公开(公告)号：US09392689B2

公开(公告)日：2016-07-12

申请号：US13881059

申请日：2011-10-25

Applicant: Yoshihisa Yamamoto ,  Hiroyuki Yoshimoto ,  Hideto Nakagawa

Inventor： Yoshihisa Yamamoto ,  Hiroyuki Yoshimoto ,  Hideto Nakagawa

IPC: B32B7/00 ,  H05K1/03 ,  H05K3/38 ,  B32B15/092 ,  B32B37/14 ,  C08L63/00 ,  B32B38/10

CPC classification number: H05K1/0393 ,  B32B15/092 ,  B32B37/14 ,  B32B38/10 ,  B32B2270/00 ,  B32B2457/08 ,  C08L63/00 ,  H05K3/386 ,  H05K2201/015 ,  H05K2201/0154 ,  Y10T156/10 ,  Y10T428/31522 ,  Y10T428/31529 ,  C08L27/18

Abstract: A metal-clad laminate, including metal foil, and a first resin layer arranged on the metal foil, the first resin layer including an epoxy resin and a fluoropolymer with a curable functional group. Also disclosed is a method of producing the metal-clad laminate.

Abstract translation: 包括金属箔的覆金属层压板和布置在金属箔上的第一树脂层，第一树脂层包括环氧树脂和具有可固化官能团的含氟聚合物。 还公开了制造覆金属层压板的方法。

公开(公告)号：US20160192490A1

公开(公告)日：2016-06-30

申请号：US14966518

申请日：2015-12-11

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Myung-Sam KANG ,  Young-Gwan KO ,  Sang-Hoon KIM ,  Kang-Wook BONG ,  Hye-Won JUNG ,  Yong-Wan JI

IPC: H05K1/11 ,  H05K3/42 ,  H05K1/03

CPC classification number: H05K1/115 ,  H05K1/0326 ,  H05K1/0346 ,  H05K3/0023 ,  H05K3/426 ,  H05K3/428 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2203/1476

Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes an insulating layer including a first resin layer and a second resin layer, circuit layers disposed on upper and lower surfaces of the insulating layer, and a via configured to connect the circuit layer formed on the upper surface to the circuit layer formed on the lower surface, and the second resin layer extends from an upper surface of the first resin layer to a lower surface of the first resin layer by passing through the first resin layer as to contact a side surface of the via.

Abstract translation: 提供一种印刷电路板及其制造方法。 印刷电路板包括绝缘层，其包括第一树脂层和第二树脂层，设置在绝缘层的上表面和下表面上的电路层，以及通孔，被配置为将形成在上表面上的电路层连接到电路层 形成在下表面上，第二树脂层通过第一树脂层从第一树脂层的上表面延伸到第一树脂层的下表面，以接触通孔的侧表面。

公开(公告)号：US20160183385A1

公开(公告)日：2016-06-23

申请号：US15057934

申请日：2016-03-01

Applicant: KANEKA CORPORATION

Inventor： Takashi KIKUCHI ,  Yasutaka Kondo

IPC: H05K3/38 ,  H05K3/18 ,  H05K3/06 ,  H05K3/14

CPC classification number: H05K3/386 ,  B32B7/12 ,  B32B15/08 ,  B32B15/18 ,  B32B15/20 ,  B32B27/08 ,  B32B27/20 ,  B32B27/281 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2255/26 ,  B32B2307/306 ,  B32B2307/546 ,  B32B2307/704 ,  B32B2307/7265 ,  B32B2457/08 ,  C08G73/1046 ,  C08G73/105 ,  C08G73/1067 ,  C08G73/1071 ,  C09J7/25 ,  C09J179/08 ,  C09J2201/622 ,  C09J2479/08 ,  C09J2479/086 ,  H05K1/0346 ,  H05K1/036 ,  H05K1/0393 ,  H05K3/06 ,  H05K3/146 ,  H05K3/18 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0355 ,  Y10T428/2896

Abstract: A film and a flexible metal-clad laminate obtained with the film. The laminate is improved in post-moisture absorption solderability. The film comprises a heat-resistant polyimide film and, disposed on at least one side thereof, an adhesive layer containing a thermoplastic polyimide. It is characterized in that the thermoplastic polyimide contained in the adhesive layer has crystallinity and that the film, when analyzed with a differential scanning calorimeter, has an endothermic peak attributable to the melting of the crystalline thermoplastic polyimide, the absolute value of the area of the peak being 4.0 mJ/mg or larger. The flexible metal-clad laminate is characterized by comprising the film and a metal layer disposed thereon.

Abstract translation: 用该膜获得的薄膜和柔性覆金属层压板。 后吸湿可焊性提高了层压板。 该膜包括耐热聚酰亚胺膜，并且在其至少一个侧面上设置含有热塑性聚酰亚胺的粘合剂层。 其特征在于，粘合剂层中所含的热塑性聚酰亚胺具有结晶性，并且当用差示扫描量热计分析时，该膜具有归因于结晶性热塑性聚酰亚胺熔融的吸热峰，该面积的绝对值 峰值为4.0mJ / mg以上。 柔性覆金属层压板的特征在于包括膜和设置在其上的金属层。

公开(公告)号：US20160135285A1

公开(公告)日：2016-05-12

申请号：US14897214

申请日：2014-04-30

Applicant: AMOGREENTECH CO., LTD.

