公开(公告)号：US20080218981A1

公开(公告)日：2008-09-11

申请号：US12030565

申请日：2008-02-13

Applicant: Chih-pin Hung ,  Ying-te Ou

Inventor： Chih-pin Hung ,  Ying-te Ou

IPC: H05K7/00

CPC classification number: H05K1/117 ,  H01L23/13 ,  H01L23/5383 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/09036 ,  H05K2201/09163 ,  H05K2203/0307

Abstract: A package structure for connection with an output/input module is disclosed. The package structure can be applied to conventional multi-chip packages and system in packages. The package structure defines at least one insertion cavity that is vertically or horizontally disposed. By simply inserting an output/input module into the insertion cavity, an electrical connection can be established between the output/input module and the package structure. Accordingly, the package structure thus constructed can address the repairing, replacement and upgrading problems of electronic components encountered by a package structure that adopts the conventional soldering connection method.

Abstract translation: 公开了一种用于与输出/输入模块连接的封装结构。 封装结构可以应用于传统的多芯片封装和封装中的系统。 包装结构限定了垂直或水平设置的至少一个插入腔。 通过简单地将输出/输入模块插入到插入腔中，可以在输出/输入模块和封装结构之间建立电连接。 因此，如此构造的封装结构可以解决采用常规焊接连接方法的封装结构所遇到的电子部件的修理，更换和升级问题。

公开(公告)号：US20080150811A1

公开(公告)日：2008-06-26

申请号：US11902448

申请日：2007-09-21

Applicant: Tomoko Honda ,  Nobuyoshi Kuroiwa ,  Masaomi Nakahata ,  Jun Morimoto ,  Satoru Honda ,  Yoshikazu Hata ,  Koichi Sato ,  Akihiro Tsujimura ,  Makoto Tabata ,  Minoru Sakurai ,  Shoji Kato

Inventor： Tomoko Honda ,  Nobuyoshi Kuroiwa ,  Masaomi Nakahata ,  Jun Morimoto ,  Satoru Honda ,  Yoshikazu Hata ,  Koichi Sato ,  Akihiro Tsujimura ,  Makoto Tabata ,  Minoru Sakurai ,  Shoji Kato

IPC: H01Q1/22

CPC classification number: H01Q9/40 ,  H01Q9/42 ,  H01Q21/28 ,  H05K1/0284 ,  H05K1/144 ,  H05K3/325 ,  H05K2201/048 ,  H05K2201/0999 ,  H05K2203/167

Abstract: An electronic apparatus includes: a housing provided with a first conductive pattern; a substrate provided with a first wiring layer in a surface thereof and fixed to the housing; and a first conductive member connecting the first conductive pattern and the first wiring layer. The first conductive pattern extends onto an outer surface and an inner surface of the housing. The first conductive member is in contact with each of at least a part of the first conductive pattern extending onto the inner surface and an end of the first wiring layer. Alternatively, an electronic apparatus includes: a housing provided with a conductive pattern and having a through part in a frame portion thereof; and a substrate provided with a wiring layer on a surface thereof and having a protruding part and fixed to the housing. The protruding part and the through part are fit. The conductive pattern extends onto an outer surface of the housing and onto an inner surface of the through part. At least some of the conductive pattern extending onto the inner surface is in contact with an end of the wiring layer.

Abstract translation: 电子设备包括：具有第一导电图案的壳体; 基板，其在其表面上设置有第一布线层并固定到所述壳体; 以及连接第一导电图案和第一布线层的第一导电构件。 第一导电图案延伸到壳体的外表面和内表面上。 第一导电构件与延伸到第一布线层的内表面和端部的第一导电图案的至少一部分中的每一个接触。 或者，电子设备包括：壳体，设置有导电图案，并且在其框架部分中具有通孔部分; 以及在其表面上设置有布线层并且具有突出部并固定到壳体的基板。 突出部分和贯穿部分是合适的。 导电图案延伸到壳体的外表面上并延伸到通孔的内表面上。 延伸到内表面上的至少一些导电图案与布线层的端部接触。

公开(公告)号：US07389012B2

公开(公告)日：2008-06-17

申请号：US10904271

申请日：2004-11-02

Applicant: Stefano S. Oggioni ,  Bert J. Offrein

Inventor： Stefano S. Oggioni ,  Bert J. Offrein

IPC: G02B6/12

CPC classification number: G02B6/43 ,  H05K1/0274 ,  H05K1/141 ,  H05K1/147 ,  H05K3/0061 ,  H05K3/0067 ,  H05K2201/048 ,  H05K2201/09127 ,  H05K2201/2009

Abstract: An electro-optical module comprising flexible connection cable and aligning capabilities is disclosed. Electro-optical devices may be soldered on a transparent substrate such as glass or a substrate comprising an optical waveguide wherein electrically conductive traces are designed, forming an electro-optical module. When such electro-optical module is inserted and aligned into a printed circuit board, the external part of the substrate, comprising electrically conductive traces and pads, referred to as flex-cable, is bent down toward the mounting plane of the PCB allowing to establish electrical connections between these pads and the PCB. The substrate may be brokenalong a pre-formed groove, and the external part of the substrate can be removed leaving the flex-cable section in place.

