公开(公告)号：US5328811A

公开(公告)日：1994-07-12

申请号：US903396

申请日：1992-06-24

Applicant: Mordechai Brestel

Inventor： Mordechai Brestel

IPC: C23C18/14 ,  B41M5/26 ,  C23F1/02 ,  G03F7/039 ,  G03F7/09 ,  H05K3/00 ,  H05K3/02 ,  H05K3/06 ,  H05K3/10 ,  G03C5/00

CPC classification number: H05K3/061 ,  B41M5/26 ,  C23F1/02 ,  G03F7/039 ,  G03F7/094 ,  H05K3/062 ,  H05K2201/0175 ,  H05K2203/0315 ,  H05K2203/0577 ,  H05K2203/0582 ,  H05K2203/0585 ,  H05K2203/107 ,  H05K2203/1105 ,  H05K2203/1157 ,  H05K2203/135 ,  H05K3/0032 ,  H05K3/027 ,  Y10S430/146 ,  Y10S430/165

Abstract: A method of printing an image on a substrate by applying to the substrate a film which is chemically activated by heat, and scanning the film by a beam of radiation according to the image to be printed, to chemically activate the film by heat and thereby to produce a pattern in the film according to the image scanned. The film includes a reagent capable of undergoing a redox reaction when heated in the presence of another reagent present with the film when scanned by the beam, to produce the redox reaction between the two reagents.

Abstract translation: 通过向基板施加通过热化学活化的薄膜并根据要印刷的图像通过辐射束扫描薄膜来将图像印刷在基板上的方法，以通过热化学活化该薄膜，由此 根据扫描的图像在电影中产生图案。 该薄膜包括当通过光束扫描时在存在于膜上的另一种试剂存在下加热时能够进行氧化还原反应的试剂，以产生两种试剂之间的氧化还原反应。

公开(公告)号：US5272600A

公开(公告)日：1993-12-21

申请号：US939228

申请日：1992-09-02

Applicant: David H. Carey

Inventor： David H. Carey

IPC: H01L23/538 ,  H01L23/64 ,  H05K1/00 ,  H05K1/11 ,  H05K1/16 ,  H05K1/14

CPC classification number: H05K1/162 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/64 ,  H01L23/642 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0289 ,  H05K1/115 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0187 ,  H05K2201/09345

Abstract: The invention relates to an electrical interconnect device with power and ground lines interwoven about signal line layers and capacitive vias between signal layers so as to make efficient use of otherwise undedicated area between signal lines and signal layers and to reduce or eliminate the need for separate power and ground layers while providing decoupling capacitance within the wiring structure.

Abstract translation: 本发明涉及一种具有电源和地线的电互连装置，其中信号线层和信号层之间的电容通孔交织在一起，以便有效地利用信号线和信号层之间的未被接合的区域，并减少或消除对分离电力的需要 和接地层，同时在布线结构内提供去耦电容。

公开(公告)号：US4747909A

公开(公告)日：1988-05-31

申请号：US853762

申请日：1986-04-18

Applicant: Kunihiko Kanazawa ,  Masaru Kazumura

Inventor： Kunihiko Kanazawa ,  Masaru Kazumura

IPC: H01L29/812 ,  H01L21/02 ,  H01L21/027 ,  H01L21/288 ,  H01L21/311 ,  H01L21/3205 ,  H01L21/338 ,  H01L21/48 ,  H05K3/00 ,  H05K3/10 ,  H05K3/38 ,  H01L21/312 ,  C25D5/02

CPC classification number: H01L28/40 ,  H01L21/0271 ,  H01L21/288 ,  H01L21/2885 ,  H01L21/31138 ,  H01L21/4846 ,  H05K3/108 ,  H05K2201/0175 ,  H05K2201/0317 ,  H05K2203/0585 ,  H05K2203/095 ,  H05K3/0041 ,  H05K3/388

Abstract: A thick resist layer is formed on a thin metal film and the resist layer is dry-etched by using an SiO.sub.2 mask formed selectively on the resist layer, and a thick wiring metal layer is formed by plating method with using the dry-etched resist layer, which has perpendicular side walls as a mask, thereby to form a low resistance and fine-patterned wiring metal layer.

