公开(公告)号：US09992866B2

公开(公告)日：2018-06-05

申请号：US15058491

申请日：2016-03-02

Applicant: BIOTRONIK SE & Co. KG

Inventor： Frederik Sporon-Fiedler ,  Bjoern Brunner ,  Jana Carraway ,  Ken Kramer

IPC: A61B5/00 ,  H05K1/03 ,  H05K1/02 ,  A61N1/375 ,  H05K1/11 ,  H05K3/00

CPC classification number: H05K1/0306 ,  A61N1/375 ,  H05K1/02 ,  H05K1/111 ,  H05K1/117 ,  H05K3/0058 ,  H05K3/0067 ,  H05K2201/0108 ,  H05K2201/09145 ,  H05K2201/09845 ,  H05K2201/0999 ,  H05K2203/30

Abstract: An electronic device, in particular for a medical implant, and a printed circuit board arrangement including a printed circuit board, wherein at least one UV-transparent element is at least fixedly coupled to the printed circuit board, wherein the UV-transparent element is intended for fixation of the printed circuit board in an electronic device.

公开(公告)号：US09980376B1

公开(公告)日：2018-05-22

申请号：US15804079

申请日：2017-11-06

Applicant: G-SMATT CO., LTD.

Inventor： Sung Soo Kim ,  Young Woo Lee ,  Ho Joon Lee

IPC: H05K1/00 ,  H05K1/03 ,  H05K1/09 ,  H05K1/14 ,  H05K3/32

CPC classification number: H05K1/0393 ,  G09F13/08 ,  H05K1/0274 ,  H05K1/09 ,  H05K1/147 ,  H05K3/32 ,  H05K3/323 ,  H05K3/361 ,  H05K3/4691 ,  H05K2201/0108 ,  H05K2201/09145 ,  H05K2201/09409 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/2009 ,  H05K2203/0285

Abstract: A durable flexible circuit board for a transparent display board is connected between a driver board provided with at least one of a power supply and a controller and a transparent plate provided with a plurality of light emitting elements. The flexible circuit board includes an electrode bonding portion provided with a plurality of signal connection terminals for transferring control signals, at least one power connection terminal for transferring electric power, and at least one dummy terminal disposed outside the signal connection terminal or the power connection terminal disposed at the outermost side. The dummy terminal resists vibration and pressure applied to the signal connection terminal or the power connection terminal disposed at the outermost side. The signal connection terminal and the power connection terminal are integrated in the flexible circuit board.

公开(公告)号：US20170202086A1

公开(公告)日：2017-07-13

申请号：US15090294

申请日：2016-04-04

Applicant: V-COLOR TECHNOLOGY INC.

Inventor： Con-Ning HUNG

IPC: H05K1/18 ,  F21V23/06 ,  H05K1/09 ,  H05K3/06 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/181 ,  H05K1/0274 ,  H05K1/09 ,  H05K1/117 ,  H05K2201/0108 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/10106 ,  H05K2201/10159 ,  Y02P70/611

Abstract: A memory module and a method of manufacturing the same are disclosed. The memory module includes a substrate, at least one memory, a mask film and at least one light emitting diode. The substrate includes electrical circuit and golden fingers, and a notch is provided at the upper rim of the substrate. The mask film is formed of opaque copper foil, and has a notch and at least one hole close to the upper rim of the substrate. The light emitting diodes are configured on the substrate and connected to the electrical connection circuit, and each light emitting diode is provided at the corresponding hole of the mask film. Thus, light generated by the light emitting diodes passes through the hole and travels outwards along the upper rim of the substrate to form a specific bright pattern, text or strip, thereby enhancing a sense of vision.

公开(公告)号：US20170150629A1

公开(公告)日：2017-05-25

申请号：US15357328

申请日：2016-11-21

Applicant: THOMSON LICENSING

Inventor： Mickey HUNT ,  William P. DERNIER

IPC: H05K5/03 ,  H05K7/14 ,  H01Q13/10 ,  H05K1/18 ,  H01Q1/38 ,  H01Q1/22 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K5/03 ,  H01Q1/2258 ,  H01Q1/38 ,  H01Q13/10 ,  H05K1/02 ,  H05K1/0203 ,  H05K1/117 ,  H05K1/18 ,  H05K3/32 ,  H05K5/02 ,  H05K7/1417 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/10287 ,  H05K2201/10356

Abstract: A wire retention cover for an antenna mounting arrangement within an electronic device is configured to be positioned over an edge of a printed circuit board and protect the antenna wires and connectors on the connector side thereof. A non-connector side portion or leg of the cover includes one or more slots for receiving antenna wires. A connector side portion or leg of the cover includes raised and lowered portions. The raised portions are configured to cover and protect antenna wire connections to the PCB.

