公开(公告)号：US07229297B2

公开(公告)日：2007-06-12

申请号：US10836100

申请日：2004-04-30

Applicant: Brian Gobrogge ,  Gordon Andrews

Inventor： Brian Gobrogge ,  Gordon Andrews

IPC: H01R4/58

CPC classification number: H01R13/2414 ,  H01R12/7005 ,  H01R12/721 ,  H05K3/325 ,  H05K3/403 ,  H05K2201/0314 ,  H05K2201/10386

Abstract: A method and system for connecting and using a circuit board connected to a conductive element is disclosed. The circuit board includes a backstop and a plurality of conductive traces positioned on an edge. The conductive element includes a plurality of conductive layers and a plurality of insulating layers alternately placed along the length of the conductive element. The conductive element is placed between the edge of the circuit board having the conductive traces and a clasp prior to inserting the circuit board into the clasp. The conductive element is conformed between the circuit board and the clasp. Each conductive trace contacts a conductive layer as a result of the insertion. The backstop conforms an extending portion of the conductive element to be substantially perpendicular to the circuit board. The assembled device can be used to provide charge to a plurality of electrodes on a substrate simultaneously.

Abstract translation: 公开了一种用于连接和使用连接到导电元件的电路板的方法和系统。 电路板包括位于边缘上的止回和多个导电迹线。 导电元件包括​​沿着导电元件的长度交替放置的多个导电层和多个绝缘层。 在将电路板插入表扣之前，将导电元件放置在具有导电迹线的电路板的边缘和扣环之间。 导电元件在电路板和扣环之间是一致的。 导电迹线由于插入而与导电层接触。 逆止器使导电元件的延伸部分基本上垂直于电路板。 组装的器件可以用于同时向衬底上的多个电极提供电荷。

公开(公告)号：US07196402B2

公开(公告)日：2007-03-27

申请号：US10937647

申请日：2004-09-08

Applicant: Gabe Cherian

Inventor： Gabe Cherian

IPC: H01L23/495

CPC classification number: H01L24/12 ,  H01L23/49555 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/97 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/3426 ,  H05K2201/09418 ,  H05K2201/10318 ,  H05K2201/10386 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10825 ,  Y02P70/613 ,  H01L2224/29099 ,  H01L2924/00

Abstract: The present invention relates generally to permanent interconnections between electronic devices, such as integrated circuit packages, chips, wafers and printed circuit boards or substrates, or similar electronic devices. More particularly it relates to high-density electronic devices.The invention describes means and methods that can be used to counteract the undesirable effects of thermal cycling, shock and vibrations and severe environment conditions in general.For leaded devices, the leads are oriented to face the thermal center of the devices and the system they interact with.For leadless devices, the mounting elements are treated or prepared to control the migration of solder along the length of the elements, to ensure that those elements retain their desired flexibility.

Abstract translation: 本发明一般涉及电子设备之间的永久互连，例如集成电路封装，芯片，晶片和印刷电路板或基板或类似的电子设备。 更具体地说，涉及高密度电子设备。

公开(公告)号：US07189083B2

公开(公告)日：2007-03-13

申请号：US10509200

申请日：2003-04-01

Applicant: Jack Seidler ,  Aleksandr Zhitomirsky

Inventor： Jack Seidler ,  Aleksandr Zhitomirsky

IPC: H01R12/00

CPC classification number: B23K3/0607 ,  B23K3/0638 ,  B23K2101/40 ,  H01L2224/1302 ,  H01L2224/16105 ,  H01L2224/16155 ,  H01L2924/0002 ,  H05K3/3405 ,  H05K3/341 ,  H05K3/3426 ,  H05K2201/10371 ,  H05K2201/10386 ,  H05K2201/1084 ,  H05K2201/10984 ,  H05K2203/0195 ,  H05K2203/0405 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of retaining a solder mass to a solder-bearing article is provided and includes the steps of: (a) forming a plurality of openings in the solder-bearing article; (b) disposing a length of solder mass over at least some of the plurality of openings; and forming a plurality of solder rivets along the length of the solder mass. The solder rivets serve to retain the length of solder mass to the solder-bearing article. The solder-bearing article includes any number of different types of components where a solder mass is held thereby, e.g., leads, terminals, connectors, electromagnetic shields, etc.