Abstract translation: 公开了一种包括柔性连接电缆和对准能力的电光模块。 电光器件可以焊接在诸如玻璃的透明衬底或包括其中导电迹线被设计的光波导的衬底上，形成电光模块。 当将这种电光模块插入并对准印刷电路板时，包括导电迹线和焊盘（称为柔性电缆）的基板的外部部分朝向PCB的安装平面向下弯曲，允许建立 这些焊盘和PCB之间的电气连接。 衬底可以是预先形成的凹槽，并且可以去除衬底的外部，留下柔性电缆部分就位。

公开(公告)号：US20080045077A1

公开(公告)日：2008-02-21

申请号：US11889878

申请日：2007-08-17

Applicant: Yung-Wei Chou

Inventor： Yung-Wei Chou

IPC: H01R12/24

CPC classification number: H01R12/00 ,  H01R4/027 ,  H01R12/7076 ,  H05K1/147 ,  H05K3/363 ,  H05K2201/048 ,  H05K2201/058 ,  H05K2201/09081

Abstract: A connecting structure of a printed circuit board of a liquid crystal display (LCD) module includes a double side printed circuit board and a single side printed circuit board. With the design of the double side printed circuit board having a solder element with two solder surfaces with a plurality of plated through holes (PTHs), and the design of the opening neighboring the solder element, the conducting surface of the single side printed circuit board may easily accord with the structural requirements to select the corresponding solder surface for performing welding.

Abstract translation: 液晶显示器（LCD）模块的印刷电路板的连接结构包括双面印刷电路板和单面印刷电路板。 通过双面印刷电路板的设计，具有具有多个电镀通孔（PTH）的两个焊接表面的焊料元件以及与焊料元件相邻的开口的设计，单面印刷电路板的导电表面 可以容易地符合选择用于进行焊接的相应焊接表面的结构要求。

公开(公告)号：US20080025028A1

公开(公告)日：2008-01-31

申请号：US11496178

申请日：2006-07-31

Applicant: Jennifer L. Gloisten ,  Frederick Reisfeld ,  Glenn T. Schmidt ,  Samuel Zeng

Inventor： Jennifer L. Gloisten ,  Frederick Reisfeld ,  Glenn T. Schmidt ,  Samuel Zeng

IPC: F21V29/00

CPC classification number: F21V5/04 ,  B60Q3/44 ,  B60Q3/76 ,  F21S45/47 ,  F21V19/0055 ,  F21V21/30 ,  F21V23/00 ,  F21V29/713 ,  F21V29/773 ,  F21V29/89 ,  F21W2106/00 ,  F21W2131/402 ,  F21W2131/405 ,  F21Y2115/10 ,  H05K1/14 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/09027 ,  H05K2201/10106

Abstract: In one aspect, a compact, lightweight, high-intensity and long-life LED lighting apparatus is provided. The LED lighting apparatus includes: a lens array including a plurality of lenses; a first circuit board including at least one LED (e.g., a plurality of surface-mount type LEDs); and a second circuit board electrically connected with the first circuit board to control illumination of the plurality of LEDs, wherein the second circuit board is configured substantially perpendicular to the first circuit board. In another aspect, a heat dissipation assembly is provided for a lighting apparatus that includes a first circuit board with at least one LED, and a second circuit board configured substantially perpendicular to the first circuit board.

