Abstract:
It is facilitated in a scanning electron microscope to save the labor of executing the reproduction test, conduct basic analysis on a problem caused in execution of the automatic observation process, and confirm details resulting in the error. Upon detecting an error from an abnormality, the scanning electron microscope extracts a sample image lm(t2) obtained by retroceding from a sample image lm(te) stored so as to be associated with time te of error occurrence by a predetermined video quantity (for example, total recording time period t2) previously set and registered by an input-output device, from sample images stored in a recording device while being overwritten, and stores a resultant sample image in another recording device.
Abstract:
The present invention provides an electron microscope device 1, comprising a scanning electron microscope 2 and an optical microscope 3, wherein the scanning electron microscope has scanning means 10 for scanning an electron beam and an electron detector 12 for detecting electrons issued from a specimen 8 scanned by the electron beam, and the scanning electron microscope acquires a scanning electron image based on a detection result from the electron detector, wherein the optical microscope projects an illumination light to the specimen, receives a reflection light from the specimen and acquires an optical image, and wherein an optical axis 7 of the scanning electron microscope crosses an optical axis 6 of the optical microscope at a point of observation of the specimen, wherein the scanning means projects the electron beam for scanning with a scanning width wider than a width of a scanning area, the optical microscope projects an illumination light and acquires an optical image in an overrunning portion where the electron beam is projected beyond the scanning area, and the scanning electron microscope acquires a scanning electron image based on electrons issued when the electron beam scans over the scanning area.
Abstract:
An imaging region of a high-magnification reference image capable of being acquired in a low-magnification field without moving a stage from a position at which a defective region has been imaged at a low magnification is searched for and if the search is successful, an image of the imaging region itself is acquired and the high-magnification reference image is acquired. If the search is unsuccessful, the imaging scheme is switched to that in which the high-magnification reference image is acquired from a chip adjacent to the defective region.
Abstract:
A fine pattern, such as a semiconductor integrated circuit (LSI), a liquid crystal panel, and a photomask (reticle) for the semiconductor or the liquid crystal panel, which are fabricated based on data for fabricating the fine pattern such as design data is inspected by a pattern inspection apparatus. The pattern inspection apparatus for inspecting a pattern to-be-inspected uses an image of the pattern to-be-inspected and data for fabricating the pattern to-be-inspected. The pattern inspection apparatus includes a reference pattern generation device configured to generate a reference pattern represented by one or more lines from the data, an image generation device configured to generate the image of the pattern to-be-inspected, a detecting device configured to detect an edge of the image of the pattern to-be-inspected, and an inspection device configured to inspect the pattern to-be-inspected by comparing edges of the image of the pattern to-be-inspected with the one or more lines of the reference pattern.
Abstract:
A pattern measurement apparatus includes a beam intensity distribution creation unit to scan a charged particle beam over a reference pattern having edge portions formed at a right angle to create a line profile of the reference pattern and thus create a reference-beam intensity distribution, an edge width detection unit to determine line profiles for pattern models including edges formed at various inclination angles by use of the reference-beam intensity distribution and calculate edge widths reflecting an influence of a width of a reference beam, and a correspondence table creation unit to calculate correction values for edge positions from the calculated edge widths and the pattern models and create a correspondence table in which the edge widths and the correction values are associated with one another.
Abstract:
In a method of scanning a charged particle beam which can position the scan position to a proper location inside a deflectable range of the scan position of charged particle beam, the scan position of charged particle beam is deflected to a plurality of target objects inside a scan position deflectable region and on the basis of a shift of a target object at a scan location after deflection, the deflection amount at the scan location is corrected.
Abstract:
A charged particle beam apparatus that can achieve both high defect-detection sensitivity and high inspection speed for a sample with various properties in a multi-beam type semiconductor inspection apparatus. The allocation of the primary beam on the sample is made changeable, and furthermore, the beam allocation for performing the inspection at the optimum inspection specifications and at high speed is selected based on the property of the sample. In addition, many optical parameters and apparatus parameters are optimized. Furthermore, the properties of the selected primary beam are measured and adjusted.
Abstract:
An object of the present invention is to provide a method that can properly carry out the evaluation of a displacement and an overlapping area between first and second patterns formed through double patterning and a device therefor.To accomplish the above object, a method and a device are provided that execute a two-step matching between combined information having information concerning the first pattern combined with design information of the second pattern formed through a second exposure of double patterning and images displaying the first and second patterns, and on the basis of a moving amount of the design information of the second pattern, a displacement amount between the first and second patterns is determined.
Abstract:
The present invention provides a charged particle beam apparatus used to measure micro-dimensions (CD value) of a semiconductor apparatus or the like which captures images for measurement. For the present invention, a sample for calibration, on which a plurality of polyhedral structural objects with known angles on surfaces produced by the crystal anisotropic etching technology are arranged in a viewing field, is used. A beam landing angle at each position within a viewing field is calculated based on geometric deformation on an image of each polyhedral structural object. Beam control parameters for equalizing the beam landing angle at each position within the viewing field are pre-registered. The registered beam control parameters are applied according to the position of the pattern to be measured within the viewing field when performing dimensional measurement. Accordingly, the present invention provides methods for reducing the variation in the CD value caused by the variation in the electron beam landing angle with respect to the sample with an equal beam landing angle and methods for reducing the instrumental error caused by the difference in the electron beam landing angle between apparatuses.
Abstract:
Provided is a charged particle beam device wherein a secondary signal generated from an alignment pattern having known coordinate values in a sample coordinate system is detected, and a positional deviation quantity between the coordinate system of a sample (10) and the coordinate system of a stage (21) is calculated so as to generate coordinate correction data. At the time of observing a sample image, the secondary signal generated from the alignment pattern is detected at least once so as to perform realignment, and the coordinate correction data is updated. Thus, the charged particle beam device performs long-time inspection at a high observation magnification by accurately correcting the sample coordinate information obtained by temperature change, while suppressing device cost increase and throughput deterioration.