公开(公告)号：US20030082974A1

公开(公告)日：2003-05-01

申请号：US10227997

申请日：2002-08-26

Inventor： Michael R. Samuels ,  Subhotosh Khan ,  Mikhail R. Levit

IPC: D04H005/00 ,  D04H001/00 ,  D04H013/00 ,  D04H003/00

CPC classification number: H05K1/0366 ,  B29B13/10 ,  B32B15/04 ,  B32B27/12 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T442/60

Abstract: A solid sheet which contains an nonwoven fabric made from short high tensile modulus fibers and a thermoplastic polymer having a low moisture absorption matrix resin that is useful as a substrate for circuit boards.

Abstract translation: 包含由短的高拉伸模量纤维制成的无纺布的固体片材和具有低吸湿基质树脂的热塑性聚合物，其可用作电路板的基底。

公开(公告)号：US20030008590A1

公开(公告)日：2003-01-09

申请号：US10162027

申请日：2002-06-04

Applicant: Polymer Group, Inc.

Inventor： Jerry Zucker ,  Nick Mark Carter

IPC: B32B005/02 ,  B32B027/04 ,  B32B027/12 ,  D04H001/46 ,  D04H003/10 ,  D04H005/02

CPC classification number: H05K1/0366 ,  B29C70/12 ,  B29C70/16 ,  B29C70/50 ,  B29L2031/3425 ,  D04H1/48 ,  D04H1/49 ,  D04H1/495 ,  D04H3/11 ,  D04H5/02 ,  D04H5/03 ,  H05K1/0254 ,  H05K1/0271 ,  H05K1/0272 ,  H05K1/0393 ,  H05K3/0052 ,  H05K3/107 ,  H05K2201/0129 ,  H05K2201/0278 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2201/09045 ,  H05K2201/09127 ,  H05K2201/2009 ,  H05K2201/2036 ,  H05K2203/065 ,  Y10T442/259 ,  Y10T442/689

Abstract: The present invention relates to a nonwoven substrate, and specifically to a nonwoven substrate imparted with a three-dimensional image, wherein the three-dimensional nonwoven substrate is particularly suited as a support substrate for a PCB (Printed Circuit Board) and similar application. By the utilization of a hydroentangled, three-dimensionally imaged support substrate impregnated with a durable resinous matrix, PCB's, and similar applications, can be imparted with unique and useful performance properties, to improve structural performance.

Abstract translation: 本发明涉及非织造基材，特别涉及赋予三维图像的非织造基材，其中三维非织造基材特别适用于PCB（印刷电路板）的支撑基板和类似应用。 通过利用浸渍有耐用的树脂基质，PCB和类似应用的水刺，三维成像的支撑基底，可以赋予独特且有用的性能特性，以改善结构性能。

公开(公告)号：US06451418B1

公开(公告)日：2002-09-17

申请号：US09532974

申请日：2000-03-22

Applicant: Masayuki Tobita

Inventor： Masayuki Tobita

IPC: B32B2704

CPC classification number: C08J5/046 ,  H01L23/3733 ,  H01L23/3737 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/15311 ,  H05K1/0206 ,  H05K3/305 ,  H05K2201/0278 ,  H05K2201/0329 ,  H05K2201/10734 ,  H05K2203/124 ,  Y10S428/901 ,  Y10T428/24994 ,  Y10T428/249942 ,  Y10T428/2904 ,  Y10T428/2913 ,  Y10T428/2931 ,  Y10T428/31623 ,  H01L2924/00012 ,  H01L2224/0401

Abstract: This invention relates to a heat conductive resin substrate which polybenzasol fibers are oriented in a thick direction and/or a direction of a surface of a resin substrate, further to the heat conductive resin substrate and a semiconductor package excellent in heat radiation ability which the semiconductor chips are mounted on the heat conductive resin substrate which the polybenzasol fibers are oriented in the thick direction (the Z direction) and/or the direction of the surface of the resin substrate, the heat conductive resin substance and the semiconductor package being provided with electrical insulation and high thermal conductivity, and being capable of controlling the thermal expansion coefficient.