Abstract translation: 提供了将焊料块保持在焊料轴承制品上的方法，包括以下步骤：（a）在所述含锡制品中形成多个开口; （b）在所述多个开口中的至少一些开口处设置长度的焊料块; 以及沿焊料块的长度形成多个焊接铆钉。 焊接铆钉用于将焊料质量的长度保持在焊接轴承制品上。 焊接轴承制品包括任何数量的不同类型的组件，其中保持焊料块，例如引线，端子，连接器，电磁屏蔽等

公开(公告)号：US20060057902A1

公开(公告)日：2006-03-16

申请号：US10509200

申请日：2003-04-01

Applicant: Jack Seidler ,  Aleksandr Zhitomirsky

Inventor： Jack Seidler ,  Aleksandr Zhitomirsky

IPC: H01R4/02

CPC classification number: B23K3/0607 ,  B23K3/0638 ,  B23K2101/40 ,  H01L2224/1302 ,  H01L2224/16105 ,  H01L2224/16155 ,  H01L2924/0002 ,  H05K3/3405 ,  H05K3/341 ,  H05K3/3426 ,  H05K2201/10371 ,  H05K2201/10386 ,  H05K2201/1084 ,  H05K2201/10984 ,  H05K2203/0195 ,  H05K2203/0405 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of retaining a solder mass to a solder-bearing article is provided and includes the steps of: (a) forming a plurality of openings in the solder-bearing article; (b) disposing a length of solder mass over at least some of the plurality of openings; and forming a plurality of solder rivets along the length of the solder mass. The solder rivets serve to retain the length of solder mass to the solder-bearing article. The solder-bearing article includes any number of different types of components where a solder mass is held thereby, e.g., leads, terminals, connectors, electromagnetic shields, etc.

Abstract translation: 提供了将焊料块保持在焊料轴承制品上的方法，包括以下步骤：（a）在所述含锡制品中形成多个开口; （b）在所述多个开口中的至少一些开口处设置长度的焊料块; 以及沿焊料块的长度形成多个焊接铆钉。 焊接铆钉用于将焊料质量的长度保持在焊接轴承制品上。 焊接轴承制品包括任何数量的不同类型的组件，其中保持焊料块，例如引线，端子，连接器，电磁屏蔽等

公开(公告)号：US20050189566A1

公开(公告)日：2005-09-01

申请号：US10746660

申请日：2003-12-26

Applicant: Tadahiko Matsumoto ,  Syuichi Honda ,  Yasuo Ohashi ,  Naoto Sano

Inventor： Tadahiko Matsumoto ,  Syuichi Honda ,  Yasuo Ohashi ,  Naoto Sano

IPC: H02M3/28 ,  H01L31/109 ,  H02M3/335 ,  H02M7/00 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36

CPC classification number: H02M7/003 ,  H02M3/33538 ,  H02M2001/0074 ,  H05K1/144 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/368 ,  H05K2201/10386

Abstract: A switching power-supply module includes circuit boards, power conversion circuit sections provided on the respective circuit boards, conductor land patterns provided with spacing therebetween along edges of the circuit boards, conductor terminals for interconnecting the conductor land patterns. The circuit boards are stacked with spacing therebetween with the corresponding conductor land patterns being aligned, and the aligned conductor land patterns are interconnected by the corresponding conductor terminals. At least one of the conductor terminals includes an interboard-connection portion for interconnecting the conductor land patterns of the circuit boards and a leg portion that extends from the interboard-connection portion in the stacking direction of the circuit boards and that defines an external-connection portion, and the other conductor terminals each function as an interboard-connection dedicated terminal for providing connection between the circuit boards.