Abstract translation: 一方面，提供了紧凑，重量轻，高强度和长寿命的LED照明装置。 LED照明装置包括：包括多个透镜的透镜阵列; 包括至少一个LED（例如，多个表面安装型LED）的第一电路板; 以及与所述第一电路板电连接以控制所述多个LED的照明的第二电路板，其中所述第二电路板被配置为基本上垂直于所述第一电路板。 在另一方面，提供一种用于照明装置的散热组件，该照明装置包括具有至少一个LED的第一电路板和基本上垂直于第一电路板配置的第二电路板。

公开(公告)号：US20070176613A1

公开(公告)日：2007-08-02

申请号：US11627844

申请日：2007-01-26

Applicant: Minoru Ogawa ,  Kazuto Nishimoto

Inventor： Minoru Ogawa ,  Kazuto Nishimoto

IPC: G01R31/02

CPC classification number: G02B6/138 ,  G02B6/43 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/1533 ,  H05K1/0272 ,  H05K1/0274 ,  H05K1/183 ,  H05K1/186 ,  H05K3/365 ,  H05K3/386 ,  H05K3/4015 ,  H05K3/4069 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4626 ,  H05K3/4697 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/0272 ,  H05K2201/0311 ,  H05K2201/048 ,  H05K2201/064 ,  H05K2201/09163 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/1031 ,  H05K2201/10378 ,  H05K2203/061 ,  Y02P70/611 ,  H01L2924/00

Abstract: A printed circuit board assembly has plural printed circuit boards that are mechanically and electrically connected to each other with them being stacked, and a connection layer that connects the adjacent two printed circuit boards to each other is provided. The connection layer includes an insulation portion and an electric conduction portion. The insulation portion contains an insulating member and is adhered to each of the adjacent two printed circuit boards. The electric conduction portion passes through the insulation portion and connects electrode terminals of the adjacent two printed circuit boards.

Abstract translation: 印刷电路板组件具有多个印刷电路板，它们被堆叠而彼此机械地和电连接，并且提供了将相邻的两个印刷电路板彼此连接的连接层。 连接层包括绝缘部分和导电部分。 绝缘部分包含绝缘部件并且粘附到相邻的两个印刷电路板中的每一个。 导电部分穿过绝缘部分并连接相邻的两个印刷电路板的电极端子。

公开(公告)号：US20060074586A1

公开(公告)日：2006-04-06

申请号：US11241846

申请日：2005-09-30

Applicant: Thomas Kautz ,  Dominic Ticali ,  Robert Freimuth

Inventor： Thomas Kautz ,  Dominic Ticali ,  Robert Freimuth

IPC: H05B1/02

CPC classification number: H05K1/147 ,  G01K7/427 ,  G01K17/20 ,  H05K1/189 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/10151 ,  H05K2201/10598

Abstract: The present invention relates to a temperature sensing device with a first temperature sensor mounted to a housing at a first location proximate a first surface of the housing. The first temperature sensor senses a first temperature while a second temperature sensor senses a second temperature. A processor circuit is coupled to the first and second temperature sensors and a mounting device is coupled to either the housing or the processor circuit. The mounting device mounts the second temperature sensor at a second location proximate a second surface of the housing which is spaced apart from the first surface. The processor circuit is configured to estimate a third temperature based on the first and second temperatures and a distance between the first and second locations which is an estimate of a temperature at a third location.

Abstract translation: 本发明涉及一种具有第一温度传感器的温度感测装置，该第一温度传感器在邻近壳体的第一表面的第一位置处安装到壳体。 第一温度传感器感测第一温度，而第二温度传感器感测第二温度。 处理器电路耦合到第一和第二温度传感器，并且安装装置耦合到壳体或处理器电路。 安装装置将第二温度传感器安装在靠近壳体的与第一表面间隔开的第二表面的第二位置处。 处理器电路被配置为基于第一和第二温度估计第三温度，以及第一和第二位置之间的距离，其是在第三位置处的温度的估计。

公开(公告)号：US20050269693A1

公开(公告)日：2005-12-08

申请号：US11143201

申请日：2005-06-02

Applicant: Ronald Green ,  Sridhar Krishnan ,  Stuart Wilson ,  James Shook ,  Ming Tsai ,  Andy Stavros

Inventor： Ronald Green ,  Sridhar Krishnan ,  Stuart Wilson ,  James Shook ,  Ming Tsai ,  Andy Stavros

IPC: H01L23/34 ,  H05K1/14 ,  H05K3/00 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40

CPC classification number: H05K3/368 ,  H05K1/145 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/366 ,  H05K3/403 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/048 ,  H05K2201/0715 ,  H05K2201/09036 ,  H05K2201/09181 ,  H05K2201/09845 ,  H05K2201/0999 ,  H05K2201/10484

Abstract: An assembly is provided which includes a first circuit panel having a top surface, a first dielectric element and first conductive traces disposed on the first dielectric element. In addition, a second circuit panel has a bottom surface, a second dielectric element and second conductive traces disposed on the second dielectric element, where at least a portion of the second circuit panel overlies at least a portion of the first circuit panel. The assembly further includes an interconnect circuit panel having a third dielectric element which has a front surface, a rear surface opposite the front surface, a top end extending between the front and rear surfaces, a bottom end extending between the front and rear surfaces, and a plurality of interconnect traces disposed on the dielectric element. The bottom end of the interconnect element abuts the top surface of the first circuit panel and the top end abuts the bottom surface of the second circuit panel, where at least some of the first conductive traces are in conductive communication with the second conductive traces through the interconnect traces.