公开(公告)号：US20170113600A1

公开(公告)日：2017-04-27

申请号：US15400153

申请日：2017-01-06

Applicant: KOITO MANUFACTURING CO., LTD.

Inventor： Katsutoshi IWAI ,  Hiroshi OTAKA ,  Takayuki KATO

IPC: B60Q1/115 ,  H05K5/02 ,  H05K1/11 ,  H02K7/116 ,  H05K1/18 ,  H02K5/16 ,  H02K11/33 ,  F21S8/10 ,  H05K5/00

CPC classification number: B60Q1/115 ,  B60Q1/076 ,  F21S41/19 ,  F21S41/25 ,  F21S41/39 ,  F21S41/635 ,  F21S41/657 ,  F21S45/47 ,  F21S45/48 ,  F21S45/50 ,  H02K5/04 ,  H02K5/16 ,  H02K5/225 ,  H02K7/116 ,  H02K11/33 ,  H05K1/116 ,  H05K1/184 ,  H05K5/0017 ,  H05K5/0217 ,  H05K2201/09145

Abstract: A motor causes a shaft of an actuator to be displaced in an axis direction thereof, at least part of a circuit for driving the motor being mounted on a circuit board. A notch is formed in an end edge of the circuit board. A protrusion is formed inside a case. The protrusion is fitted into the notch, whereby the circuit board is independently supported inside the case.

公开(公告)号：US09623256B2

公开(公告)日：2017-04-18

申请号：US15000146

申请日：2016-01-19

Applicant: Boston Scientific Neuromodulation Corporation

Inventor： Damon Moazen ,  Robert G. Lamont ,  Robert R. Tong ,  Navin N. Bunyan

IPC: A61N1/372 ,  A61N1/375 ,  A61N1/36 ,  H05K3/30 ,  H05K1/02 ,  H05K1/11

CPC classification number: A61N1/3758 ,  A61N1/36125 ,  A61N1/37229 ,  H05K1/0268 ,  H05K1/117 ,  H05K3/30 ,  H05K2201/09145 ,  H05K2203/162 ,  Y10T29/49004

Abstract: Designs and methods of construction for a printed circuit board (PCB) in an implantable pulse generator (IPG) are disclosed which facilitate IPG PCB testing while also providing for protection of IPG circuitry in a simple and cost effective manner. The IPG PCB is formed as part of a larger test PCB, which includes an extender portion with traces routing nodes of interest in the IPG PCB to an edge connector. IPG electronics are mounted or soldered to the IPG PCB, and then such electronics are tested via the edge connector. The IPG PCB is then singulated from the extender portion in a manner leaving one or more PCB tabs at the severed edge of the PCB. The PCB tab(s) extend from the severed edge, and create an offset distance preventing traces severed and now exposed at the severed edge from contacting and potentially shorting to conductive structures in the IPG.

公开(公告)号：US09573514B2

公开(公告)日：2017-02-21

申请号：US14765656

申请日：2014-02-04

Applicant: KOITO MANUFACTURING CO., LTD.

Inventor： Katsutoshi Iwai ,  Hiroshi Otaka ,  Takayuki Kato

IPC: B60Q1/115 ,  B60Q1/076 ,  H02K5/04 ,  H02K5/22 ,  H05K5/00 ,  H05K5/02 ,  F21S8/10

CPC classification number: B60Q1/115 ,  B60Q1/076 ,  F21S41/19 ,  F21S41/25 ,  F21S41/39 ,  F21S41/635 ,  F21S41/657 ,  F21S45/47 ,  F21S45/48 ,  F21S45/50 ,  H02K5/04 ,  H02K5/16 ,  H02K5/225 ,  H02K7/116 ,  H02K11/33 ,  H05K1/116 ,  H05K1/184 ,  H05K5/0017 ,  H05K5/0217 ,  H05K2201/09145

Abstract: A motor causes a shaft of an actuator to be displaced in an axis direction thereof, at least part of a circuit for driving the motor being mounted on a circuit board. A notch is formed in an end edge of the circuit board. A protrusion is formed inside a case. The protrusion is fitted into the notch, whereby the circuit board is independently supported inside the case.

