公开(公告)号：US10076028B2

公开(公告)日：2018-09-11

申请号：US15544961

申请日：2016-01-19

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD. ,  SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.

Inventor： Takashi Kasuga ,  Yoshio Oka ,  Shigeaki Uemura ,  Jinjoo Park ,  Hiroshi Ueda ,  Kousuke Miura

IPC: H05K1/09 ,  H05K1/02 ,  H05K3/42 ,  C23C28/02 ,  H05K3/18 ,  H05K3/06 ,  H05K3/10 ,  H05K3/12 ,  H05K3/40 ,  H05K3/02

CPC classification number: H05K1/0298 ,  C23C28/023 ,  H05K1/09 ,  H05K1/097 ,  H05K3/025 ,  H05K3/064 ,  H05K3/108 ,  H05K3/1283 ,  H05K3/188 ,  H05K3/245 ,  H05K3/381 ,  H05K3/4038 ,  H05K3/424 ,  H05K2201/0116 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2203/072 ,  H05K2203/095 ,  H05K2203/1131

Abstract: A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having insulating properties and a sintered layer formed of a plurality of metal particles, the sintered layer being stacked on at least one surface of the base film, in which a region of the sintered layer extending from an interface between the sintered layer and the base film to a position 500 nm or less from the interface has a porosity of 1% or more and 50% or less.

公开(公告)号：US20180187035A1

公开(公告)日：2018-07-05

申请号：US15740514

申请日：2016-06-30

Applicant: NATIONAL RESEARCH COUNCIL OF CANADA

Inventor： Ta-Ya CHU ,  Zhiyi ZHANG ,  Ye TAO

IPC: C09D11/52 ,  C09D11/037 ,  C09D11/033 ,  C09D11/322 ,  C09D11/36 ,  H01L21/288

CPC classification number: C09D11/52 ,  C09D11/033 ,  C09D11/037 ,  C09D11/322 ,  C09D11/36 ,  H01L21/288 ,  H05K3/1208 ,  H05K3/1241 ,  H05K3/125 ,  H05K2201/0145

Abstract: Disclosed is a method of printing an ultranarrow line of a functional material. The method entails providing a substrate having an interlayer on the substrate and printing the ultranarrow line by depositing ink on the interlayer of the substrate, the ink comprising the functional material and a solvent mixture that partially dissolves the interlayer on the substrate to cause the ink to shrink and sink into the interlayer on the substrate thereby reducing a width of the line.

公开(公告)号：US20180143740A1

公开(公告)日：2018-05-24

申请号：US15598786

申请日：2017-05-18

Applicant: Interface Technology (ChengDu) Co., Ltd. ,  Interface Optoelectronics (ShenZhen) Co., Ltd. ,  General Interface Solution Limited

Inventor： Chun-Jen CHEN ,  Nan-Tsun Kuo ,  Chia-Ming Hsieh ,  Tzu-Hsiang Lin

IPC: G06F3/0481 ,  H05K1/02 ,  H05K1/03

CPC classification number: H05K1/0353 ,  G02B5/00 ,  H05K1/0274 ,  H05K2201/0145 ,  H05K2201/0154

Abstract: A cover window is provided and includes a substrate and a coating layer. The substrate has a thickness of 60 to 120 μm. The substrate has a Re of 6000 to 12000. The coating layer is coated on the substrate. The cover window has a first direction and a second direction. The first direction is a machine direction of the cover window. The second direction is perpendicular to the first direction. A tensile stress of 50 to 130 MPa is exerted in the first direction. A tensile stress of 140 to 300 MPa is exerted in the second direction. Since the substrate has a Re of 6000 to 12000, a penetrating ray of an incident ray is uniformly distributed on a visible region of the cover window, so as to reduce the phase difference between reflected rays, reduce rainbow patterns, and enhance visibility under a polarizer.

公开(公告)号：US20180134025A1

公开(公告)日：2018-05-17

申请号：US15567748

申请日：2016-04-20

Applicant: KURARAY CO., LTD.

Inventor： Takahiro NAKASHIMA ,  Takeshi TAKAHASHI ,  Minoru ONODERA

IPC: B32B38/00 ,  B32B3/26 ,  B32B15/09 ,  H05K1/03 ,  H05K3/46 ,  H05K3/38

CPC classification number: B32B38/0036 ,  B29C65/02 ,  B32B3/263 ,  B32B15/08 ,  B32B15/09 ,  B32B37/10 ,  B32B37/182 ,  B32B2457/08 ,  H05K1/0353 ,  H05K3/38 ,  H05K3/381 ,  H05K3/4611 ,  H05K2201/0141 ,  H05K2201/0145

Abstract: A method for manufacturing a metal-clad laminate sheet including forming a laminate sheet having the thermoplastic liquid crystal polymer film and the metal foil bonded together; and providing the laminate sheet with a heat treatment which satisfies conditions (1) and (2) below: (1) a heat treatment temperature ranges between 1° C. inclusive and 50° C. exclusive higher than a melting point of the thermoplastic liquid crystal polymer film. (2) a time for the heat treatment ranges from one second to 10 minutes.