Abstract translation: 本发明涉及一种导热树脂基板，其中聚苯并
苯酚纤维在树脂基板的厚度方向和/或表面方向上进一步定向到导热树脂基板和散热能力优异的半导体封装，半导体 芯片安装在导热树脂基板上，聚苯并苯酚纤维在厚度方向（Z方向）和/或树脂基板的表面方向上取向，导热树脂物质和半导体封装设置有电 绝缘性和高导热性，并且能够控制热膨胀系数。

公开(公告)号：US06407017B1

公开(公告)日：2002-06-18

申请号：US09416047

申请日：1999-10-12

Applicant: Masanori Wada ,  Sadamitsu Murayama ,  Michikage Matsui

Inventor： Masanori Wada ,  Sadamitsu Murayama ,  Michikage Matsui

IPC: D02G300

CPC classification number: H01B3/52 ,  D21H13/24 ,  D21H13/26 ,  D21H15/02 ,  D21H15/06 ,  D21H17/52 ,  H05K1/0366 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T428/2973 ,  Y10T428/2976 ,  Y10T428/2978 ,  Y10T442/609 ,  Y10T442/61 ,  Y10T442/611 ,  Y10T442/69 ,  Y10T442/697

Abstract: A wholly aromatic polyamide (aramid) fiber synthetic paper sheet includes 70-96 wt % of an aramid staple fiber component which includes 30 wt % or more of a para-type aramid staple fibers each having two or more annular projections spaced from each other and having an average ratio R/&ggr; of the largest diameter R of the annular projections to the smallest diameter &ggr; of the annular projection-free portions of the staple fiber, of 1.1 or more, and 4-30 wt % of a binder component, namely a resinous binder and/or heat resistant fibrids.

Abstract translation: 全芳族聚酰胺（芳族聚酰胺）纤维合成纸片包括70-96重量％的芳族聚酰胺短纤维组分，其包含30重量％或更多的对位型芳族聚酰胺短纤维，每个具有两个或更多个环形突起彼此间隔开， 具有环形突起的最大直径R与短纤维的无环形突起部的最小直径γ的平均比R /γ为1.1以上，粘合剂成分为4-30重量％，即 树脂粘合剂和/或耐热纤维素。

公开(公告)号：US06368698B1

公开(公告)日：2002-04-09

申请号：US09573977

申请日：2000-05-19

Applicant: Kay Rokman ,  Rod Komlenic ,  Kelly Rennels ,  Hakan Sabel

Inventor： Kay Rokman ,  Rod Komlenic ,  Kelly Rennels ,  Hakan Sabel

IPC: B32B300

CPC classification number: C08J5/046 ,  B32B5/28 ,  C08J5/24 ,  D21F11/002 ,  D21H13/18 ,  D21H13/22 ,  D21H13/24 ,  D21H13/26 ,  D21H13/40 ,  D21H25/005 ,  D21H25/04 ,  D21H25/06 ,  H05K1/0366 ,  H05K2201/0145 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/28 ,  Y10T442/2008 ,  Y10T442/2738 ,  Y10T442/608 ,  Y10T442/632 ,  Y10T442/637

Abstract: A printed circuit board is made from at least one non-woven sheet or web layer comprising at least 50% by weight acrylic fibers, with any balance substantially electrically non-conductive fibers, filler, and binder. The sheet or web is preferably made by the foam process, and may contain 60-80% straight polyacrylonitrile fibers and 40-20% fibrillated (pulp) ones. The web or sheet is preferably compressed by thermal calendering so that it has a density of about 0.1-1 grams per cubic centimeter; and the web or sheet may have a basis weight of between about 20-120 grams per square meter. The web or sheet may also have a 1-40% of substantially electrically non-conductive organic or inorganic binder, or may be substantially binder free. A printed circuit board made using the layers of these non-woven webs or sheets is otherwise conventional, including a pre-preg material, electrically conductive circuit elements, and electronics, and has improved properties compared to woven glass and non-woven aramid products, including improved fiber consolidation, easy board construction, and improved MD/CD ratio and stability.

Abstract translation: 印刷电路板由至少一种包含至少50重量％的丙烯酸纤维的无纺布片材或纤维网层制成，任何平衡物基本上不导电的纤维，填料和粘合剂。 片材或纤维网优选通过泡沫方法制成，并且可以含有60-80％的直链聚丙烯腈纤维和40-20％的原纤化（纸浆）纤维。 纤维网或片材优选通过热压延来压缩，使其具有约0.1-1克/立方厘米的密度; 并且网或片可以具有介于约20-120克/平方米之间的基重。 幅材或片材还可以具有1-40％的基本上不导电的有机或无机粘合剂，或者可以是基本上不含粘合剂的。 使用这些非织造网或片的层制成的印刷电路板是常规的，包括预浸材料，导电电路元件和电子元件，并且与机织玻璃和非织造芳族聚酰胺产品相比具有改进的性能， 包括改进的纤维固结，易于板的构建，以及改善的MD / CD比和稳定性。

