公开(公告)号：US06579565B2

公开(公告)日：2003-06-17

申请号：US10184968

申请日：2002-07-01

Applicant: Kinji Saijo ,  Shinji Ohsawa ,  Kazuo Yoshida

Inventor： Kinji Saijo ,  Shinji Ohsawa ,  Kazuo Yoshida

IPC: B05D512

CPC classification number: H05K3/062 ,  H05K3/20 ,  H05K3/44 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/09554 ,  H05K2203/0384 ,  H05K2203/0733 ,  Y10S428/901 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12931 ,  Y10T428/12944 ,  Y10T428/24917

Abstract: A multilayered circuit board is produced by: a. laminating a copper foil conductor layer and a nickel foil or nickel plating etch-stopping layer by simultaneously press-bonding the nickel and copper layer to form a multilayered clad sheet; b. selectively etching the multilayered clad sheet; c. forming an insulating layer and an outer conductor layer on the surface of the clad sheet; d. patterning the outer conductor layer; and e. electrically connecting the internal conductor layer and the outer conductor layer by interposing a columnar conductor formed in the base by etching.

Abstract translation: 多层电路板由以下产品制成：a。 通过同时压合镍和铜层来层压铜箔导体层和镍箔或镍电镀蚀刻停止层以形成多层包覆片; b。 选择性地蚀刻多层复合板; c。 在包覆板的表面上形成绝缘层和外导体层; d。 图案化外导体层; 安德 通过蚀刻形成在基底中的柱状导体来电连接内导体层和外导体层。

公开(公告)号：US20030034174A1

公开(公告)日：2003-02-20

申请号：US10198341

申请日：2002-07-18

Inventor： Zhong-You Shi ,  Delin Li ,  Richard McMillan

IPC: H05K003/20 ,  H01R012/04

CPC classification number: H05K3/429 ,  H05K3/0047 ,  H05K3/06 ,  H05K3/062 ,  H05K3/064 ,  H05K3/4038 ,  H05K3/4069 ,  H05K3/44 ,  H05K3/445 ,  H05K3/4608 ,  H05K3/4611 ,  H05K3/4623 ,  H05K3/4641 ,  H05K3/4685 ,  H05K2201/0305 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/0379 ,  H05K2201/0397 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/09609 ,  H05K2201/09845 ,  H05K2201/09881 ,  H05K2203/0369 ,  H05K2203/066 ,  H05K2203/0733 ,  H05K2203/1152 ,  H05K2203/1184 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/24917

Abstract: A method 10, 110 for making multi-layer circuit boards having metallized apertures 38, 40, 130, 132 which may be selectively and electrically grounded and having at least one formed air-bridge 92, 178.

Abstract translation: 一种用于制造具有金属化孔38,40,130,132的多层电路板的方法10,110，其可以选择性地和电接地并且具有至少一个形成的空气桥92,178。

公开(公告)号：US20020148809A1

公开(公告)日：2002-10-17

申请号：US09836644

申请日：2001-04-17

Inventor： Andrew Z. Glovatsky ,  Robert E. Belke ,  Delin Li ,  Lakhi N. Goenka ,  Mohan R. Paruchuri ,  Marc A. Straub ,  Richard K. McMillan ,  Ram S. Raghava ,  Thomas B. Krautheim ,  Michael A. Howey ,  Vivek A. Jairazbhoy

IPC: H01B013/00

CPC classification number: H05K3/4641 ,  H05K3/062 ,  H05K3/4038 ,  H05K3/4623 ,  H05K2201/0305 ,  H05K2201/0361 ,  H05K2201/0397 ,  H05K2201/09554 ,  H05K2201/09881 ,  H05K2203/0733 ,  H05K2203/1184 ,  Y10T29/49155

Abstract: A method 10 for making multi-layer electronic circuit boards having metallized apertures 34, 36 which may be selectively and electrically grounded or isolated from an electrical ground plane.

Abstract translation: 一种用于制造具有金属化孔34,36的多层电子电路板的方法10，其可以选择性地电接地或与电接地平面隔离。

公开(公告)号：US06449839B1

公开(公告)日：2002-09-17

申请号：US09655986

申请日：2000-09-06

Applicant: Andrew Z. Glovatsky ,  Thomas Krautheim ,  Robert E. Belke, Jr. ,  Vivek Amir Jairazbhoy ,  Cuong V. Pham

Inventor： Andrew Z. Glovatsky ,  Thomas Krautheim ,  Robert E. Belke, Jr. ,  Vivek Amir Jairazbhoy ,  Cuong V. Pham

IPC: H05K302

CPC classification number: H05K3/4084 ,  H05K1/056 ,  H05K3/062 ,  H05K3/4092 ,  H05K3/44 ,  H05K3/445 ,  H05K2201/0305 ,  H05K2201/0361 ,  H05K2201/0379 ,  H05K2201/0397 ,  H05K2201/09554 ,  H05K2203/0195 ,  H05K2203/063 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49156

Abstract: A method for forming connections within a multi-layer electronic circuit board 10. In one non-limiting embodiment, the method includes selectively forming air bridges over portions of the circuit board 10 and selectively collapsing the air bridges with a metallurgical bonding tool, effective to interconnect layers of the circuit board 10.

