1

公开(公告)日：2003-05-20

申请号：US09662947

申请日：2000-09-15

Applicant: Hidekazu Yagi ,  Motohide Takeichi ,  Junji Shinozaki

Inventor： Hidekazu Yagi ,  Motohide Takeichi ,  Junji Shinozaki

IPC: C08K310

CPC classification number: H05K3/323 ,  C09J7/10 ,  C09J2201/602 ,  C09J2463/00 ,  H01L2224/293 ,  H01L2924/01019 ,  H01L2924/01079 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/068 ,  Y10S525/903

Abstract: A connecting material for bonding and connecting elements each having electrodes thereon in a correspondingly confronting relation to each other, while attaining electroconductive connection between the corresponding electrodes, which material has a high heat resistance and can avoid occurrence of faulty electrical conductance even in the case of bonding elements having a large number of electrodes arranged, thus, at a considerably small interval under such a condition that the bonded assembly is exposed to a service environment of high temperature or of high temeperature and high humidity, wherein the connecting material contains a thermosetting resin and an inorganic filler and has, after having been cured, characteristic features of a modulus of elasticity of 1-12 GPa, a glass transition temperature Tg of 120-200° C., a coefficient of linear expansion (&agr;1) of 50 ppm/° C. or less at temperatures below the Tg and a coefficient of linear expansion (&agr;2) of 110 ppm/° C. or less at temperatures above the Tg, wherein the difference (&agr;2−&agr;1) does not exceed over 60 ppm/° C.

Abstract translation: 一种连接材料，用于在彼此具有相应对应关系的每一个上具有电极的接合和连接元件，同时在相应的电极之间获得导电连接，该材料具有高耐热性，并且可以避免发生故障电导，即使在 因此，在接合组件暴露于高温或高温高湿的使用环境的条件下，以相当小的间隔布置具有大量电极的接合元件，其中连接材料包含热固性树脂 和无机填料，在固化后具有1-12GPa的弹性模量，120-200℃的玻璃化转变温度Tg，50ppm /分的线性膨胀系数（α1）的特征， 在低于Tg的温度下，线膨胀系数（α2）为110ppm /℃或更低 在高于Tg的温度下，其中差值（α2-α1）不超过60ppm /℃。

公开(公告)号：US20030091777A1

公开(公告)日：2003-05-15

申请号：US10176980

申请日：2002-06-20

Inventor： Peter Jones ,  Deanna J. Wright ,  Robert J. Malik

IPC: B32B009/00

CPC classification number: H05K9/0015 ,  C09J7/28 ,  C09J7/38 ,  C09J9/02 ,  C09J2201/602 ,  Y10T428/14 ,  Y10T428/19

Abstract: An EMI shielding tape adherable to a surface of a structure. The tape includes a backing layer, and an adhesive layer carried on at least one side of the backing layer. The adhesive layer has an inner face bonded the backing layer, and an opposite outer face which is bondable under pressure to the structure surface to adhere the tape thereto. The adhesive layer is formulated as an admixture of a pressure sensitive adhesive (PSA) composition and one or more electrically-conductive particulate fillers. When adhered to the structure surface, the tape is substantially cleanly releasable therefrom.

Abstract translation: 可与结构表面相粘合的EMI屏蔽胶带。 胶带包括背衬层和承载在背衬层的至少一侧上的粘合剂层。 粘合剂层具有粘合背衬层的内表面和在压力下结合到结构表面以将胶带粘合的相对的外表面。 粘合剂层被配制成压敏粘合剂（PSA）组合物和一种或多种导电性颗粒填料的混合物。 当粘附到结构表面上时，带基本上可以从其中清除。

公开(公告)号：US20020142157A1

公开(公告)日：2002-10-03

申请号：US09866217

申请日：2001-05-29

Applicant: Shinwha Intertek Corp.