Abstract translation: 电动机使致动器的轴在其轴向上移位，用于驱动电动机的电路的至少一部分安装在电路板上。 在电路板的端部边缘形成有凹口。 在壳体内部形成突起。 该凸起装配在凹口中，由此电路板独立地支撑在壳体内。

公开(公告)号：US09497860B2

公开(公告)日：2016-11-15

申请号：US13671527

申请日：2012-11-07

Applicant: Lattice Semiconductor Corporation

Inventor： Kihong Kim

IPC: G02B6/42 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40 ,  G02B6/43 ,  H05K1/02 ,  H05K1/14

CPC classification number: H05K1/117 ,  G02B6/42 ,  G02B6/4214 ,  G02B6/4246 ,  G02B6/4292 ,  G02B6/43 ,  H05K1/0274 ,  H05K1/141 ,  H05K3/366 ,  H05K3/403 ,  H05K2201/09072 ,  H05K2201/09145 ,  H05K2201/10121 ,  Y10T29/4913

Abstract: Exemplary embodiments of methods and apparatuses to provide an electro-optical alignment are described. An electrical connector is formed on a printed circuit board substrate that extends onto a side surface of the substrate to form an electrical turn. An optoelectronic die is placed onto the printed circuit board substrate. The optoelectronic die on the printed circuit board substrate is erected over a mounting board to provide optical coupling substantially parallel to the mounting board.

Abstract translation: 描述了提供电光对准的方法和装置的示例性实施例。 电连接器形成在印刷电路板基板上，该印刷电路板基板延伸到基板的侧表面以形成电转弯。 将光电管芯放置在印刷电路板基板上。 印刷电路板基板上的光电管芯竖立在安装板上，以提供基本上平行于安装板的光学耦合。

公开(公告)号：US09485867B2

公开(公告)日：2016-11-01

申请号：US13880589

申请日：2011-10-27

Applicant: Yurie Onitsuka ,  Yousuke Moriyama

Inventor： Yurie Onitsuka ,  Yousuke Moriyama

IPC: H05K1/09 ,  H05K1/18 ,  H01L23/13 ,  H01L23/498 ,  H05K1/02 ,  H01L23/36 ,  H01L33/48 ,  H05K3/00

CPC classification number: H05K1/18 ,  H01L23/13 ,  H01L23/36 ,  H01L23/49805 ,  H01L33/486 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/02 ,  H05K3/0052 ,  H05K3/0061 ,  H05K2201/0769 ,  H05K2201/09145 ,  H05K2201/0919 ,  H05K2201/09845 ,  H01L2924/00011 ,  H01L2924/00

Abstract: A wiring board includes an insulating substrate having a side surface including a protrusion portion or a recess portion and a lower surface having a metal member bonded thereto; a wiring conductor embedded in the insulating substrate and having an exposed portion partially exposed above the protrusion portion or the recess portion from the side surface of the insulating substrate; and a metal member bonded to the lower surface of the insulating substrate. It is possible to suppress occurrence of ion migration between the wiring conductor and the metal member by increasing a distance between the exposed portion and the metal member without increasing a thickness of the wiring board.

Abstract translation: 布线基板包括绝缘基板，该绝缘基板具有包括突出部或凹部的侧表面和与其接合的金属部件的下表面; 嵌入绝缘基板中的布线导体，并且具有从绝缘基板的侧面突出部分或凹部的部分露出的暴露部分; 以及结合到绝缘基板的下表面的金属构件。 通过在不增加布线板的厚度的情况下增加露出部与金属构件的距离，能够抑制布线导体与金属构件之间的离子迁移的发生。

公开(公告)号：US20160249454A1

公开(公告)日：2016-08-25

申请号：US15090730

申请日：2016-04-05

Applicant: International Business Machines Corporation

Inventor： Brian Samuel Beaman

IPC: H05K1/11 ,  H05K3/40

CPC classification number: H05K1/117 ,  H01R12/721 ,  H05K3/403 ,  H05K2201/09145 ,  H05K2201/09909 ,  H05K2201/10863 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A printed circuit board assembly and method of assembly is provided for a printed circuit board having a top and bottom surface with at least one edge portion having a rounded surface extending from the top surface to a point below the top surface and at least one electrical contact pad located on the top surface and extending over the edge portion rounded surface to a point below the top surface.

Abstract translation: 为具有顶表面和底表面的印刷电路板组件和组装方法提供了一种印刷电路板，该印刷电路板具有顶表面和底表面，其中至少一个边缘部分具有从顶表面延伸到顶表面下方的点的圆形表面， 垫位于顶部表面上并且在边缘部分圆形表面上延伸到顶部表面下方的点。