Abstract translation: 在薄金属膜上形成厚的抗蚀剂层，并且通过使用在抗蚀剂层上选择性地形成的SiO 2掩模来干蚀刻抗蚀剂层，并且通过使用干蚀刻抗蚀剂层的电镀方法形成厚的布线金属层 其具有垂直侧壁作为掩模，从而形成低电阻和精细图案化的布线金属层。

公开(公告)号：US4268349A

公开(公告)日：1981-05-19

申请号：US723582

申请日：1976-09-15

Applicant: Hans-Juergen Hacke ,  Hans Hadersbeck

Inventor： Hans-Juergen Hacke ,  Hans Hadersbeck

IPC: H05K3/28 ,  H05K3/06 ,  H05K3/34 ,  H05K3/42

CPC classification number: H05K3/3452 ,  H05K3/062 ,  H05K2201/0175 ,  H05K2203/0505 ,  H05K3/3447 ,  H05K3/3473 ,  H05K3/427

Abstract: A process for the production of printed circuit boards having first zones of a wiring pattern for receiving solder and second sub-zones provided with solder rejecting properties so that they do not receive solder, characterized by galvanically applying a solderable etch-resistant metal layer on the first sub-zones of each conductive metal layer, by photo printing a mask of etch-resistant material on the second sub-zones, etching to remove the exposed portions of the conductive metal layer, removing the mask from the second sub-zones and providing the exposed second sub-zones with a solder rejecting property with the aid of passivation without impairing the solderability of the etch-resistant metal layers of the first sub-zones.

Abstract translation: 一种用于生产印刷电路板的方法，该印刷电路板具有用于接收焊料的布线图案的第一区域和具有阻焊性能的第二子区域，使得它们不接收焊料，其特征在于将可焊接耐腐蚀金属层电镀在 每个导电金属层的第一子区域，通过在第二子区域上印刷耐蚀刻材料的掩模，蚀刻以去除导电金属层的暴露部分，从第二子区域移除掩模并提供 暴露的第二子区域借助于钝化而具有阻焊性，而不损害第一子区域的耐蚀刻金属层的可焊性。

公开(公告)号：US4077851A

公开(公告)日：1978-03-07

申请号：US774482

申请日：1977-03-04

Applicant: Douglas Leon Simms ,  Peter Kenny Skurkiss ,  Clark Woody White

Inventor： Douglas Leon Simms ,  Peter Kenny Skurkiss ,  Clark Woody White

IPC: C23C22/82 ,  C25D5/02 ,  H05K3/24 ,  C23C15/00

CPC classification number: H05K3/243 ,  C23C22/82 ,  C25D5/02 ,  H05K2201/0175

Abstract: A process is described for putting down patterned chromate films on metal substrates. The procedure involves first forming a chromate film on the metal surface and then forming the patterned chromate film. The pattern is formed by sputtering the substrate through a suitable shadow mask. This procedure yields patterned chromate films with high dimensional tolerance limits. Such patterns are particularly useful in the fabrication of electronic artifacts, as for example, a mask in gold plating processes.

Abstract translation: 描述了将金属基底上的图案化铬酸盐膜放下的过程。 该方法首先在金属表面上形成铬酸盐膜，然后形成图案化的铬酸盐膜。 该图案通过用适当的荫罩溅射衬底而形成。 该过程产生具有高尺寸公差极限的图案化铬酸盐膜。 这种图案在电子伪像的制造中是特别有用的，例如镀金工艺中的掩模。

公开(公告)号：US4042450A

公开(公告)日：1977-08-16

申请号：US422925

申请日：1973-12-07

Applicant: Igor Danilovich Voitovich ,  Maxim Timofeevich Kostyshin ,  Ekaterina Vasilievna Mikhailovskaya ,  Vyacheslav Vasilievich Petrov ,  Petr Fedorovich Romanenko ,  Vladimir Petrovich Skuridin

Inventor： Igor Danilovich Voitovich ,  Maxim Timofeevich Kostyshin ,  Ekaterina Vasilievna Mikhailovskaya ,  Vyacheslav Vasilievich Petrov ,  Petr Fedorovich Romanenko ,  Vladimir Petrovich Skuridin

IPC: C23F1/02 ,  G03C1/705 ,  G03F7/004 ,  H01L21/00 ,  H01L21/314 ,  H01L49/02 ,  H05K3/06

CPC classification number: H05K3/067 ,  C23F1/02 ,  G03C1/705 ,  G03F7/0042 ,  H01L21/00 ,  H01L21/314 ,  H01L49/02 ,  H05K3/062 ,  H05K2201/0175 ,  H05K2203/1142

Abstract: A method for the production of films having the desired geometrical form (configuration) comprising depositing an electromagnetic radiation-sensitive system, which consists of a metal layer and an inorganic compound layer capable of reacting with said metal layer and forming interaction products under the effect of electromagnetic radiation, onto a film made from a material which does not react, on being irradiated, with the layer of said system that adjoins said film; subjecting said system to selective irradiation in conformity to the desired configuration, followed by carrying out the selective etching of the irradiated system so as to obtain the requisite configuration, and thereafter using said etched system as a mask for etching selectively said film in order to impart thereto the sought-for geometrical form.

