公开(公告)号：US20040149377A1

公开(公告)日：2004-08-05

申请号：US10748548

申请日：2003-12-30

Applicant: 3M Touch Systems, Inc.

Inventor： Frank J. Bottari ,  Andrea C. Marble

IPC: B44C001/165 ,  B44C001/00

CPC classification number: G06F3/045 ,  G06F2203/04113 ,  H05K3/20 ,  H05K3/207 ,  H05K3/28 ,  H05K2201/0284 ,  H05K2201/09436 ,  H05K2203/0531 ,  Y10T428/24917

Abstract: A method of applying an edge electrode pattern to a touch screen. The method includes depositing, on a first surface of a decal strip, conductive material in the form of an edge electrode pattern, placing the first surface of the decal strip on one edge of a touch screen, applying heat and pressure to an opposite surface of the decal strip until the edge electrode pattern is transferred from the first surface of the decal strip to the touch screen; and removing the decal strip.

Abstract translation: 将边缘电极图案应用于触摸屏的方法。 该方法包括在贴花条的第一表面上沉积呈边缘电极图案形式的导电材料，将贴花条的第一表面放置在触摸屏的一个边缘上，将热和压力施加到 贴花条，直到边缘电极图案从贴花条的第一表面转移到触摸屏; 并去除贴花条。

公开(公告)号：US20030211246A1

公开(公告)日：2003-11-13

申请号：US10276118

申请日：2002-11-12

Inventor： Paul H. Kydd ,  David L. Richard ,  Yvonne M. Kunz

IPC: B05D001/32 ,  B05D003/02

CPC classification number: H05K3/12 ,  C23C18/08 ,  H05K1/0386 ,  H05K1/0393 ,  H05K3/0061 ,  H05K3/0064 ,  H05K3/0067 ,  H05K3/007 ,  H05K2201/0129 ,  H05K2201/0284 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/016 ,  H05K2203/0169 ,  H05K2203/085

Abstract: A method of printing electronic circuits and components on polymers which would normally distort at the cure temperature of the metallic printing inks is disclosed. The method consists of restraining the polymer film either mechanically or by laminating it to a rigid backing. The rigid backing can be temporary and reusable or it can be a permanent part of the product.

Abstract translation: 公开了一种在通常在金属印刷油墨的固化温度下变形的聚合物上印刷电子电路和组件的方法。 该方法包括机械地或通过将其层压到刚性背衬上来限制聚合物膜。 刚性背衬可以是临时的和可重复使用的，或者它可以是产品的永久部分。

公开(公告)号：US06598292B1

公开(公告)日：2003-07-29

申请号：US09554395

申请日：2000-07-13

Applicant: Shigetoshi Segawa ,  Yasuyuki Baba ,  Katsuyoshi Ishikawa ,  Kazuhiko Ihara

Inventor： Shigetoshi Segawa ,  Yasuyuki Baba ,  Katsuyoshi Ishikawa ,  Kazuhiko Ihara

IPC: H01K310

CPC classification number: H05K3/4061 ,  B41F15/20 ,  B41P2215/134 ,  H05K3/1216 ,  H05K3/4053 ,  H05K2201/0116 ,  H05K2201/0284 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/082 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A manufacturing method of a circuit board comprises the steps of: (a) feeding a printing stage having a porous member comprising a porous plate and a porous sheet, the porous sheet is composed of 90 wt % to 98 wt % of cellulose; (b) placing a plate for the circuit board having a pierced hole above the porous member; and (c) filling a conductive material in the pierced hole from an upper side of the plate for circuit board by sucking the porous member at a prescribed vacuum pressure from a back of the porous member.