公开(公告)号：US06365844B2

公开(公告)日：2002-04-02

申请号：US09248020

申请日：1999-02-10

Applicant: Toshihiro Nishii ,  Shigeru Yamane ,  Shinji Nakamura ,  Hidenori Hayashi ,  Toru Fujimoto ,  Toshiharu Okada ,  Izuru Nakai

Inventor： Toshihiro Nishii ,  Shigeru Yamane ,  Shinji Nakamura ,  Hidenori Hayashi ,  Toru Fujimoto ,  Toshiharu Okada ,  Izuru Nakai

IPC: H05K111

CPC classification number: H05K3/4069 ,  H05K1/0366 ,  H05K3/0017 ,  H05K3/0032 ,  H05K2201/0278 ,  H05K2201/0355 ,  H05K2201/09581 ,  H05K2203/1136 ,  H05K2203/1461 ,  Y10T29/49165

Abstract: In manufacturing a double-layered or a multi-layered printed wiring board, a layer of metamorphic substance, which is created by transmuting a substrate material, is formed on an inner wall of a hole during a perforation process of the substrate utilizing radiation energy. The layer of metamorphic substance prevents conductive materials constituting electrical connection means formed on the inner wall of the hole from dispersing over a surface of the substrate or permeating into the substrate.

Abstract translation: 在制造双层或多层印刷线路板的过程中，利用辐射能在衬底的穿孔过程中，在孔的内壁上形成通过变换衬底材料产生的变质物质层。 变质物质层防止形成在孔的内壁上的电连接装置的导电材料在基体的表面上分散或渗透到基底中。

公开(公告)号：US20020020556A1

公开(公告)日：2002-02-21

申请号：US09975780

申请日：2001-10-12

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Toshihiro Nishii ,  Shigeru Yamane ,  Shinji Nakamura ,  Hidenori Hayashi ,  Toru Fujimoto ,  Toshiharu Okada ,  Izuru Nakai

IPC: B32B003/00

CPC classification number: H05K3/4069 ,  H05K1/0366 ,  H05K3/0032 ,  H05K2201/0278 ,  H05K2201/0355 ,  H05K2201/09581 ,  H05K2203/1136 ,  H05K2203/1461 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/249953 ,  Y10T428/249996

Abstract: In manufacturing a double-layered or a multi-layered printed wiring board, a layer of metamorphic substance, which is created by transmuting a substrate material, is formed on an inner wall of a hole during a perforation process of the substrate utilizing radiation energy. The layer of metamorphic substance prevents conductive materials constituting electrical connection means formed on the inner wall of the hole from dispersing over a surface of the substrate or permeating into the substrate.

Abstract translation: 在制造双层或多层印刷线路板的过程中，利用辐射能在衬底的穿孔过程中，在孔的内壁上形成通过变换衬底材料产生的变质物质层。 变质物质层防止形成在孔的内壁上的电连接装置的导电材料在基体的表面上分散或渗透到基底中。

公开(公告)号：US06323436B1

公开(公告)日：2001-11-27

申请号：US08833614

申请日：1997-04-08

Applicant: Jeffrey Curtis Hedrick ,  Kostas Papathomas ,  Amarjit Singh Rai ,  Stephen Leo Tisdale ,  Alfred Viehbeck

Inventor： Jeffrey Curtis Hedrick ,  Kostas Papathomas ,  Amarjit Singh Rai ,  Stephen Leo Tisdale ,  Alfred Viehbeck

IPC: H05K104

CPC classification number: H05K1/0366 ,  H01L23/145 ,  H01L2224/16225 ,  H01L2924/1433 ,  H01L2924/15311 ,  H05K3/0023 ,  H05K3/0035 ,  H05K3/0041 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/0278 ,  H05K2201/068 ,  H05K2201/092 ,  H05K2201/09518 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096

Abstract: Disclosed is a printed circuit board, and a method of preparing a printed circuit board, which possesses a coefficient of thermal expansion substantially similar to that of silicon for use in direct semiconductor chip attach structures and similar solder mounted devices. The printed circuit board is fabricated from prepreg having a thermosetting resin and a reinforcement layer consisting of non-woven aramid mat or a liquid crystalline polymer paper. The composite dielectric layer optionally includes plated through holes which are either filled or non-filled, and one or more thin film redistribution layers to provide high density electronic packages. The design places the solder pads at the PTHs where needed. The redistribution layer can be formed using photoimagable dielectrics or laminated controlled-CTE composites and laser via imaging.