Abstract translation: 开关电源模块包括电路板，设置在各个电路板上的功率转换电路部分，沿着电路板的边缘设置有间隔的导体焊盘图案，用于互连导体焊盘图案的导体端子。 电路板之间具有间隔地堆叠，相应的导体焊盘图案对准，并且对准的导体焊盘图案通过相应的导体端子互连。 至少一个导体端子包括用于互连电路板的导体焊盘图案的板间连接部分和从电路板的层叠方向上从板间连接部分延伸的脚部分，并且限定外部连接 部分，其他导体端子各自用作板间连接专用端子，用于提供电路板之间的连接。

公开(公告)号：US06897078B2

公开(公告)日：2005-05-24

申请号：US10697898

申请日：2003-10-30

Applicant: David Kautz ,  Howard Morgenstern ,  Roy J. Blazek

Inventor： David Kautz ,  Howard Morgenstern ,  Roy J. Blazek

IPC: H01L21/66 ,  H05K1/00 ,  H05K1/03 ,  H05K1/14 ,  H05K1/18 ,  H05K3/28

CPC classification number: H05K1/181 ,  H01L22/22 ,  H01L2924/0002 ,  H05K1/0286 ,  H05K1/0306 ,  H05K1/141 ,  H05K3/284 ,  H05K2201/10386 ,  H05K2201/10636 ,  H05K2203/1572 ,  H05K2203/176 ,  Y02P70/611 ,  H01L2924/00

Abstract: A multi-chip module comprising a low-temperature co-fired ceramic substrate having a first side on which are mounted active components and a second side on which are mounted passive components, wherein this segregation of components allows for hermetically sealing the active components with a cover while leaving accessible the passive components, and wherein the passive components are secured using a reflow soldering technique and are removable and replaceable so as to make the multi-chip module substantially programmable with regard to the passive components.

Abstract translation: 一种多芯片模块，包括具有第一侧的低温共烧陶瓷基板，其上安装有有源部件，第二侧安装有无源部件，其中部件的这种偏析允许用一个 盖，同时使无源部件可接近，并且其中使用回流焊接技术来固定无源部件，并且是可拆卸和可更换的，以使得多芯片模块基本上可被无源组件编程。

公开(公告)号：US20050079748A1

公开(公告)日：2005-04-14

申请号：US10948667

申请日：2004-09-24

Applicant: Myoung-Kon Kim

Inventor： Myoung-Kon Kim

IPC: G09F9/00 ,  H01J17/16 ,  H01R4/34 ,  H01R4/66 ,  H05K3/32

CPC classification number: H05K1/0215 ,  H01R4/34 ,  H01R4/66 ,  H05K3/325 ,  H05K2201/10295 ,  H05K2201/10386 ,  H05K2201/10401 ,  H05K2201/10409

Abstract: A coupling and grounding structure of a plasma display device for grounding a circuit board effectively, and fixing the circuit board stably. The plasma display device includes a plasma display panel having a display area, on which images are displayed; a chassis base coupled to a back surface of the plasma display panel; at least one circuit board, on which at least one electronic element for driving the plasma display panel is mounted, the circuit board having a conductive portion and at least one coupling hole to be coupled to the chassis base by a bolt member penetrating the coupling hole; and at least a conductive member which contacts the conductive portion and the bolt member in the coupling hole.

Abstract translation: 用于有效地接地电路板的等离子体显示装置的耦合和接地结构，并且稳定地固定电路板。 等离子体显示装置包括具有显示区域的等离子体显示面板，显示图像; 耦合到所述等离子体显示面板的后表面的底架; 至少一个电路板，其上安装有用于驱动等离子体显示面板的至少一个电子元件，所述电路板具有导电部分和至少一个耦合孔，以通过穿过所述耦合孔的螺栓构件联接到所述底架 ; 以及至少一个与所述连接孔中的导电部分和螺栓构件接触的导电构件。

公开(公告)号：US06863578B2

公开(公告)日：2005-03-08

申请号：US10432100

申请日：2001-11-16

Applicant: Frank Templin ,  Hans-Peter Martin ,  Karl Rehnelt

Inventor： Frank Templin ,  Hans-Peter Martin ,  Karl Rehnelt

IPC: H01R12/52 ,  H01R12/57 ,  H05K3/34 ,  H05K3/36 ,  H05K7/14 ,  H01R4/02

CPC classification number: H01R12/57 ,  H01R12/52 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/366 ,  H05K2201/10386 ,  H05K2201/10924 ,  H05K2201/10984

Abstract: A holding element with a holding clip for holding a carrier board is soldered freestanding to a printed circuit board (PCB). The holding element has first and second holding arms that extend from a supporting region and form a receiving region therebetween. The first holding arm is connected to a first leg and the second holding arm is connected to a second leg. The first and second legs each have a base in an end region. At least one of the legs has a curved surface in the region of the base so that the holding element can be soldered to the PCB. The holding element being made of a strip material, and the first and second holding arms each having an outward bend forming a transition into the first and second legs, respectively.