Abstract translation: 电路板的制造方法包括以下步骤：（a）馈送具有包括多孔板和多孔片的多孔构件的印刷台，所述多孔片由90重量％至98重量％的纤维素组成; （b）在所述多孔构件上方设置具有穿孔的所述电路板的板; 以及（c）从所述多孔构件的背面以规定的真空压力吸取所述多孔构件，从所述电路板用板的上侧填充所述穿孔孔内的导电性材料。

公开(公告)号：US06280552B1

公开(公告)日：2001-08-28

申请号：US09365100

申请日：1999-07-30

Applicant: Frank J. Bottari

Inventor： Frank J. Bottari

IPC: B44C1165

CPC classification number: G06F3/045 ,  H05K3/207 ,  H05K3/28 ,  H05K2201/0284 ,  H05K2201/09436 ,  H05K2203/0531 ,  Y10S428/914 ,  Y10T29/49117 ,  Y10T428/24777 ,  Y10T428/24917

Abstract: A method of applying an edge electrode pattern to a touch screen panel including printing an edge electrode pattern on decal paper; applying a cover coat over the electrode pattern; removing the decal paper; and transferring the edge electrode pattern to a touch screen panel. A decal to be used in accordance with this method.

Abstract translation: 一种将边缘电极图案应用于触摸屏面板的方法，包括在贴纸上印刷边缘电极图案; 在电极图案上涂覆覆盖层; 去除贴纸; 并将边缘电极图案转移到触摸屏面板。 按照这种方法使用的贴花。

公开(公告)号：US6124220A

公开(公告)日：2000-09-26

申请号：US714264

申请日：1996-09-17

Applicant: Takahiro Nakata ,  Takahisa Iida ,  Takashi Yamaguchi ,  Toshihide Kanazawa

Inventor： Takahiro Nakata ,  Takahisa Iida ,  Takashi Yamaguchi ,  Toshihide Kanazawa

IPC: H05K1/03 ,  B32B27/38

CPC classification number: B32B37/0038 ,  H05K1/036 ,  H05K1/0366 ,  H05K2201/0209 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/1314 ,  Y10T428/1317 ,  Y10T428/1321 ,  Y10T428/24893 ,  Y10T428/24901 ,  Y10T428/24917

Abstract: A laminated board comprising an intermediate layer and two surface layers formed thereon, in which board the intermediate layer comprises a central layer made of a nonwoven glass fiber fabric impregnated with a resin composition containing a thermosetting resin and an inorganic filler and upper and lower layers formed on the central layer, each being made of said resin composition containing a thermosetting resin and an inorganic filler, and the two surface layers formed on the intermediate layer are made of a thermosetting resin-impregnated fiber substrate; and a process for production of the laminated board.

Abstract translation: 一种层压板，包括中间层和在其上形成的两个表面层，其中中间层包括由浸渍有含有热固性树脂和无机填料的树脂组合物的非织造玻璃纤维织物制成的中心层和形成的上下层 在中心层上，每个由含有热固性树脂和无机填料的树脂组合物制成，并且形成在中间层上的两个表面层由热固性树脂浸渍的纤维基材制成; 以及层压板的制造方法。

公开(公告)号：US4714653A

公开(公告)日：1987-12-22

申请号：US011359

申请日：1987-02-02

Applicant: Robert Cassat

Inventor： Robert Cassat

IPC: C08L61/06 ,  C08G59/00 ,  C08G59/18 ,  C08G85/00 ,  C08L61/00 ,  C08L61/04 ,  C08L63/00 ,  H05K1/03 ,  H05K3/10 ,  H05K3/18 ,  H05K3/38 ,  C08K9/06 ,  C09J5/00

CPC classification number: H05K3/188 ,  H05K1/0373 ,  H05K3/387 ,  H05K2201/0209 ,  H05K2201/0236 ,  H05K2201/0245 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/1157 ,  H05K2203/125 ,  H05K3/105 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/256

Abstract: Substrate composites, well adopted for the production of metallized printed circuits and facilely prepared by, e.g., papermaking procedures, include a central core layer comprising fibrous cellulosic material or flaked mica within a matrix of a thermosetting resin binder, said central core element having coextensively laminated to at least one of the face surfaces thereof, a lamina of a thermosetting resin comprising non-conductive metal oxide filler material distributed therethrough, and said metal oxide being borohydride reduceable and reactive to form unstable metal hydride intermediates.

