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    Method of making solder shape array package
    95.
    发明授权
    Method of making solder shape array package 失效
    焊料形状阵列封装方法

    公开(公告)号：US5531021A

    公开(公告)日：1996-07-02

    申请号：US366801

    申请日：1994-12-30

    Applicant: Frank Kolman ,  Kevin Haley

    Inventor： Frank Kolman ,  Kevin Haley

    IPC: H01L21/48 ,  H01L23/498 ,  H05K3/34 ,  H01K3/10

    CPC classification number: H01L21/486 ,  H01L23/49827 ,  H05K3/3468 ,  H01L2924/0002 ,  H05K2201/09572 ,  H05K2201/10666 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/128 ,  H05K3/3436 ,  Y10T29/49149 ,  Y10T29/49165

    Abstract: A surface mount package for an electronic device has an array of solder shapes or structures projecting from the bottom surface of the package. The solder structures are cast in place on the package substrate using a wave solder process. The solder also fills via holes in the substrate at each solder structure site. An integrated circuit is bonded to the top surface of the substrate using a conventional tape automated bonding (TAB) process or other suitable bonding process. The preferred shape of the solder structure is a cone, but other shapes, including hemispheres, columns and pyramids can be produced using a mold with suitably shaped cavities. The mold is preferably as large as an entire substrate panel so that a large number of device sites can be processed simultaneously.

    Abstract translation: 用于电子设备的表面贴装封装具有从封装的底表面突出的焊料形状或结构的阵列。 使用波峰焊工艺将焊料结构浇铸在封装衬底上的适当位置。 焊料还通过每个焊料结构部位的基板上的孔填充。 集成电路使用传统的带式自动接合（TAB）工艺或其它合适的粘结工艺结合到衬底的顶表面。 焊料结构的优选形状是锥体，但是可以使用具有合适形状的腔的模具来生产包括半球，柱和金字塔的其它形状。 模具优选地与整个基板面板一样大，从而能够同时处理大量的装置位置。

    Cardlike electronic device
    97.
    发明授权
    Cardlike electronic device 失效
    卡式电子设备

    公开(公告)号：US5418688A

    公开(公告)日：1995-05-23

    申请号：US38423

    申请日：1993-03-29

    Applicant: Allen D. Hertz ,  David A. Tribbey ,  Kenneth Cook ,  Arthur L. A. Baker

    Inventor： Allen D. Hertz ,  David A. Tribbey ,  Kenneth Cook ,  Arthur L. A. Baker

    IPC: G06K19/077 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34 ,  H05K3/36

    CPC classification number: H05K1/186 ,  G06K19/077 ,  H05K1/144 ,  H05K3/368 ,  H05K1/182 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/10666 ,  H05K2203/087 ,  H05K3/341 ,  H05K3/3436 ,  H05K3/3489 ,  H05K3/3494 ,  H05K3/462

    Abstract: An electronic device (100) comprises a first substrate (102) having a first circuit pattern disposed thereon which is selectively processed to provide pretinned connection pads (108, 116, 124, 132, 140) for connection to at least one electronic component (142) and a second circuit pattern disposed on a second substrate (104). The second circuit pattern disposed on the second substrate (104) is selectively processed to further provide pretinned connection pads (110, 118, 126) for connection to the first circuit pattern, and the second substrate (104) further has relief provided within a portion thereof to position the at least one electronic component (142) with respect to the pretinned connection pads (108, 116, 124, 132, 140) on the first circuit pattern. The pretinned connection pads (108, 116, 124, 132, 140, 110, 118, 126) are processed using a low residue fluxing agent to enable processing of the first (102) and second (104) substrates and the at least one electronic component (142) in a single operation through an envelope heating device without a requirement for cleaning after reflow.