Inventor： Jongsoo Kim ,  Jeong-Sang Yu ,  O-Chung Kwon ,  Jae-Sic Kim

IPC: H05K1/02 ,  H05K3/10 ,  H05K3/46 ,  H05K3/00 ,  H05K1/11 ,  H05K1/09

CPC classification number: H05K3/361 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/092 ,  H05K1/115 ,  H05K3/0011 ,  H05K3/10 ,  H05K3/285 ,  H05K3/46 ,  H05K3/4664 ,  H05K3/4676 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0317 ,  H05K2203/0759

Abstract: A flexible printed circuit board includes a substrate, a circuit pattern formed on the substrate, and a protective coating layer formed on the substrate by applying and curing a coating solution to cover and protect the circuit pattern. A method for manufacturing forming a circuit pattern on a substrate and forming a protective coating layer for covering and protecting the circuit pattern by applying a coating solution on the substrate. The circuit pattern may be securely attached to the substrate, and damage and deformation of the circuit pattern due to repeated bending or warping of the substrate may be prevented, ultimately improving operational reliability.

Abstract translation: 柔性印刷电路板包括基板，形成在基板上的电路图案，以及通过施加和固化涂覆溶液来覆盖和保护电路图案而在基板上形成的保护涂层。 一种在衬底上形成电路图案的方法，并且通过在衬底上施加涂布溶液形成用于覆盖和保护电路图案的保护涂层。 电路图案可以牢固地附接到基板，并且可以防止由于基板的反复弯曲或翘曲引起的电路图案的损坏和变形，最终提高了操作可靠性。

公开(公告)号：US20160115277A1

公开(公告)日：2016-04-28

申请号：US14565420

申请日：2014-12-10

Applicant: TAIFLEX Scientific Co., Ltd.

Inventor： Yi-Kai Fang ,  Tsung-Tai Hung ,  Chiao-Pei Chen ,  Chiu-Feng Chen ,  Ching-Hung Huang

IPC: C08G73/10 ,  H05K1/03

CPC classification number: H05K1/0313 ,  C08G73/1028 ,  C08G73/1042 ,  C08G73/105 ,  C08G73/1078 ,  C09D179/08 ,  H05K1/028 ,  H05K1/0346 ,  H05K1/09 ,  H05K2201/0154 ,  H05K2201/068

Abstract: A polyimide polymer represented by the following formula 1 is provided. In formula 1, Ar is Ar′ is A is and 0

Abstract translation: 提供由下式1表示的聚酰亚胺聚合物。 在式1中，Ar为Ar'为A且0

公开(公告)号：US09313898B2

公开(公告)日：2016-04-12

申请号：US12275458

申请日：2008-11-21

Applicant: Manfred Mengel ,  Joachim Mahler

Inventor： Manfred Mengel ,  Joachim Mahler

IPC: C09K19/00 ,  H05K3/28 ,  C08G73/10 ,  C09D179/08

CPC classification number: H05K3/285 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/105 ,  C08G73/1064 ,  C08G73/1071 ,  C09D179/08 ,  H05K2201/0154 ,  H05K2203/013 ,  Y10T428/1005 ,  Y10T428/1023

Abstract: An electrical component that includes a substrate and a polymeric layer oriented in working relation with the substrate, the polymeric layer including a low molecular mass polyimide.

Abstract translation: 一种电气部件，其包括基材和与所述基材工作的取向的聚合物层，所述聚合物层包括低分子量聚酰亚胺。

公开(公告)号：US20160095208A1

公开(公告)日：2016-03-31

申请号：US14498230

申请日：2014-09-26

Applicant: QUALCOMM Incorporated

Inventor： Daeik Daniel Kim ,  Je-Hsiung Jeffrey Lan ,  Changhan Hobie Yun ,  Mario Francisco Velez ,  Chengjie Zuo ,  Jonghae Kim ,  David Francis Berdy

IPC: H05K1/02 ,  H01L21/768 ,  H05K1/09 ,  C23F1/02 ,  H05K1/03

CPC classification number: H05K1/0271 ,  C23F1/02 ,  H01L21/768 ,  H01L23/562 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/09 ,  H05K2201/0154 ,  H05K2201/0195 ,  H01L2924/00

Abstract: A device includes a stress relief region between at least two stress domains of a substrate (e.g., of a semiconductor die or other integrated circuit). The stress relief region includes a conductive structure electrically coupling circuitries of the stress domains between which the conductive structure is disposed.

