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    Display device
    91.
    发明授权
    Display device 有权
    显示设备

    公开(公告)号：US08493345B2

    公开(公告)日：2013-07-23

    申请号：US12572395

    申请日：2009-10-02

    Applicant: Kouichi Anno

    Inventor： Kouichi Anno

    IPC: G06F3/041

    CPC classification number: H03K17/9622 ,  G06F3/044 ,  G06F2203/04111 ,  H05K1/118 ,  H05K2201/09245 ,  H05K2201/09254 ,  H05K2201/09781 ,  H05K2201/10128

    Abstract: A highly reliable electrostatic-capacitive-type display device with a touch panel which allows a user to perform finger touch inputting and exhibits excellent detection sensitivity is provided. A transparent conductive film is formed above a back surface of an electrostatic-capacitive-type touch panel so as to block noises generated by a display device. A conductive member is provided to supply a voltage to a transparent conductive film formed above a back surface of the touch panel. An electrode which is formed on the electrostatic-capacitive-type touch panel is divided in accordance with a ratio between the number of X electrodes and the number of Y electrodes. A floating electrode is formed in a gap defined between the electrodes so as to adjust an area of the electrode. Due to the shrinkage of the area of the electrode, it is possible to lower a noise level to a level equal to or lower than a signal level. Accordingly, an S/N ratio is increased thus enhancing detection sensitivity. Further, lines are branched on a flexible printed circuit board and intersecting lines are formed on a back surface of the flexible printed circuit board, and the intersecting lines are made to orthogonally intersect with lines formed on a front surface of the flexible printed circuit board thus lowering line capacitance.

    Abstract translation: 提供了具有触摸面板的高度可靠的静电电容型显示装置，其允许用户执行手指触摸输入并且显示出优异的检测灵敏度。 在静电电容型触摸面板的背面上形成透明导电膜，以阻止由显示装置产生的噪声。 提供导电构件以向形成在触摸面板的背面上方的透明导电膜提供电压。 根据X电极的数量和Y电极的数量之间的比例，分离形成在静电电容型触摸面板上的电极。 浮动电极形成在限定在电极之间的间隙中，以调节电极的面积。 由于电极区域的收缩，可以将噪声电平降低到等于或低于信号电平的电平。 因此，S / N比增加，从而提高检测灵敏度。 此外，线在柔性印刷电路板上分支，并且在柔性印刷电路板的后表面上形成相交线，并且使交叉线与形成在柔性印刷电路板的前表面上的线正交相交，因此 降低线路电容。

    Via structure for multi-gigahertz signaling
    92.
    发明授权
    Via structure for multi-gigahertz signaling 失效
    通过多吉赫兹信号的结构

    公开(公告)号：US08487195B2

    公开(公告)日：2013-07-16

    申请号：US12717570

    申请日：2010-03-04

    Applicant: Shengli Lin

    Inventor： Shengli Lin

    IPC: H05K1/11

    CPC classification number: H05K1/162 ,  H05K1/0222 ,  H05K1/0251 ,  H05K2201/0969 ,  H05K2201/09718 ,  H05K2201/09781

    Abstract: A via structure is disclosed to pass electronic signals from a first conductive pathway formed on a first outermost substrate of a multi-layer PCB to a second conductive pathway formed on a second outermost substrate of the multi-layer PCB. The via structure allows the electronic signals to pass from the first outermost substrate through one or more inner substrates to the second outermost substrate. The one or more inner substrates include one or more closed geometric structures to enclose the via structure.

    Abstract translation: 公开了一种通孔结构，用于将形成在多层PCB的第一最外层衬底上的第一导电通路的电子信号传递到形成在多层PCB的第二最外层衬底上的第二导电通路。 通孔结构允许电子信号从第一最外面的衬底通过一个或多个内部衬底到第二最外面的衬底。 一个或多个内部基板包括一个或多个闭合的几何结构以封闭通孔结构。

    ADHESIVE DAM
    94.
    发明申请
    ADHESIVE DAM 有权
    粘合丹

    公开(公告)号：US20130170164A1

    公开(公告)日：2013-07-04

    申请号：US13340345

    申请日：2011-12-29

    Applicant: Jing-En Luan ,  Hk Looi

    Inventor： Jing-En Luan ,  Hk Looi

    IPC: H05K7/06 ,  H05K3/30 ,  H05K1/16

    CPC classification number: H05K3/305 ,  H05K3/321 ,  H05K3/3421 ,  H05K2201/09781 ,  H05K2201/09909 ,  Y02P70/613 ,  Y10T29/4913

    Abstract: On a circuit substrate on which an adhesive is used to couple electronic or structural components to the substrate, an adhesive dam is positioned to prevent the adhesive from interfering with the operation of the circuit. A contact pad can be provided at a selected location and with a selected shape, and solder deposited on the pad, then reflowed to form the dam. The dam can be a structure soldered to a contact pad, or the dam can be supported at its ends by another structure of the device, so that, at the location where it functions to contain the adhesive, it is not attached to the substrate.

