公开(公告)号：US20160295683A1

公开(公告)日：2016-10-06

申请号：US15090231

申请日：2016-04-04

Applicant: DENSO CORPORATION

Inventor： Takayuki Uchida

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0209 ,  H05K7/20463 ,  H05K2201/066 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2201/1056

Abstract: Heating elements are mounted on a substrate. A heat sink is provided to be capable of releasing heat of the heating elements. Each radiating component is provided between a corresponding one of the heating elements and the heat sink, and is provided in a corresponding one of radiating regions. Each radiating region includes a corresponding one of mounting portions of the heating elements. A gap part is formed in an area surrounded by the radiating components each of which is provided at a corresponding one of the radiating regions. Each heating element is located in a corresponding one of the radiating regions. There is not any one of the radiating components disposed at the gap part.

Abstract translation: 加热元件安装在基板上。 提供散热器以能够释放加热元件的热​​量。 每个辐射部件设置在相应的一个加热元件和散热器之间，并且设置在相应的一个辐射区域中。 每个辐射区域包括加热元件的相应的一个安装部分。 在由辐射部件围绕的区域中形成间隙部分，每个辐射部件设置在相应的一个辐射区域。 每个加热元件位于相应的一个辐射区域中。 辐射部件中没有任何一个设置在间隙部分。

公开(公告)号：US20160267820A1

公开(公告)日：2016-09-15

申请号：US15162439

申请日：2016-05-23

Applicant: Ultravision Technologies, LLC

Inventor： William Y. Hall

IPC: G09F9/302 ,  G09F13/22 ,  G06F1/18 ,  G06F1/20 ,  G09G5/14

CPC classification number: G09F13/22 ,  F21K9/20 ,  F21K9/90 ,  F21V23/023 ,  F21V31/005 ,  F21Y2101/00 ,  F21Y2115/10 ,  G06F1/1601 ,  G06F1/182 ,  G06F1/183 ,  G06F1/188 ,  G06F1/189 ,  G06F1/20 ,  G06F1/26 ,  G06F3/1446 ,  G06F3/147 ,  G09F9/3023 ,  G09F2013/222 ,  G09G3/006 ,  G09G3/32 ,  G09G5/14 ,  G09G2300/026 ,  G09G2320/029 ,  G09G2330/02 ,  G09G2330/045 ,  G09G2330/10 ,  G09G2360/04 ,  H01B7/2825 ,  H01B9/003 ,  H01B11/02 ,  H04N7/00 ,  H05K1/181 ,  H05K3/32 ,  H05K5/0017 ,  H05K5/0247 ,  H05K5/0256 ,  H05K5/03 ,  H05K5/06 ,  H05K7/1422 ,  H05K7/1427 ,  H05K7/20 ,  H05K7/20127 ,  H05K7/20136 ,  H05K7/2039 ,  H05K7/20954 ,  H05K7/20963 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/10128 ,  Y02P70/611

Abstract: Embodiments of the present invention relate to integrated modular display panels. In one embodiment, modular display panel includes a casing having a recess. The casing includes locking points for use in attachment to an adjacent casing of another modular display panel. A printed circuit board is disposed in the recess and a plurality of LEDs attached to the printed circuit board. A driver circuit is attached to the printed circuit board. A heat sink is disposed between a back side of the casing and the printed circuit board. The heat sink thermally contacts the back side of the casing and the printed circuit board. A framework of louvers is disposed over the printed circuit board. The framework of louvers is disposed between rows of the LEDs. The framework of louvers is attached to the printed circuit board using an adhesive.