Abstract translation: 器件包括在衬底（例如，半导体管芯或其他集成电路）的至少两个应力结构域之间的应力消除区域。 应力消除区域包括导电结构，电耦合应力区域的电路，导电结构设置在该应力区域之间。

公开(公告)号：US20160085000A1

公开(公告)日：2016-03-24

申请号：US14492449

申请日：2014-09-22

Applicant: The Chinese University of Hong Kong

Inventor： Shih-Chi Chen ,  Ni Zhao ,  Huihua Xu ,  Xi Zhou

IPC: G02B5/18 ,  H05K1/02 ,  C23F1/00

CPC classification number: G02B5/1857 ,  B81C1/00031 ,  B81C1/00388 ,  C23C22/02 ,  C23F1/00 ,  C23F1/02 ,  C23F1/14 ,  C23F1/44 ,  H05K1/028 ,  H05K1/0296 ,  H05K1/118 ,  H05K3/061 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2203/122

Abstract: A process for positive microcontact printing, including inking a patterned mold with a thiol; contacting the mold with a metal surface of a substrate; backfilling the metal surface with a solution containing an aromatic amine to form a backfilling layer; etching the metal surface of the substrate; and rinsing the substrate to remove the backfilling layer.

Abstract translation: 一种用于正极微接触印刷的方法，包括用硫醇着墨图案化的模具; 使模具与衬底的金属表面接触; 用含有芳香胺的溶液回填金属表面以形成回填层; 蚀刻衬底的金属表面; 并冲洗底物以除去回填层。

公开(公告)号：US20160037651A1

公开(公告)日：2016-02-04

申请号：US14783136

申请日：2014-04-10

Applicant: SEIREN CO., LTD.

Inventor： Takashi UESUGI ,  Kazuhisa TSUJIMOTO

IPC: H05K3/18 ,  H05K3/00 ,  C23C18/30 ,  C23C18/16 ,  C23C18/20

CPC classification number: H05K3/182 ,  C23C18/1608 ,  C23C18/1653 ,  C23C18/208 ,  C23C18/30 ,  H05K1/0284 ,  H05K3/0014 ,  H05K2201/0154

Abstract: [Problem] To provide: a material which is for three-dimensional molding and on which a conductive pattern that exhibits excellent adhesiveness even after the three-dimensional molding can be formed; and a process for producing a three-dimensional conductive pattern structure, said process using this material for three-dimensional molding and necessitating no special apparatus. [Solution] This three-dimensional conductive pattern structure is produced by: using a material which is for three-dimensional molding and which has, in at least a part thereof, a surface made of a polyimide resin; conducting, in a surface portion (1) made of a polyimide resin, the formation of a modified pattern and then the adsorption and reduction of metal ions to form a material which is provided with a pattern (2) having a plating-catalyzing activity; and subjecting the material which is provided with the pattern (2) to three-dimensional molding and electroless plating successively.

Abstract translation: [问题]提供一种三维成型用材料，即使在三维成型后也能够表现出优异的粘合性的导电图案; 以及制造三维导电图案结构的方法，所述方法使用该材料进行三维成型，不需要特殊的装置。 [解决方案]该三维导电图案结构通过以下方式制造：使用用于三维成型的材料，其至少一部分具有由聚酰亚胺树脂制成的表面; 在由聚酰亚胺树脂制成的表面部分（1）中形成改性图案，然后吸附和还原金属离子以形成具有电镀催化活性的图案（2）的材料; 并对设置有图案（2）的材料进行三维成型和无电镀。

公开(公告)号：US20160037632A1

公开(公告)日：2016-02-04

申请号：US14775576

申请日：2014-03-06

Applicant: DIC Corporation

Inventor： Akira MURAKAWA ,  Jun SHIRAKAMI ,  Wataru FUJIKAWA ,  Yukie SAITOU

IPC: H05K1/03 ,  H05K1/02 ,  H05K1/09 ,  H05K3/18

CPC classification number: H05K1/092 ,  B32B7/02 ,  B32B27/00 ,  G06K19/07722 ,  H05K1/0298 ,  H05K1/0346 ,  H05K3/1208 ,  H05K3/1283 ,  H05K3/181 ,  H05K3/246 ,  H05K3/386 ,  H05K2201/0154

Abstract: Provided is a laminate in which at least a layer including a support, a primer layer, a first conductive layer, an insulating layer, and a second conductive layer are laminated, wherein the insulating layer is formed by coating at least a portion of or entirety of a surface of the first conductive layer with a resin composition and drying the resin composition; and the second conductive layer includes a second plating seed layer formed by coating a portion of or entirety of a surface of the insulating layer with a fluid containing a conductive substance, and a second plating layer formed on a surface of the second plating seed layer. This laminate has high adhesion between layers and allows the high adhesion to be maintained even upon exposure to a high-temperature and high-humidity environment.

Abstract translation: 本发明提供一种层叠体，其中层叠至少一层包含载体，底漆层，第一导电层，绝缘层和第二导电层的层，其中绝缘层通过涂覆至少一部分或全部 的第一导电层的表面用树脂组合物干燥树脂组合物; 并且第二导电层包括通过用含有导电物质的流体涂覆绝缘层的表面的一部分或整体而形成的第二电镀种子层，以及形成在第二镀覆种子层的表面上的第二镀层。 该层压板在层间具有高粘合性，并且即使在暴露于高温高湿环境下也能够保持高粘合性。