公开(公告)号：US09955571B2

公开(公告)日：2018-04-24

申请号：US15700433

申请日：2017-09-11

Applicant: Honeywell Federal Manufacturing & Technologies, LLC

Inventor： Jonathan Douglas Hatch ,  Stephen McGarry Hatch

IPC: H05K1/03 ,  H05K3/00 ,  H05K1/14 ,  H05K3/46 ,  H05K1/02 ,  H05K1/11 ,  H05K3/12 ,  H05K3/38 ,  H05K3/10

CPC classification number: H05K1/0306 ,  H05K1/02 ,  H05K1/028 ,  H05K1/0393 ,  H05K1/115 ,  H05K1/144 ,  H05K3/0023 ,  H05K3/0064 ,  H05K3/007 ,  H05K3/048 ,  H05K3/103 ,  H05K3/125 ,  H05K3/386 ,  H05K3/389 ,  H05K3/4611 ,  H05K3/4644 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/05 ,  H05K2201/09009 ,  H05K2203/0152

Abstract: A PCB page blank includes a flexible substrate, a curable adhesive, a conductive layer, and a conductive layer support. The flexible substrate receives an opaque negative circuit pattern thereon. Portions of the curable adhesive not obscured by the circuit pattern may bond to portions of the conductive layer when exposed to light. The bonded portions of the conductive layer shear or tear from non-bonded portions of the conductive layer such that the bonded portions remain with the flexible substrate and the non-bonded portions remain with the conductive layer support when the flexible substrate and the conductive layer support are separated. The flexible substrate and the bonded portions of the conductive layer thus form a PCB prototype with the bonded portions of the conductive layer forming circuit traces of the circuit pattern.

公开(公告)号：US20180090035A1

公开(公告)日：2018-03-29

申请号：US15710565

申请日：2017-09-20

Applicant: STANLEY ELECTRIC CO., LTD.

Inventor： Akihiko HANYA ,  Kosaburo ITO ,  Yoshiyuki ABE

IPC: G09F7/00 ,  F21V33/00 ,  E04D13/10

CPC classification number: G09F7/002 ,  B60S1/026 ,  E04D13/103 ,  F21V33/00 ,  H05K1/0306 ,  H05K1/167 ,  H05K2201/0108 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/10106

Abstract: A thin light-transmitting substrate showing high thermal conduction efficiency, and having a function of raising surface temperature thereof is provided.The light-transmitting substrate of the present invention comprises a substrate that transmits at least a light of a predetermined wavelength, and a conductor pattern that is disposed on the substrate, and generates heat to raise temperature of the surface of the substrate when it is supplied with an electric current. The conductor pattern is directly disposed on the substrate without any adhesive layer.

公开(公告)号：US09900992B1

公开(公告)日：2018-02-20

申请号：US15401143

申请日：2017-01-09

Applicant: AUTOMATED ASSEMBLY CORPORATION

Inventor： Robert Neuman

IPC: H01L33/62 ,  H05K3/32

CPC classification number: H05K3/32 ,  H01L21/4846 ,  H01L21/4853 ,  H01L21/56 ,  H01L21/563 ,  H01L23/3135 ,  H01L23/3157 ,  H01L23/4985 ,  H01L23/49883 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/45147 ,  H01L2224/48106 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8385 ,  H01L2224/85201 ,  H01L2224/85423 ,  H01L2224/85447 ,  H01L2224/85801 ,  H01L2224/92147 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/1205 ,  H01L2924/1207 ,  H01L2924/1421 ,  H01L2933/005 ,  H01L2933/0066 ,  H05K1/189 ,  H05K3/284 ,  H05K3/321 ,  H05K3/3426 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2203/049 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48247

Abstract: A disclosed circuit arrangement includes adhesive transfer tape having a layer of pressure sensitive adhesive (PSA) having a first major surface and a second major surface opposite the first major surface. One or more metal foil pads are attached directly to the second major surface of the layer of PSA. Electrically conductive round wire is attached directly to the second major surface of the layer of PSA. The wire has a round cross-section and one or more portions directly connected to the one or more metal foil pads with one or more weld joints, respectively. An electronic device is attached directly to the second major surface of the layer of PSA and is electrically connected to the one or more portions of the round wire by one or more bond wires, respectively.

