Abstract:
A module component includes a substrate including a liquid crystal polymer resin sheet, and an electronic component mounted on the substrate by ultrasonic bonding, wherein the electronic component includes a plurality of first substrate connecting electrodes including respective planar conductors provided on a substrate mounting surface separately from each other, and connected at a same potential or substantially a same potential, and the substrate includes a first component connecting electrode including a planar conductor provided on a component loading surface, and bonded to the plurality of first substrate connecting electrodes.
Abstract:
Disclosed herein is a display apparatus that reduces a magnitude of a tension applied to a flexible PCB when a display panel is provided with a curved surface, and prevents damage of a driving chip. The display apparatus in accordance with exemplary embodiments includes a display panel configured to display an image, a source printed circuit board configured to control the display panel, and a flexible PCB that connects the display panel and the source printed circuit board. A length of at least one side edge of the flexible PCB is formed longer than a minimum length from the display panel to the source printed circuit board.
Abstract:
A circuit board and a circuit module more accurately provide impedance matching between an antenna coil and an electronic component electrically connected to the antenna coil, and include a board body including board portions and a plurality of laminated insulating material layers made of a flexible material. An antenna coil includes coil conductors provided in the board portion. Wiring conductors are provided in the board portion and electrically connected to the antenna coil. The board portion has a structure that is less likely to deform than the board portion. An integrated circuit electrically connected to the wiring conductors is mounted on the board portion.
Abstract:
The present invention provides a flexible printed circuit board having gold fingers, comprising a base sheet, a metallic layer and a protective sheet. The base sheet has a plurality of voids thereon. The metallic layer is provided on the base sheet, and has at least one plated through hole. The protective sheet is provided on the base sheet and the metallic layer to expose a portion of the metallic layer and the plated through hole. The flexible printed circuit board may electrically be connected to a conductive terminal of a rigid printed circuit board with one gold finger and electrically be connected to a system with another gold finger. The plated through hole has a function of heat conduction and soldering, and the voids of the flexible printed circuit board can provide a space for overflowing solder and heat dissipation.
Abstract:
It is an object of this invention to provide an FPC capable of improving tamper resistance. An FPC (1) of this invention includes: a signal line pattern (2) for inputting a communication signal; and signal protective line patterns (3, 4) provided to be opposed to an upper surface and a lower surface of the signal line pattern and having the same width as a width of the signal line pattern (2) or a larger width than the width of the signal line pattern (2). The signal protective line patterns are provided along the signal line pattern within a region that requires tamper resistance.
Abstract:
This electronic circuit, includes a set of electronic boards intended to support components and linked together by joining elements. The joining elements include curved flexible printed circuits linking two opposing ends of two electronic boards running side by side, the said curved flexible printed circuits being foldable for erecting the electronic circuit into a volume so that the electronic circuit comprises electronic boards placed opposite one another.
Abstract:
A circuit board and a circuit module more accurately provide impedance matching between an antenna coil and an electronic component electrically connected to the antenna coil, and include a board body including board portions and a plurality of laminated insulating material layers made of a flexible material. An antenna coil includes coil conductors provided in the board portion. Wiring conductors are provided in the board portion and electrically connected to the antenna coil. The board portion has a structure that is less likely to deform than the board portion. An integrated circuit electrically connected to the wiring conductors is mounted on the board portion.
Abstract:
In the fields of printed wiring boards and circuit boards, a good glass cloth-penetrating property is exhibited and prepreg appearance is excellent. A cured product thereof exhibits good heat resistance. A phenolic resin is a phosphorus-atom-containing phenolic resin that has phosphorus-atom-containing structural portions (i) represented by structural formula (Y1) or (Y2) below and alkoxymethyl groups (ii) in an aromatic nucleus of a phenolic compound: (In structural formulae (Y1) and (Y2), R1 to R4 each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms). A ratio of the number of the alkoxymethyl groups (ii) relative to the total number of the phosphorus-atom-containing structural portions (i) and the alkoxymethyl groups (ii) is 5 to 20%.
Abstract:
It is an object of this invention to provide an FPC capable of improving tamper resistance. An FPC (1) of this invention includes: a signal line pattern (2) for inputting a communication signal; and signal protective line patterns (3, 4) provided to be opposed to an upper surface and a lower surface of the signal line pattern and having the same width as a width of the signal line pattern (2) or a larger width than the width of the signal line pattern (2). The signal protective line patterns are provided along the signal line pattern within a region that requires tamper resistance.
Abstract:
A method of manufacturing a printed circuit board precursor includes the steps of providing a substrate. Then the surface of the substrate is catalyzed to form a catalytic layer by a catalyst. Subsequently, a conductive layer is formed and attached to the surface of the catalytic layer. Finally, a metal layer is electroplated on the conductive layer. A printed circuit board precursor includes a substrate having a surface. Specifically, the surface is catalytically treated to form a catalytic layer. The precursor also includes a conductive layer which is attached to and covers the catalytic layer and a metal layer which is disposed on the conductive layer.