Inventor： Yong-In Lee

IPC: B32B015/04 ,  B32B007/12 ,  B32B027/04 ,  D04B021/00 ,  D04G001/00 ,  D03D019/00 ,  D04B001/00

CPC classification number: B32B3/10 ,  B32B5/16 ,  B32B27/12 ,  B32B27/32 ,  B32B27/36 ,  B32B2262/101 ,  B32B2307/202 ,  B32B2323/04 ,  B32B2323/10 ,  B32B2367/00 ,  B32B2405/00 ,  C09J7/29 ,  C09J2201/602 ,  C09J2400/163 ,  C09J2423/006 ,  C09J2467/006 ,  C09J2477/006 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/2896 ,  Y10T442/10 ,  Y10T442/133 ,  Y10T442/172 ,  Y10T442/2738

Abstract: The present invention relates to an electroconductive adhesive tape used for electrical and electronic products to bond or fix an element to a support while maintaining an electrical conductivity between the element and support. The electroconductive adhesive tape comprises a perforated synthetic film, two metal plating layers respectively formed on both surfaces of the synthetic resin film, and a conductive adhesive layer formed on one of the metal plating layers. Made to be very thin, the film has the advantage of being flexible and high in tensile strength in addition to showing excellent electrical conductivity. The metal plating layers are integratedly formed through the perforations of the synthetic resin film, maintaining excellent electrical conductivity. Thus, the electroconductive adhesive tape maintains a desired strength while exhibiting a high flexibility and a high bondability.

Abstract translation: 本发明涉及一种用于电气和电子产品的导电胶带，用于将元件粘合或固定到支撑件上，同时保持元件和支撑件之间的导电性。 导电胶带包括穿孔合成膜，分别形成在合成树脂膜的两个表面上的两个金属镀层和形成在一个金属镀层上的导电粘合剂层。 除了显示出优异的导电性外，该薄膜具有柔韧性和拉伸强度高的优点。 金属镀层通过合成树脂膜的穿孔整体形成，保持优异的导电性。 因此，导电胶带保持期望的强度，同时具有高的柔韧性和高的粘合性。

公开(公告)号：US3497383A

公开(公告)日：1970-02-24

申请号：US3497383D

申请日：1967-08-22

Applicant: MINNESOTA MINING & MFG

Inventor： OLYPHANT MURRAY JR ,  STOW ROBERT H

IPC: H01B1/00 ,  B44D1/18

CPC classification number: H01B1/00 ,  C09J7/28 ,  C09J7/29 ,  C09J9/02 ,  C09J2201/32 ,  C09J2201/602 ,  C09J2400/163 ,  Y10T428/24529 ,  Y10T428/24917

Abstract: 1,247,016. Electrically conductive adhesive tape. MINNESOTA MINING & MFG. CO. 21 Aug., 1968 [22 Aug., 1967], No. 40049/68. Heading B2E. [Also in Division H1] An electrically conductive adhesive tape comprises a flexible continuous electrically conductive backing embossed with many integral electrically conductive closely spaced projections of uniform height on at least one surface and a layer of adhesive covering said surface(s) of thickness at least as great as the height of the projections but not exceeding this by more than an amount that will readily undergo dielectric breakdown when a useful voltage is imposed between the tape and a conductive substrate to which the tape is applied. The backing may include at least one layer of highly conductive metal, such as aluminium or copper, the adhesive being disposed electrical contact therewith to form the adhesive surface(s) of the tape. The projections may comprise line-shaped projections and they may taper towards the top. The backing may consist of a self-supporting metal foil or a layer of metal coated on an organic polymeric film such as of polyethylene terephthalate. The adhesive may be pressure sensitive such as a 96:4 copolymer of isooctyl acrylate and acrylamide, a polyester of terephthalic acid, ethylene glycol and neopentyl glycol, or a mixture of a polyterpene polymer containing wood resin and natural rubber.