Abstract translation: 公开了一种印刷电路板，以及一种制备印刷电路板的方法，该印刷电路板的热膨胀系数基本上类似于用于直接半导体芯片连接结构和类似的焊接安装器件的硅的热膨胀系数。 印刷电路板由具有热固性树脂的预浸料和由无纺芳族聚酰胺垫或液晶聚合物纸构成的加强层制成。 复合电介质层可选地包括填充或未填充的电镀通孔以及一个或多个薄膜再分配层以提供高密度电子封装。 该设计将焊盘放置在需要的PTH处。 可以使用光可光电介质或层压的受控CTE复合材料和激光通孔成像形成再分布层。

公开(公告)号：US06319605B1

公开(公告)日：2001-11-20

申请号：US09147630

申请日：1999-02-04

Applicant: Sadamitsu Murayama ,  Michikage Matsui

Inventor： Sadamitsu Murayama ,  Michikage Matsui

IPC: B32B2734

CPC classification number: C08J5/06 ,  D21H13/20 ,  D21H13/24 ,  D21H13/26 ,  D21H25/06 ,  H05K1/0366 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2203/1105 ,  Y10S428/903 ,  Y10T428/2969 ,  Y10T428/31562 ,  Y10T428/31681 ,  Y10T428/31725 ,  Y10T428/31993

Abstract: A heat resistant fiber sheet composed of staple fibers consisting of a heat resistant organic high molecular polymer and fibrids consisting of a heat resistant organic high molecular polymer as main components, having excellent heat resistance, dimensional stability to heat, interlaminar peeling strength, electric insulation resistance under a high humidity, etc., and also good resin impregnating property in spite of having a high bulk density, and especially suitable for a base substrates for an electric insulating material and a laminate for an electric circuit, is obtained by setting the amount of the staple fibers occupying in the total amount of the sheet as 40 to 97% by weight and the amount of the fibrids as 3 to 60% by weight and partially softening and/or melting the fibrids so as to act as a binder.

Abstract translation: 由耐热有机高分子聚合物和由耐热有机高分子聚合物组成的纤维状物作为主要成分的短纤维组成的耐热纤维片材，耐热性，热稳定性，层间剥离强度，电绝缘电阻 在高湿度等下，并且尽管具有高的堆积密度，并且特别适合于用于电绝缘材料的基底和用于电路的层压板的树脂浸渍性能通过设定量 占片材总量的短纤维为40〜97重量％，纤条体的量为3〜60重量％，部分软化和/或熔融纤条体，以起粘合剂的作用。

公开(公告)号：US06258203B1

公开(公告)日：2001-07-10

申请号：US09399775

申请日：1999-09-21

Applicant: Kay Rokman ,  Rod Komlenic ,  Kelly Rennels ,  Hakan Sabel

Inventor： Kay Rokman ,  Rod Komlenic ,  Kelly Rennels ,  Hakan Sabel

IPC: D04H500

CPC classification number: C08J5/046 ,  B32B5/28 ,  C08J5/24 ,  D21F11/002 ,  D21H13/18 ,  D21H13/22 ,  D21H13/24 ,  D21H13/26 ,  D21H13/40 ,  D21H25/005 ,  D21H25/04 ,  D21H25/06 ,  H05K1/0366 ,  H05K2201/0145 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/28 ,  Y10T442/2008 ,  Y10T442/2738 ,  Y10T442/608 ,  Y10T442/632 ,  Y10T442/637

Abstract: A printed circuit board is made from at least one non-woven sheet or web layer comprising at least 50% by weight acrylic fibers, with any balance substantially electrically non-conductive fibers, filler, and binder. The sheet or web is preferably made by the foam process, and may contain 60-80% straight polyacrylonitrile fibers and 40-20% fibrillated (pulp) ones. The web or sheet is preferably compressed by thermal calendering so that it has a density of about 0.1-1 grams per cubic centimeter; and the web or sheet may have a basis weight of between about 20-120 grams per square meter. The web or sheet may also have a 1-40% of substantially electrically non-conductive organic or inorganic binder, or may be substantially binder free. A printed circuit board made using the layers of these non-woven webs or sheets is otherwise conventional, including a pre-preg material, electrically conductive circuit elements, and electronics, and has improved properties compared to woven glass and non-woven aramid products, including improved fiber consolidation, easy board construction, and improved MD/CD ratio and stability.