Abstract translation: 一种用于在多层电子电路板10内形成连接的方法。在一个非限制性实施例中，该方法包括在电路板10的部分上选择性地形成空气桥，并用冶金接合工具选择性地折叠气桥， 电路板10的互连层。

公开(公告)号：US20010052423A1

公开(公告)日：2001-12-20

申请号：US09907971

申请日：2001-03-20

Inventor： Achyuta Achari ,  Andrew Zachary Glovatsky ,  Robert Edward Belke ,  Brenda Joyce Nation ,  Delin Li ,  Lakhi N. Goenka ,  Robert Joseph Gordon ,  Thomas Bernd Krautheim

IPC: H05K001/11

CPC classification number: H05K3/4038 ,  H05K3/0047 ,  H05K3/06 ,  H05K3/062 ,  H05K3/064 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/44 ,  H05K3/445 ,  H05K3/4608 ,  H05K3/4611 ,  H05K3/4623 ,  H05K3/4641 ,  H05K3/4685 ,  H05K2201/0305 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/0379 ,  H05K2201/0397 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/09609 ,  H05K2201/09845 ,  H05K2201/09881 ,  H05K2203/0369 ,  H05K2203/066 ,  H05K2203/0733 ,  H05K2203/1152 ,  H05K2203/1184 ,  H05K2203/1536 ,  Y10T29/49156

Abstract: A method for making a multi-layer electronic circuit board 136 having electroplated apertures 96, 98 which may be selectively and electrically isolated from an electrically grounded member 46 and further having selectively formed air bridges and/or crossover members 128 which are structurally supported by material 134.

Abstract translation: 一种用于制造具有电镀孔96,98的多层电子电路板136的方法，其可以与电接地构件46选择性地和电隔离，并且还具有结构上由材料支撑的选择性地形成的空气桥和/或交叉构件128 134。

公开(公告)号：US20010035299A1

公开(公告)日：2001-11-01

申请号：US09815564

申请日：2001-03-23

Inventor： Achyuta Achari ,  Andrew Zachary Glovatsky ,  Robert Edward Belke ,  Brenda Joyce Nation ,  Delin Li ,  Lakhi N. Goenka ,  Mohan R. Paruchuri ,  Robert Joseph Gordon ,  Thomas Bernd Krautheim

IPC: H05K001/03

CPC classification number: H05K3/4038 ,  H05K3/0047 ,  H05K3/06 ,  H05K3/062 ,  H05K3/064 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/44 ,  H05K3/445 ,  H05K3/4608 ,  H05K3/4611 ,  H05K3/4623 ,  H05K3/4641 ,  H05K3/4685 ,  H05K2201/0305 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/0379 ,  H05K2201/0397 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/09609 ,  H05K2201/09845 ,  H05K2201/09881 ,  H05K2203/0369 ,  H05K2203/066 ,  H05K2203/0733 ,  H05K2203/1152 ,  H05K2203/1184 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T156/1056

Abstract: A method for making a multi-layer circuit board 116 having apertures 96, 98 which may be selectively and electrically isolated from electrically grounded member 46 and further having selectively formed air bridges and/or crossover members 104 which are structurally supported by material 112. Each of the apertures 96, 98 selectively receives electrically conductive material 114.

Abstract translation: 一种用于制造具有孔96,98的多层电路板116的方法，其可以与电接地构件46选择性地和电隔离，并且还具有在结构上由材料112支撑的选择性地形成的空气桥和/或交叉构件104.每个 孔96,98选择性地接收导电材料114。

公开(公告)号：US20010035298A1

公开(公告)日：2001-11-01

申请号：US09812963

申请日：2001-03-20

Inventor： Mohan R. Paruchuri

IPC: H05K001/03

CPC classification number: H05K3/44 ,  H05K3/0047 ,  H05K3/06 ,  H05K3/062 ,  H05K3/064 ,  H05K3/4038 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/445 ,  H05K3/4608 ,  H05K3/4611 ,  H05K3/4623 ,  H05K3/4641 ,  H05K3/4685 ,  H05K2201/0305 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/0379 ,  H05K2201/0397 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/09609 ,  H05K2201/09845 ,  H05K2201/09881 ,  H05K2203/0369 ,  H05K2203/066 ,  H05K2203/0733 ,  H05K2203/1152 ,  H05K2203/1184 ,  H05K2203/1536

Abstract: A method 10, 80, 81 for making multi-layer electronic circuit boards 77, 137, 139 having metallized apertures 18, 20, 34, 40, 104, 106, 120.