公开(公告)号：US09401348B2

公开(公告)日：2016-07-26

申请号：US14309628

申请日：2014-06-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Young Jeong Yoon ,  Yeon Woo Lee ,  Sung Min Jang

IPC: H01L33/46 ,  H01L25/075 ,  H05K1/02 ,  H05K1/18

CPC classification number: H01L25/0753 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/189 ,  H05K2201/066 ,  H05K2201/10106 ,  H01L2924/00

Abstract: There is provided a semiconductor light emitting device including: a heat dissipation structure including one or more of materials among a metal, a ceramic, a semiconductor, and a resin; a flexible insulating layer directly in contact with the heat dissipation structure; a conductive layer laminated on the flexible insulating layer; and a light emitting device mounted on the conductive layer, wherein the light emitting device includes a light emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer; and first and second electrodes connected to the first and second conductivity-type semiconductor layers, respectively, and the first electrode includes a plurality of conductive vias connected to the first conductivity-type semiconductor layer through the second conductivity-type semiconductor layer and the active layer.

Abstract translation: 提供了一种半导体发光器件，包括：包含金属，陶瓷，半导体和树脂中的一种或多种材料的散热结构; 直接与散热结构接触的柔性绝缘层; 层压在柔性绝缘层上的导电层; 以及安装在所述导电层上的发光器件，其中所述发光器件包括包括第一导电型半导体层，有源层和第二导电型半导体层的发光结构; 以及分别连接到第一和第二导电类型半导体层的第一和第二电极，并且第一电极包括通过第二导电类型半导体层和有源层连接到第一导电类型半导体层的多个导电通孔 。

公开(公告)号：US20160211190A1

公开(公告)日：2016-07-21

申请号：US14914998

申请日：2013-09-27

Applicant: INTEL CORPORATION

Inventor： Henning BRAUNISCH ,  Feras EID ,  Adel A. ELSHERBINI ,  Johanna M. SWAN ,  Don W. NELSON

IPC: H01L23/367 ,  H01L21/52 ,  H01L23/498

CPC classification number: H01L23/3675 ,  H01L21/52 ,  H01L23/36 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/473 ,  H01L23/49811 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/5389 ,  H01L2924/0002 ,  H05K1/021 ,  H05K1/185 ,  H05K2201/066 ,  H05K2201/10416 ,  H05K2201/10545 ,  H01L2924/00

Abstract: An apparatus including a die, a first side of the die including a first type of system level contact points and a second side including a second type of contact points; and a package substrate coupled to the die and the second side of the die. An apparatus including a die, a first side of the die including a plurality of system level logic contact points and a second side including a second plurality of system level power contact points. A method including coupling one of a first type of system level contact points on a first side of a die and a second type of system level contact points on a second side of the die to a package substrate.

Abstract translation: 一种包括模具的设备，所述模具的第一侧包括第一类型的系统级接触点和包括第二类型的接触点的第二侧; 以及耦合到管芯和管芯的第二侧的封装衬底。 一种包括管芯的设备，所述管芯的第一侧包括多个系统级逻辑接触点和包括第二多个系统级电力接触点的第二侧。 一种方法，包括将管芯的第一侧上的第一类型的系统级接触点中的一个与管芯的第二侧上的第二类型的系统级接触点耦合到封装衬底。

公开(公告)号：US20160183415A1

公开(公告)日：2016-06-23

申请号：US14864048

申请日：2015-09-24

Applicant: Samsung Display Co., Ltd.

Inventor： Minki KIM ,  HwanJin KIM

IPC: H05K7/20 ,  H05K5/00 ,  H05K1/02 ,  G09G3/20

CPC classification number: G09G3/3208 ,  G02F1/133385 ,  G09G2300/0426 ,  G09G2330/045 ,  H05K1/0209 ,  H05K2201/066 ,  H05K2201/10128 ,  H05K2201/1056

Abstract: A display apparatus includes a display panel including a display area and a non-display area, a driving chip disposed in the non-display area, and a heat radiate sheet. The heat radiate sheet includes a first portion disposed on a rear surface of the display panel, a second portion disposed on the driving chip, and a connection portion connecting the first portion and the second portion.