Abstract translation: 提供了一种组件，其包括具有顶表面的第一电路板，设置在第一介电元件上的第一介电元件和第一导电迹线。 此外，第二电路板具有底表面，第二介电元件和设置在第二电介质元件上的第二导电迹线，其中第二电路板的至少一部分覆盖在第一电路板的至少一部分上。 该组件还包括具有第三电介质元件的互连电路板，第三电介质元件具有前表面，与前表面相对的后表面，在前表面和后表面之间延伸的顶端，在前表面和后表面之间延伸的底端，以及 布置在电介质元件上的多个互连迹线。 互连元件的底端邻接第一电路板的顶表面，并且顶端邻接第二电路板的底表面，其中至少一些第一导电迹线通过第二导电迹线与第二导电迹线导通连通 互连线。

公开(公告)号：US20050209813A1

公开(公告)日：2005-09-22

申请号：US10801313

申请日：2004-03-16

Applicant: Thomas Kautz ,  Kirk Drees

Inventor： Thomas Kautz ,  Kirk Drees

IPC: G01K1/20 ,  F24F11/00 ,  F24F11/02 ,  G01K3/00 ,  G01K3/14 ,  G01K7/00 ,  G01K7/42 ,  G01K17/04 ,  G01K17/20 ,  H05B1/02

CPC classification number: H05K1/147 ,  G01K7/427 ,  G01K17/20 ,  H05K1/189 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/10151 ,  H05K2201/10598

Abstract: A temperature sensing device includes a first temperature sensor configured for mounting to a structure at a first distance relative to the structure. The temperature sensing device also includes a second temperature sensor configured for mounting to the structure at a second distance relative to the structure. The temperature sensing device also includes a processor coupled to the first and second temperature sensors and configured to estimate a third temperature based on the first and second temperatures and the distance separating the first and second temperature sensors.

Abstract translation: 温度感测装置包括第一温度传感器，其被配置为相对于结构在相对于结构的第一距离处安装到结构。 温度感测装置还包括第二温度传感器，其被配置为相对于结构以相对距离安装到结构。 温度感测装置还包括耦合到第一和第二温度传感器并被配置为基于第一和第二温度以及分离第一和第二温度传感器的距离来估计第三温度的处理器。

公开(公告)号：US06904236B2

公开(公告)日：2005-06-07

申请号：US10448335

申请日：2003-05-29

Applicant: Hiroshi Terada ,  Naohiro Tsuchida ,  Yutaka Maeda ,  Kazuyuki Iwasa ,  Tatsuo Takanashi

Inventor： Hiroshi Terada ,  Naohiro Tsuchida ,  Yutaka Maeda ,  Kazuyuki Iwasa ,  Tatsuo Takanashi

IPC: G03B17/00 ,  H05K1/14 ,  H05K3/36 ,  G03B17/02

CPC classification number: G03B17/00 ,  H05K1/148 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/10484 ,  H05K2201/10568 ,  H05K2201/10598

Abstract: In a camera according to the present invention, an edge portion of a lens barrel unit is projected and arranged from a front cover. The lens barrel unit is covered with a front cover cylindrical member connected to the front cover, and a front exposed portion of the front cover cylindrical member is covered with an exterior cylindrical member as a detachable (before-attaching) metal cylindrical member. The exterior cylindrical member is positioned and is fixed by an stop claw on the front-cover side. A C-shaped stop portion cover having flexibility is made flexible and is attached around the stop claw portion, and is fixed by a screw. The restriction on design is reduced on the appearance for covering the lens barrel unit of the camera, and a camera exterior portion can be made of metal.

Abstract translation: 在根据本发明的照相机中，透镜筒单元的边缘部分从前盖突出并布置。 透镜筒单元被连接到前盖的前盖圆柱形构件覆盖，并且前盖圆柱形构件的前部暴露部分被外部圆柱形构件覆盖为可拆卸（安装前）金属圆柱形构件。 外圆柱形部件通过前盖侧的止动爪定位并固定。 具有柔性的C形止挡部分盖被制成柔性并且被安装在止动爪部分周围，并由螺钉固定。 相机的镜筒单元的外观上的设计限制减少，摄像机外部部分可以由金属制成。