公开(公告)号：US20190157485A1

公开(公告)日：2019-05-23

申请号：US16204257

申请日：2018-11-29

Applicant: The Boeing Company

Inventor： Eric M. Rehder

IPC: H01L31/05 ,  B32B37/04 ,  B32B38/00 ,  C09J5/00 ,  B32B15/01 ,  B32B7/12 ,  B32B15/16 ,  B32B37/12 ,  H01L31/043 ,  B32B5/16 ,  B32B15/04 ,  B32B7/04

CPC classification number: H01L31/0512 ,  B32B5/16 ,  B32B7/04 ,  B32B7/12 ,  B32B15/01 ,  B32B15/018 ,  B32B15/043 ,  B32B15/16 ,  B32B37/04 ,  B32B37/12 ,  B32B38/0036 ,  B32B2037/1269 ,  B32B2305/30 ,  B32B2307/202 ,  B32B2457/00 ,  C09J5/00 ,  C09J2201/602 ,  C09J2203/326 ,  C22C5/02 ,  H01L31/043 ,  Y02E10/50

Abstract: An anisotropic conducting adhesive is improved in conductivity without increasing the density of admixed conductive particles by inducing metallic fusion between the surfaces of the conducting particles and the surfaces being bonded. The metallic fusion may be promoted by physical/chemical interaction characteristic of certain materials at a compressed interface; by compression sufficient to deform the conductive particles in a manner that increases the mechanical contact area; by heating (with or without melting of a material), which may also serve to cure the adhesive matrix; or by acoustic vibration, e.g., ultrasonic vibration. The resulting metallic-fusion joint is stronger, as well as more conductive, than a joint in which the particles and surfaces are held in unfused mechanical contact.

公开(公告)号：US20190040286A1

公开(公告)日：2019-02-07

申请号：US15831548

申请日：2017-12-05

Applicant: HO SEUP MOON ,  Truss Co., Ltd.

Inventor： HO SEUP MOON

IPC: C09J9/02 ,  C09J201/00 ,  C08K3/08

CPC classification number: C09J9/02 ,  C08J2300/26 ,  C08K3/08 ,  C08K2003/0812 ,  C08K2003/085 ,  C08K2003/0862 ,  C08K2003/0887 ,  C08K2201/003 ,  C09J7/28 ,  C09J7/38 ,  C09J11/04 ,  C09J201/00 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2400/16 ,  C09J2400/163 ,  C09J2467/006

Abstract: Provided are a conductive adhesive tape including a compressible conductive powder, which is manufactured by applying a conductive adhesive prepared by mixing a conductive powder having a conductive metal-coated outer surface and an adhesive resin at a certain ratio on one surface or both surfaces of a conductive substrate and is easily and evenly attached to an attachment surface by preventing a protrusion phenomenon through deformable characteristics with respect to pressing, and a manufacturing method thereof.

公开(公告)号：US20180277505A1

公开(公告)日：2018-09-27

申请号：US15571241

申请日：2016-05-27

Applicant: DEXERIALS CORPORATION

Inventor： Shinichi HAYASHI ,  Masao SAITO ,  Yasushi AKUTSU ,  Reiji TSUKAO

IPC: H01L23/00 ,  C09J9/02 ,  C09J7/10

CPC classification number: H01L24/29 ,  C08K3/36 ,  C08K2201/001 ,  C09J7/10 ,  C09J9/02 ,  C09J163/00 ,  C09J2201/28 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  C09J2471/00 ,  H01L2224/29076 ,  H01L2224/29291 ,  H01L2224/293

Abstract: An anisotropic conductive film includes an insulating adhesive layer and conductive particles disposed thereon. Arrangement axes of the conductive particles having a particle pitch extend in a widthwise direction of the film, and the axes are sequentially arranged with an axis pitch in a lengthwise direction of the film. The particle pitch, axis pitch of the axes, and an angle θ of the axes relative the widthwise direction of the film are determined according to external shapes of terminals so 3 to 40 conductive particles are present on each terminal when a terminal arrangement region of an electronic component is superimposed on the film so a lengthwise direction of each terminal is aligned with the widthwise direction of the film. By using the film, stable connection reliability is obtained and an excessive increase in the density of the conductive particles is suppressed even in the connection of fine pitches.