Abstract translation: 一种用于制造具有金属化孔18,20,34,40,104,106,120的多层电子电路板77,137,139的方法10,80,81。

公开(公告)号：US20010006115A1

公开(公告)日：2001-07-05

申请号：US09761140

申请日：2001-01-16

Inventor： Lakhi Nandlal Goenka ,  Mohan R. Paruchuri

IPC: H05K003/00

CPC classification number: H05K3/4685 ,  H05K3/062 ,  H05K3/205 ,  H05K3/386 ,  H05K2201/0361 ,  H05K2201/0394 ,  H05K2203/0369 ,  H05K2203/0376

Abstract: A multilayer circuit board having strengthened air bridge crossover structures, and additive and subtractive methods for producing the same, wherein the circuit includes specially designed metallic fortifying layers to mechanically and/or electrically fortify the circuit. A preferred embodiment includes air bridge structures having generally T-shaped cross-sections, which provide strengthened, mechanically robust air bridges which are especially resistant to damage from flexure and displacement due to physical impact, bending, thermal excursions, and the like.

Abstract translation: 一种具有加强的空气桥交叉结构的多层电路板及其制造方法，其中该电路包括专门设计的金属防腐层，以机械和/或电气强化电路。 优选的实施例包括通常具有T形横截面的空气桥结构，其提供加强的机械坚固的空气桥，其特别地抵抗由于物理冲击，弯曲，热偏移等引起的挠曲和位移的损坏。

公开(公告)号：US5664325A

公开(公告)日：1997-09-09

申请号：US410950

申请日：1995-03-27

Applicant: Naoki Fukutomi ,  Hajime Nakayama ,  Yoshiaki Tsubomatsu ,  Kouichi Kaitou ,  Yasunobu Yoshidomi ,  Yoshihiro Takahashi

Inventor： Naoki Fukutomi ,  Hajime Nakayama ,  Yoshiaki Tsubomatsu ,  Kouichi Kaitou ,  Yasunobu Yoshidomi ,  Yoshihiro Takahashi

IPC: H05K3/04 ,  H05K3/20 ,  H05K3/42 ,  H05K3/46 ,  H05K3/06

CPC classification number: H05K3/428 ,  H05K3/205 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/09781 ,  H05K2203/0152 ,  H05K2203/025 ,  H05K2203/0376 ,  H05K2203/0384 ,  H05K2203/0726 ,  H05K2203/0733 ,  H05K2203/1476 ,  H05K3/04 ,  H05K3/4652 ,  H05K3/4658 ,  Y10S29/016 ,  Y10T29/49156 ,  Y10T29/49158

Abstract: A wiring board is fabricated through the following steps:(A) forming, on one side of an elongated carrier metal foil made of a first metal, a thin layer with a second metal whose etching conditions are different from those of the first metal;(B) forming, on a surface of the thin layer, a desired wiring pattern with a third metal whose etching conditions are different from those of the second metal;(C) superposing the carrier metal foil on an insulating substrate with the side of the wiring pattern being positioned inside, whereby the wiring pattern is embedded in the insulating substrate; and(D) etching off the carrier metal foil and the thin layer at desired parts thereof.

Abstract translation: 通过以下步骤制造布线板：（A）在由第一金属制成的细长载体金属箔的一侧上形成具有与第一金属的蚀刻条件不同的第二金属的薄层; （B）在所述薄层的表面上形成与蚀刻条件不同于所述第二金属的第三金属的期望布线图案; （C）将所述载体金属箔叠置在所述布线图案的一侧位于绝缘基板上，由此将所述布线图案嵌入所述绝缘基板中; 和（D）在其所需部分刻蚀载体金属箔和薄层。

公开(公告)号：US5504992A

公开(公告)日：1996-04-09

申请号：US268866

申请日：1994-06-30

Applicant: Naoki Fukutomi ,  Yoshiaki Tsubomatsu ,  Toshio Yamazaki ,  Masahiko Itabashi ,  Hirohito Ohhata

Inventor： Naoki Fukutomi ,  Yoshiaki Tsubomatsu ,  Toshio Yamazaki ,  Masahiko Itabashi ,  Hirohito Ohhata

IPC: H05K3/42 ,  H05K3/46 ,  H05K3/02

CPC classification number: H05K3/428 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/09781 ,  H05K2203/0152 ,  H05K2203/025 ,  H05K2203/0376 ,  H05K2203/0384 ,  H05K2203/0726 ,  H05K2203/0733 ,  H05K2203/1476 ,  H05K3/4652 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: The object of the present invention is to provide a wiring board fabrication process which is, not only so smooth on the surface that a fine wiring pattern can be formed thereon, but also suitable for mounting electronic parts having fine pitch terminals.The present invention is a fabrication process of a wiring board which comprises a wiring conductive line embedded in the surface of an insulating substrate so that the upper face of the conductive line and the surface of the substrate are flat, and a through-hole land which is a conductive portion projected from the surface of the substrate in a through-hole portion, which is characterized in removing the conductive portion projected from the surface of the substrate in the through-hole portion so as to have a flat surface on the surface of the substrate.

Abstract translation: 本发明的目的在于提供一种线路板制造工艺，不仅在表面上光滑地形成精细的布线图案，而且还适合于安装具有细间距端子的电子部件。 本发明是一种布线板的制造工艺，其包括布置在绝缘基板的表面上的布线导线，使得导线的上表面和基板的表面平坦，以及通孔焊盘， 是在通孔部中从基板的表面突出的导电部，其特征在于，除去从通孔部中的基板的表面突出的导电部，使其在表面上具有平坦的表面 底物。