Abstract translation: 用于生产金属化印刷电路并通过例如造纸方法容易制备的基材复合材料包括在热固性树脂粘合剂的基体内包含纤维状纤维素材料或薄片状云母的中心芯层，所述中心芯部元件具有共同层压 至少一个其表面，包含分布在其中的非导电金属氧化物填充材料的热固性树脂的层，并且所述金属氧化物是硼氢化物可还原和反应以形成不稳定的金属氢化物中间体。

公开(公告)号：US4547408A

公开(公告)日：1985-10-15

申请号：US599988

申请日：1984-04-13

Applicant: Robert Cassat ,  Bruno Vignando

Inventor： Robert Cassat ,  Bruno Vignando

IPC: H05K3/46 ,  B32B15/14 ,  H05K1/03 ,  B05D3/02 ,  B32B15/06

CPC classification number: H05K1/036 ,  B32B15/14 ,  H05K1/0366 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0245 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/31518 ,  Y10T428/31522 ,  Y10T428/31623 ,  Y10T428/31634 ,  Y10T428/31656 ,  Y10T428/31659 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31721 ,  Y10T428/3188 ,  Y10T428/31949 ,  Y10T428/31975

Abstract: A metallized, laminated substrate well adapted for the production of printed circuits is comprised of:(A) an electrically insulating support element which comprises (a) a central core member comprising a major proportion by weight of a cellulosic or mica filler and a minor proportion by weight of a thermosetting resin, and (b) and (b') a pair of skin laminae coextensively secured to each face surface, respectively, of said central core (a), each of said skin laminae comprising a fibrous glass, asbestos or heat-stable synthetic polymer reinforcing filler, and a thermosetting resin impregnant, which thermosetting resin may either be the same as or different from the thermosetting resin comprising said central core member (a); and(B) an electrically conducting metal foil (c) coextensively adhered to the exposed face surface of one or the other of said skin laminae (b) or (b').

Abstract translation: 适用于生产印刷电路的金属化层压基板包括：（A）电绝缘支撑元件，其包括（a）包含主要重量比的纤维素或云母填料和较小比例的中心芯构件 和（b）和（b'）分别固定在所述中心芯（a）的每个面表面上的一对皮层，每个所述皮层包括纤维状玻璃，石棉或 热稳定性合成聚合物增强填料和热固性树脂浸渍剂，该热固性树脂可以与包含所述中心芯构件（a）的热固性树脂相同或不同; 和（B）与所述皮肤层（b）或（b'）中的一个或另一个的暴露的表面共同粘合的导电金属箔（c）。

公开(公告)号：US4521491A

公开(公告)日：1985-06-04

申请号：US572126

申请日：1984-01-18

Applicant: Masayuki Oizumi ,  Masaharu Abe ,  Yasuo Fushiki

Inventor： Masayuki Oizumi ,  Masaharu Abe ,  Yasuo Fushiki

IPC: B32B15/04 ,  B32B15/08 ,  B32B15/09 ,  B32B27/36 ,  B32B29/06 ,  C08J5/24 ,  C08K5/02 ,  C09K21/08 ,  H05K1/03

CPC classification number: H05K1/0373 ,  B32B29/06 ,  C08K5/02 ,  C09K21/08 ,  D21H21/34 ,  D21H27/32 ,  D21H5/0002 ,  D21H27/34 ,  D21H27/38 ,  H05K2201/012 ,  H05K2201/0145 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/122 ,  Y10S428/921 ,  Y10T428/31681 ,  Y10T428/31786 ,  Y10T428/3179 ,  Y10T428/31982 ,  Y10T428/31993

Abstract: A flame-retarded copper-clad laminate is provided comprising a plurality of paper substrate layers each impregnated with an unsaturated polyester resin and a copper cladding adhesively bonded onto at least one side thereof.The improvement comprises said unsaturated polyester resin containing an aliphatic and/or alicyclic brominated flame-retardant and aromatic brominated flame-retardant in combination.