Abstract translation: 显示装置包括显示面板和非显示区域的显示面板，设置在非显示区域的驱动芯片和散热片。 热辐射片包括设置在显示面板的后表面上的第一部分，设置在驱动芯片上的第二部分和连接第一部分和第二部分的连接部分。

公开(公告)号：US20160150631A1

公开(公告)日：2016-05-26

申请号：US14867465

申请日：2015-09-28

Applicant: NEC Corporation

Inventor： Yuki MATSUMOTO

IPC: H05K1/02

CPC classification number: H05K1/0204 ,  H01L23/36 ,  H01L23/40 ,  H05K7/2039 ,  H05K2201/066 ,  H05K2201/10409

Abstract: The object of the present invention is to provide a cooling device capable of more efficiently cooling heating components heated. The cooling device has a first heat sink and a heat conductor. The first heat sink is thermally coupled to a first heating component mounted on a first surface of a circuit board. The heat conductor is thermally coupled to a second heating component mounted on a second surface of the circuit board and is thermally coupled to the first heat sink.

Abstract translation: 本发明的目的是提供一种能够更有效地冷却被加热的加热部件的冷却装置。 冷却装置具有第一散热器和热导体。 第一散热器热耦合到安装在电路板的第一表面上的第一加热部件。 热导体热耦合到安装在电路板的第二表面上的第二加热部件，并且热耦合到第一散热器。

公开(公告)号：US20160135283A1

公开(公告)日：2016-05-12

申请号：US14653522

申请日：2013-12-13

Applicant: VALEO SYSTEMES THERMIQUES

Inventor： Karen Chauvin ,  Xavier Goumain ,  Friedbald Kiel

IPC: H05K1/02 ,  H05K1/18 ,  H05K7/20 ,  H05K1/11

CPC classification number: H05K1/0206 ,  H05K1/115 ,  H05K1/181 ,  H05K7/20163 ,  H05K7/205 ,  H05K7/20854 ,  H05K7/20863 ,  H05K2201/066 ,  H05K2201/09545

Abstract: The invention relates to a cooling device for a printed circuit board, comprising a printed circuit board equipped with at least one face or first face and at least one heat sink (9) brazed to said at least one face of the printed circuit, in which said at least one heat sink (9) can be disposed in a flow of coolant. The invention is suitable for motor vehicles.

Abstract translation: 本发明涉及一种用于印刷电路板的冷却装置，包括装配有至少一个面或第一面的印刷电路板和钎焊到印刷电路的所述至少一个面的至少一个散热器（9），其中 所述至少一个散热器（9）可以设置在冷却剂流中。 本发明适用于机动车辆。

公开(公告)号：US20160027715A1

公开(公告)日：2016-01-28

申请号：US14803889

申请日：2015-07-20

Applicant: J-DEVICES CORPORATION

Inventor： Shinji WATANABE ,  Sumikazu HOSOYAMADA ,  Shingo NAKAMURA ,  Hiroshi DEMACHI ,  Takeshi MIYAKOSHI ,  Tomoshige CHIKAI ,  Kiminori ISHIDO ,  Hiroaki MATSUBARA ,  Takashi NAKAMURA ,  Hirokazu HONDA ,  Yoshikazu KUMAGAYA ,  Shotaro SAKUMOTO ,  Toshihiro IWASAKI ,  Michiaki TAMAKAWA

IPC: H01L23/373 ,  H05K1/18 ,  H01L23/31 ,  H05K1/02 ,  H01L25/065 ,  H01L23/367

CPC classification number: H05K1/181 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/3733 ,  H01L23/4334 ,  H01L23/49816 ,  H01L25/105 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/15331 ,  H01L2924/1815 ,  H05K1/0204 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/141 ,  H05K2201/0275 ,  H05K2201/066 ,  H05K2201/10515 ,  H05K2203/1311 ,  H05K2203/1322 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A stacked semiconductor package includes a first semiconductor package including a first circuit board and a first semiconductor device mounted on the first circuit board; a second semiconductor package including a second circuit board and a second semiconductor device mounted on the second circuit board, the second semiconductor package being stacked on the first semiconductor package; and a heat transfer member provided on the first semiconductor device and a part of the first circuit board, the part being around the first semiconductor device.