Abstract translation: 一种用于生产具有所需几何形状（构型）的膜的方法，包括沉积电磁辐射敏感系统，该系统由金属层和能够与所述金属层反应形成相互作用产物的金属层和无机化合物层组成， 电磁辐射照射到与所述膜相邻的所述系统层的由不反应的材料制成的膜上; 对所述系统进行选择性照射，按照所需的结构进行选择性蚀刻，然后对所照射的系统进行选择性蚀刻，以获得必要的结构，然后使用所述蚀刻系统作为掩模以选择性地蚀刻所述膜以赋予 寻求寻求的几何形式。

公开(公告)号：US3827918A

公开(公告)日：1974-08-06

申请号：US25673572

申请日：1972-05-25

Applicant: IBM

Inventor： AMEEN T ,  MESLEY N

IPC: H01L21/60 ,  H05K3/34 ,  B44D1/18 ,  C23F7/26

CPC classification number: H01L24/81 ,  H01L2224/13111 ,  H01L2224/81801 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3452 ,  H05K2201/0175 ,  Y10T428/12396 ,  H01L2924/00

Abstract: PRINTED CIRCUIT CONDUCTORS ARE SELECTIVELY COATED WITH A CHROMATE CONVERSION FILM TO CONFINE MOLTEN SOLDER TO SELECTED AREAS DURING REFLOW AND THEREBY PREVENT WICKING METHODS OF APPLICATION ALLOW IMMERSION COATING OF THE CHROMATE, EITHER WITH OR WITHOUT SOLIDIFIED, SOLDER PRESENT IN THE SELECTIVE AREAS. WITH SOLDER PRESENT, A PASSIVATION LAYER IS FORMED ON THE SOLDER TO PREVENT CHROMATING DEPOSITION, AND WITHOUT THE PRESENCE OF SOLDER A REMOVABLE PROTECTIVE RESIST IS APPLIED TO PREVENT CHROMATING ON THE SELECTED AREAS. THE CHROMATE CONVERSION COATING WITHSTANDS SUCCESSIVE FLUX APPLICATIONS AND REHATING FOR REPETITIVE ASSEMBLY AND DISASSEMBLY OF THE SOLDER JOINTS WITHOUT ALLOWING SOLDER RUNBACK.

公开(公告)号：US3567533A

公开(公告)日：1971-03-02

申请号：US3567533D

申请日：1969-02-20

Applicant: FMC CORP

Inventor： CHIANG JOHN S C ,  MCMANAMON JOSEPH T

IPC: C23F1/00 ,  C23F1/02 ,  H05K3/06 ,  C23F17/00

CPC classification number: C23F1/02 ,  H05K3/062 ,  H05K3/067 ,  H05K2201/0175 ,  H05K2201/0305

Abstract: A METHOD OF ETCHING A METAL WORKPIECE IS DESCRIBED, WHICH CARRIES A TIN RESIST (OR A TIN-COATED SOLDER RESIST), A CHROMATE COATING IS PROVIDED OVER THE RESIST, AND THE METAL WORKPIECE IS ETCHED WITH AN AQUEOUS ETCHANT SUCH AS A PEROXYSULFATE CONTAINING PHOSPHORIC ACID OR A SODIUM CHLORITE-AMMONIUM HYDROXIDE SOLUTION OR A CHROMIC-SULFURIC ACID BATH TO DISSOLVE THE METAL FREE OF RESIST, THUS PRODUCING BRIGHT, SMOOTH AND ELECTRICALLY CLEAN RELIEFS HAVING SHARP PATTERN DEFINITION ON THE METAL WORKPIECE.

公开(公告)号：US2566666A

公开(公告)日：1951-09-04

申请号：US805448

申请日：1948-02-13

Applicant: GLOBE UNION INC

Inventor： KHOURI ALFRED S ,  WOLFF ROBERT L

IPC: H01G2/00 ,  H01R12/18 ,  H05K1/03 ,  H05K1/09 ,  H05K1/16 ,  H05K3/38

CPC classification number: H01G2/00 ,  H05K1/0306 ,  H05K1/095 ,  H05K1/162 ,  H05K1/167 ,  H05K3/38 ,  H05K2201/0175 ,  H05K2201/0323 ,  H05K2201/09672

公开(公告)号：US11898844B2

公开(公告)日：2024-02-13

申请号：US17063179

申请日：2020-10-05

Applicant: CORNELL UNIVERSITY

Inventor： Amit Lal ,  Benyamin Davaji ,  Visarute Pinrod

IPC: G01C19/5698 ,  H05K1/03 ,  H05K1/02

CPC classification number: G01C19/5698 ,  H05K1/0296 ,  H05K1/0306 ,  H05K2201/0175 ,  H05K2201/09227

Abstract: A rotation sensor, including: (i) a substrate having a top surface and an interior bottom surface; (ii) an electrode module positioned on the top surface of the substrate and including a first set of electrodes configured to generate a bulk acoustic wave directly into the substrate, wherein at least a portion of the bulk acoustic wave is transduced into a shear wave upon reflection on the interior bottom surface of the substrate without use of a reflector, and a second set of electrodes configured to detect the shear wave; and (iii) a controller in communication with the first set and second set of electrodes and configured to determine, based on the detected shear wave, an effect of Coriolis force on the sensor.