Abstract translation: 具有用于保持承载板的保持夹的保持元件被独立地焊接到印刷电路板（PCB）。 保持元件具有从支撑区域延伸并在其间形成接收区域的第一和第二保持臂。 第一保持臂连接到第一腿部，第二保持臂连接到第二腿部。 第一和第二腿各自在端部区域中具有基部。 至少一个腿在基部的区域中具有弯曲表面，使得保持元件可以焊接到PCB。 保持元件由条带材料制成，并且第一和第二保持臂各自具有分别形成向第一和第二腿部的过渡的向外弯曲部。

公开(公告)号：US20040248437A1

公开(公告)日：2004-12-09

申请号：US10453119

申请日：2003-06-03

Inventor： Marvin Glenn Wong

IPC: H01R012/00

CPC classification number: H05K3/3405 ,  H01R12/721 ,  H01R43/205 ,  H05K1/0306 ,  H05K1/117 ,  H05K3/0061 ,  H05K2201/10386 ,  H05K2201/10856

Abstract: Devices and methods are disclosed for reinforcing substrates having edge-mount connectors. In one embodiment, the device comprises a fragile substrate, a reinforcement plate bonded to the substrate, and an edge-mount connector mated with the substrate and the reinforcement plate.

Abstract translation: 公开了用于加强具有边缘安装连接器的基板的装置和方法。 在一个实施例中，该装置包括易碎基板，与基板结合的加强板，以及与基板和加强板配合的边缘安装连接器。

公开(公告)号：US20040240187A1

公开(公告)日：2004-12-02

申请号：US10853125

申请日：2004-05-26

Inventor： Naritomo Takabatake ,  Hiroshi Nakamura

IPC: H05K005/00 ,  H05K005/04 ,  H01L023/02 ,  H05K005/06

CPC classification number: H05K3/3405 ,  H01R13/405 ,  H01R13/5216 ,  H01R43/24 ,  H05K5/0091 ,  H05K2201/10287 ,  H05K2201/10386 ,  H05K2201/10962 ,  H05K2201/10977

Abstract: An electronic component has a casing having a resin injecting section having at least one wall. At least one circuit board is housed in the casing, next to the resin injecting section via the wall. At least one lead terminal is provided in the casing. The lead terminal has a first end and a second end, and a middle section connected between the first and second ends. The first end of the lead terminal is connected to the circuit board in a way that the middle section of the lead terminal is provided as straddling the wall of the resin injecting section. Also provided is at least one lead wire having a third end and a fourth end. The third end of the lead wire is connected to the second end of the lead terminal in the resin injecting section. The fourth end of the lead wire is pulled out from the casing. The third end of the lead wire and the second end of the lead terminal connected to each other are embedded in resin injected in the resin injecting section whereas the middle section of the lead terminal straddling the wall of the resin injecting section is not embedded in the resin. In stead of straddling the wall of the resin injecting section, the middle section of the lead terminal may be inserted into an opening provided on the wall and connected to the circuit board.

Abstract translation: 电子部件具有具有至少一个壁的树脂注入部的壳体。 至少一个电路板通过墙壁容纳在壳体中，靠近树脂注入部分。 至少一个引线端子设置在壳体中。 引线端子具有第一端和第二端，以及连接在第一端和第二端之间的中间部分。 引线端子的第一端以与引线端子的中间部分设置成跨越树脂注入部分的壁的方式连接到电路板。 还提供了至少一个具有第三端和第四端的引线。 引线的第三端与树脂注入部的引线端子的第二端连接。 引线的第四端从外壳中拉出。 导线的第三端和彼此连接的引线端子的第二端嵌入注入树脂注入部分的树脂中，而跨越树脂注入部分的壁的引线端子的中间部分不嵌入在 树脂。 代替跨越树脂注入部分的壁，引线端子的中间部分可插入设置在壁上的开口并连接到电路板。