Abstract translation: 叠层半导体封装包括：第一半导体封装，包括第一电路板和安装在第一电路板上的第一半导体器件; 第二半导体封装，包括第二电路板和安装在第二电路板上的第二半导体器件，第二半导体封装堆叠在第一半导体封装上; 以及设置在第一半导体器件上的传热部件和第一电路板的一部分，该部分围绕第一半导体器件。

公开(公告)号：US20160021729A1

公开(公告)日：2016-01-21

申请号：US14772155

申请日：2014-03-24

Applicant: MITSUBISHI MATERIALS CORPORATION

Inventor： Yoshiyuki Nagatomo ,  Nobuyuki Terasaki ,  Yoshirou Kuromitsu

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/18

CPC classification number: H05K1/0203 ,  B23K1/0016 ,  B23K1/19 ,  B23K20/023 ,  B23K2101/40 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/18 ,  C04B35/645 ,  C04B37/021 ,  C04B37/026 ,  C04B2235/6562 ,  C04B2235/6581 ,  C04B2237/121 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/127 ,  C04B2237/128 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/708 ,  C04B2237/86 ,  H01L23/36 ,  H01L23/3735 ,  H01L23/4006 ,  H01L23/473 ,  H01L25/07 ,  H01L25/18 ,  H01L2224/32225 ,  H01L2924/13055 ,  H05K1/09 ,  H05K1/181 ,  H05K2201/066 ,  H01L2924/00

Abstract: The present invention provides a power module substrate including an insulating substrate, a circuit layer which is formed on one surface of the insulating substrate, and a metal layer which is formed on the other surface of the insulating substrate, in which the circuit layer has a first aluminum layer made of aluminum or an aluminum alloy which is bonded to the insulating substrate and a first copper layer made of copper or a copper alloy which is bonded to the first aluminum layer by solid-phase diffusion, the metal layer has a second aluminum layer made of aluminum or an aluminum alloy, and a relationship between a thickness t1 of the circuit layer and a thickness t2 of the second aluminum layer of the metal layer satisfy t1

Abstract translation: 本发明提供一种功率模块用基板，其具备绝缘性基板，形成在绝缘基板的一个面上的电路层和形成在绝缘基板的另一方的金属层，电路层具有 由绝缘基板接合的铝或铝合金制成的第一铝层和通过固相扩散与第一铝层接合的由铜或铜合金制成的第一铜层，金属层具有第二铝 由铝或铝合金制成的层，并且电路层的厚度t1与金属层的第二铝层的厚度t2之间的关系满足t1

公开(公告)号：US20160007499A1

公开(公告)日：2016-01-07

申请号：US14856836

申请日：2015-09-17

Applicant: Intel Corporation

Inventor： David W. Song ,  Je-Young Chang

IPC: H05K7/20

CPC classification number: H05K7/20272 ,  H01L23/427 ,  H01L23/473 ,  H01L2224/16 ,  H01L2224/73253 ,  H05K1/0209 ,  H05K7/20218 ,  H05K7/2039 ,  H05K2201/066 ,  Y10T29/4913

Abstract: A heat dissipation lid that includes a plate having a first surface, an opposing second surface, and at least one sidewall extending from the plate second surface. The heat dissipation lid also includes at least one fluid delivery conduit and at least one fluid removal conduit, each extending between the plate first and second surface, and at least one spacing projection extending from the plate second surface to establish and maintain a desired distance between the plate second surface and a microelectronic device, when the heat dissipation lid is positioned to remove heat from the microelectronic device.

Abstract translation: 一种散热盖，其包括具有第一表面，相对的第二表面和从所述板第二表面延伸的至少一个侧壁的板。 散热盖还包括至少一个流体输送管道和至少一个流体移除管道，每个至少一个流体移除管道在板的第一和第二表面之间延伸，以及至少一个从板的第二表面延伸的间隔突起，以建立和保持 板的第二表面和微电子器件，当散热盖定位成从微电子器件移除热量时。