Abstract translation: 提供了一种阻燃覆铜层压板，其包括多个纸基材层，每个纸基材层浸渍有不饱和聚酯树脂和铜​​包层，其粘合到至少一个侧面上。 该改进包括组合含有脂族和/或脂环族溴化阻燃剂和芳族溴化阻燃剂的所述不饱和聚酯树脂。

公开(公告)号：US4499145A

公开(公告)日：1985-02-12

申请号：US480034

申请日：1983-03-29

Applicant: Tomomi Yanagida ,  Mitunori Ajiki ,  Shigeru Suzuki

Inventor： Tomomi Yanagida ,  Mitunori Ajiki ,  Shigeru Suzuki

IPC: H01B19/00 ,  B32B15/08 ,  B32B37/06 ,  H05K1/03 ,  B32B27/06 ,  C09J5/02 ,  C25D5/56

CPC classification number: H05K1/036 ,  B32B15/08 ,  H05K2201/0129 ,  H05K2201/0158 ,  H05K2201/0162 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10S428/91 ,  Y10T428/31529 ,  Y10T428/31533 ,  Y10T428/31663 ,  Y10T428/31678 ,  Y10T428/31703 ,  Y10T428/31721 ,  Y10T428/31902 ,  Y10T428/31931 ,  Y10T428/31967

Abstract: A metal-clad laminate comprising a base plate composed of a plurality of electrically insulating material layers and a metal foil or foils laminated on one side or both sides of the base plate, characterized in that to at least the metal foil or foils is laminated an electrically insulating material layer composed of a silane-modified polyethylene resin sheet, that to the silane-modified polyethylene resin is laminated an electrically insulating material layer made of a paper or cloth containing an epoxy resin and/or a silanol condensation catalyst, and that the layer made of a paper or cloth contains 5 to 35% by weight of an epoxy resin and/or that to the layer made of a paper or cloth is laminated an electrically insulating material layer other than the above-mentioned two layers. Said metal-clad laminate has excellent characteristics such as low, .epsilon., low tan .delta. and excellent moisture-resistant insulating property.

Abstract translation: 一种覆金属层压板，包括由多个电绝缘材料层构成的基板和层叠在所述基板的一侧或两侧的金属箔或箔，其特征在于，至少将所述金属箔或箔层压 将由硅烷改性的聚乙烯树脂片构成的电绝缘性材料层与硅烷改性聚乙烯系树脂层叠，由含有环氧树脂和/或硅烷醇缩合催化剂的纸或布制成的电绝缘材料层， 由纸或布制成的层包含5至35重量％的环氧树脂和/或由纸或布制成的层层压除了上述两层之外的电绝缘材料层。 所述覆金属层压板具有优异的特性，例如低，ε，低tanδ和优异的耐湿绝缘性能。

公开(公告)号：US4370386A

公开(公告)日：1983-01-25

申请号：US189860

申请日：1980-09-15

Applicant: Masakazu Uekita ,  Yasuo Fushiki ,  Masaharu Abe

Inventor： Masakazu Uekita ,  Yasuo Fushiki ,  Masaharu Abe

IPC: B32B15/04 ,  B32B15/08 ,  B32B15/09 ,  C08J5/24 ,  H01B17/60 ,  H05K1/03 ,  H05K3/02 ,  B32B15/12 ,  B32B27/04 ,  B32B27/42

CPC classification number: H05K1/036 ,  B32B15/08 ,  H05K3/022 ,  B32B2457/08 ,  H05K1/0366 ,  H05K2201/0145 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/068 ,  H05K2203/1476 ,  Y10T428/31681 ,  Y10T428/31688 ,  Y10T428/31703 ,  Y10T428/3179 ,  Y10T428/31794 ,  Y10T428/31949 ,  Y10T428/31964

Abstract: An electrical laminate comprising layers of an unsaturated polyester resin-impregnated fibrous cellulosic substrate is disclosed. The substrate is preimpregnated with a mixture and/or a condensate of an aminoplast with a higher fatty derivative having at least one functional group capable of condensation with the methylol group of aminoplast. The laminate exhibits improved moisture resistance and punchability.

Abstract translation: 公开了一种包含不饱和聚酯树脂浸渍的纤维状纤维素基材层的电气层压材料。 将底物与氨基塑料的混合物和/或缩合物与具有至少一个能够与氨基塑料的羟甲基缩合的官能团的高级脂肪衍生物预先浸渍。 层压材料具有改善的耐湿性和冲压性。