公开(公告)号：US09896566B2

公开(公告)日：2018-02-20

申请号：US14753055

申请日：2015-06-29

Applicant: Ticona LLC

Inventor： Paul C. Yung ,  Michael Schaefer

IPC: C08K3/10 ,  C08K3/34 ,  C08K7/10 ,  H05K1/03 ,  C08K3/32 ,  C08K3/40 ,  C08K3/30 ,  H05K1/16 ,  H05K3/10 ,  H05K3/18

CPC classification number: C08K3/10 ,  C08G63/605 ,  C08K3/22 ,  C08K3/30 ,  C08K3/32 ,  C08K3/34 ,  C08K3/40 ,  C08K7/10 ,  C08K2003/2248 ,  C08K2003/2251 ,  C08K2003/3045 ,  C08K2003/325 ,  C08K2201/005 ,  C08L67/03 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/165 ,  H05K3/105 ,  H05K3/106 ,  H05K3/185 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/0236 ,  H05K2201/0266 ,  H05K2201/10098 ,  H05K2203/107 ,  C08L67/00

Abstract: A polymer composition that comprises an aromatic polyester, a laser activatable additive, and a mineral filler is provided. The mineral filler has a median size of about 35 micrometers or less and the laser activatable additive has a mean size of about 1000 nanometers or less.

公开(公告)号：US20170347448A1

公开(公告)日：2017-11-30

申请号：US15676519

申请日：2017-08-14

Applicant: Intel Corporation

Inventor： Christopher Jezewski ,  Ravi Pillarisetty ,  Brian Doyle

IPC: H05K1/03 ,  D03D11/02 ,  D03D15/00 ,  H05K3/00 ,  H05K3/10 ,  H05K3/32 ,  D03D1/00 ,  H05K3/28 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/038 ,  D03D1/0088 ,  D03D11/02 ,  D03D15/00 ,  H05K1/028 ,  H05K1/0393 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/10 ,  H05K3/28 ,  H05K3/284 ,  H05K3/32 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/029

Abstract: A system comprises an article comprising one or more fabric layers, a. plurality of electronic devices, each being incorporated into or onto one of the one or more fabric layers, and one or more communication links between two or more of the plurality of electronic devices. Each of the plurality of electronic devices can comprise a flexible substrate coupled to the fabric layer, one or more metallization layers deposited on the flexible substrate, and one or more electronic components electrically coupled to the one or more metallization layers.

公开(公告)号：US20170295645A1

公开(公告)日：2017-10-12

申请号：US15507807

申请日：2015-08-24

Applicant: HIROSHIMA UNIVERSITY ,  TEIJIN FILM SOLUTIONS LIMITED

Inventor： Masamichi HIKOSAKA ,  Kiyoka OKADA ,  Yoshitaka TANAKA

IPC: H05K1/03 ,  H05K3/00 ,  C08J5/18 ,  B29C47/00 ,  B29C47/88

CPC classification number: H05K1/0393 ,  B29C48/08 ,  B29C48/88 ,  B29C48/914 ,  B29D7/00 ,  B29K2067/003 ,  B29K2995/0016 ,  B29L2031/3425 ,  B32B27/06 ,  B32B27/36 ,  B32B2307/30 ,  B32B2307/306 ,  B32B2307/514 ,  B32B2307/704 ,  B32B2307/72 ,  B32B2367/00 ,  B32B2457/08 ,  C08G63/02 ,  C08G63/12 ,  C08G63/16 ,  C08G63/18 ,  C08G63/181 ,  C08G63/183 ,  C08G63/185 ,  C08G63/187 ,  C08G63/189 ,  C08J5/18 ,  C08J2367/02 ,  C08L67/00 ,  C08L67/02 ,  C08L67/03 ,  H05K1/03 ,  H05K1/0326 ,  H05K3/0014 ,  H05K2201/0145 ,  Y10T428/31681 ,  Y10T428/31786

Abstract: The polyester sheet in accordance with an aspect of the present invention contains crystals of polyester which is a polycondensate of polyvalent carboxylic acid and polyalcohol. The polyester sheet contains nano-oriented crystals which contain crystals of polyester in each of which a polymer chain is highly oriented and each of which has a crystal size of 50 nm or less. A heatproof temperature of the polyester sheet is higher than a temperature that is lower than an equilibrium melting point of the polyester by 80° C., and a melting point of the polyester sheet is higher than a temperature that is lower than the equilibrium melting point of the polyester by 40° C.