    Abstract translation: 在其上使用粘合剂将电子或结构部件耦合到基板的电路基板上，设置粘合剂阻挡层以防止粘合剂干扰电路的操作。 可以在选定的位置提供接触垫并具有选定的形状，并将焊料沉积在垫上，然后回流以形成坝。 大坝可以是焊接到接触垫的结构，或者可以通过设备的另一种结构在其端部处支撑坝，使得在其用于容纳粘合剂的位置处，该坝不附着到基底。

    Packaging structure having embedded semiconductor element
    96.
    发明授权
    Packaging structure having embedded semiconductor element 有权
    具有嵌入式半导体元件的封装结构

    公开(公告)号：US08461689B2

    公开(公告)日：2013-06-11

    申请号：US12876674

    申请日：2010-09-07

    Applicant: Kan-Jung Chia

    Inventor： Kan-Jung Chia

    IPC: H01L23/48

    CPC classification number: H01L21/50 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24227 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/185 ,  H05K3/0032 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/10674 ,  H01L2924/00

    Abstract: A packaging structure having an embedded semiconductor element includes: a substrate having opposite first and second surfaces and at least an opening penetrating the first and second surfaces; a first metallic frame disposed around the periphery of the opening on the first surface; a semiconductor chip received in the opening and having an active surface formed with a plurality of electrode pads and an opposite inactive surface; two first dielectric layers formed on the active surface and the inactive surface of the chip, respectively; a first wiring layer formed on the first dielectric layer of the first surface; and a first built-up structure disposed on the first dielectric layer and the first wiring layer. A shape of the opening is precisely controlled through the first metallic frame around the periphery of the predefined opening region, thereby allowing the chip to be precisely embedded in the substrate.

    Abstract translation: 具有嵌入式半导体元件的封装结构包括：具有相对的第一表面和第二表面的至少一个穿透第一表面和第二表面的开口的基底; 第一金属框架，设置在所述第一表面上的所述开口的周边周围; 半导体芯片接收在开口中并具有形成有多个电极焊盘和相对的无效表面的有源表面; 分别形成在芯片的有源表面和非活性表面上的两个第一电介质层; 第一布线层，形成在第一表面的第一介电层上; 以及设置在第一电介质层和第一布线层上的第一组合结构。 通过围绕预定开口区域的周边的第一金属框架精确地控制开口的形状，从而允许芯片被精确地嵌入在基板中。

    Module connection structure
    98.
    发明授权
    Module connection structure 有权
    模块连接结构

    公开(公告)号：US08441797B2

    公开(公告)日：2013-05-14

    申请号：US12868798

    申请日：2010-08-26

    Applicant: Ryo Mochizuki

    Inventor： Ryo Mochizuki

    IPC: H05K1/14

    CPC classification number: H05K1/141 ,  H05K1/0243 ,  H05K1/025 ,  H05K1/142 ,  H05K1/181 ,  H05K3/0061 ,  H05K3/3405 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10189 ,  H05K2201/1028 ,  H05K2201/10409 ,  H05K2201/10446

    Abstract: According to one embodiment, a module connection structure designed to connect a module to other modules. The module includes a dielectric layer, a micro-strip path, a projection, and a plurality of gain adjusting lands. The dielectric layer is formed on a substrate. The micro-strip path is provided on the dielectric layer and configured to transmit a transmission signal input to one end portion, to the other end portion. The projection is formed at edges of the substrate, which are adjacent to the other modules, and protruding from the micro-strip path and the dielectric layer toward the other modules. The plurality of gain adjusting lands is formed adjacent to the micro-strip path, for use in adjusting an input/output gain of the module. The gain adjusting lands uncouple from the micro-strip path or other gain adjusting lands couple to the micro-strip path, thereby to adjust the input/output gain of the module.

    Abstract translation: 根据一个实施例，设计用于将模块连接到其他模块的模块连接结构。 该模块包括电介质层，微带路径，投影和多个增益调整区域。 介电层形成在基板上。 微带路径设置在电介质层上，并被配置为将输入到一个端部的传输信号传输到另一端部。 突起形成在与其他模块相邻的基板的边缘处，并且从微带路径和介电层向另一个模块突出。 多个增益调整区域形成为与微带路径相邻，用于调整模块的输入/输出增益。 增益调整平台从微带路径分离或其他增益调整平台耦合到微带路径，从而调整模块的输入/输出增益。

    Interconnect Board
    99.
    发明申请
    Interconnect Board 有权
    互连板

    公开(公告)号：US20130114229A1

    公开(公告)日：2013-05-09

    申请号：US13290223

    申请日：2011-11-07

    Applicant: Lothar Schmidt ,  Christoph Kutscher

    Inventor： Lothar Schmidt ,  Christoph Kutscher

    IPC: H05K7/10

    CPC classification number: H05K1/0286 ,  H05K1/142 ,  H05K2201/09781

    Abstract: A combination of an interconnect board and a module board for connecting a plurality of electronic modules to a processing unit is described. The interconnect board comprises a plurality of interconnect data lines connected between a plurality of interconnect board input terminals and interconnect board output terminals. The module board comprises at least one electronic module connected to a module connection input terminal, a plurality of module board data lines connected between a plurality of module board input terminals and a plurality of module board output terminals, and an unconnected module board output terminal. A first one of the interconnect board output terminals is connectable to the module connection input terminal, and the unconnected module board output terminal is connectable to one of the interconnect board input terminals.

    Abstract translation: 描述了用于将多个电子模块连接到处理单元的互连板和模块板的组合。 互连板包括连接在多个互连板输入端子和互连板输出端子之间的多个互连数据线。 模块板包括连接到模块连接输入端子的至少一个电子模块，连接在多个模块板输入端子和多个模块板输出端子之间的多个模块板数据线以及未连接的模块板输出端子。 互连板输出端子中的第一个可连接到模块连接输入端子，未连接的模块板输出端子可连接到互连板输入端子之一。

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