    Abstract translation: 电子设备（100）包括第一衬底（102），其具有布置在其上的第一电路图案，其被选择性地处理以提供用于连接到至少一个电子部件（142）的预先安装的连接焊盘（108,116,124,132,140） ）和设置在第二基板（104）上的第二电路图案。 布置在第二基板（104）上的第二电路图案被选择性地处理以进一步提供用于连接到第一电路图案的预先安装的连接焊盘（110,118,126），并且第二基板（104）还具有设置在第一基板 以相对于第一电路图案上的预先设计的连接焊盘（108,116,124,132,140）定位所述至少一个电子部件（142）。 使用低残留助熔剂处理预先安装的连接焊盘（108,116,124,132,140,​​110,118,126），以使得能够处理第一（102）和第二（104）衬底和至少一个电子 组件（142）通过信封加热装置进行单次操作，而不需要在回流之后进行清洁。

    Feedthrough via connection
    98.
    发明授权
    Feedthrough via connection 失效
    通过连接通过

    公开(公告)号：US5416278A

    公开(公告)日：1995-05-16

    申请号：US024046

    申请日：1993-03-01

    Applicant: Fred E. Ostrem ,  Alfred G. Ocken

    Inventor： Fred E. Ostrem ,  Alfred G. Ocken

    IPC: H05K1/00 ,  H05K1/02 ,  H05K1/05 ,  H05K1/11 ,  H05K3/00 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K3/44

    CPC classification number: H05K3/44 ,  H05K3/363 ,  H05K1/0206 ,  H05K1/0393 ,  H05K1/05 ,  H05K1/111 ,  H05K2201/0195 ,  H05K2201/0305 ,  H05K2201/0347 ,  H05K2201/09554 ,  H05K2201/10666 ,  H05K2201/10977 ,  H05K3/0061 ,  H05K3/305 ,  H05K3/3452 ,  H05K3/4038

    Abstract: A method for constructing a feedthrough via connection and a corresponding apparatus includes a metallic plate (101), or rigidizer, preferably composed of an aluminum material. A solderable contact area (103), is located on the plate (101). This contact area (103) is preferable comprised of a copper material selectively disposed by a plasma spraying process. Next, an electrically insulating adhesive layer (105) is disposed onto the plate (101). This adhesive layer (105) has a feedthrough via (106) disposed therethrough aligned with the contact area (103). Then, a substrate (109), preferably composed of a flexible composite polyimide material, is disposed onto the adhesive layer (105). This flexible substrate (109) has a via (110) disposed therethrough with a solderable area (111) disposed thereon. Then, a quantity of solder (113) is disposed onto the solderable area (111), and the assembly (100) is heated so that the solder (113) flows into the vias (106) and (110), thereby providing an electrical connection including the solderable area (111) of the via (110), the solder (113), and the contact area (103). During this reflow step, the structure of the adhesive layer (105) acts as a soldermask preventing the solder (113) from flowing outside of an area defined by the via (106).

    Abstract translation: 通过连接构造馈通方法和相应的装置包括优选由铝材料组成的金属板（101）或刚性机构。 可焊接接触区域（103）位于板（101）上。 该接触区域（103）优选由通过等离子体喷涂工艺选择性地设置的铜材料构成。 接下来，将电绝缘性粘合剂层（105）设置在板（101）上。 该粘合剂层（105）具有穿过通孔（106），其穿过与接触区域（103）对齐。 然后，将优选由柔性复合聚酰亚胺材料构成的基板（109）设置在粘合剂层（105）上。 该柔性基板（109）具有穿过其中设置有可焊接区域（111）的通孔（110）。 然后，将一定量的焊料（113）设置在可焊接区域（111）上，并且组装（100）被加热，使得焊料（113）流入通孔（106）和（110），从而提供电气 包括通孔（110）的可焊接区域（111），焊料（113）和接触区域（103）的连接。 在该回流步骤期间，粘合剂层（105）的结构用作焊接掩模，防止焊料（113）流过由通孔（106）限定的区域的外部。

    Method for making 3-D electrical circuitry
    99.
    发明授权
    Method for making 3-D electrical circuitry 失效
    制造三维电路的方法

    公开(公告)号：US5307561A

    公开(公告)日：1994-05-03

    申请号：US991735

    申请日：1992-11-27

    Applicant: Haim Feigenbaum ,  William R. Crumly ,  Christopher M. Schreiber

    Inventor： Haim Feigenbaum ,  William R. Crumly ,  Christopher M. Schreiber

    IPC: G01R1/073 ,  G01R31/02 ,  H01H1/14 ,  H01L21/66 ,  H01R12/00 ,  H05K1/11 ,  H05K3/20 ,  H05K3/32 ,  H05K3/36 ,  H05K3/40 ,  H05K3/02

    CPC classification number: G01R1/073 ,  H05K3/205 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/10666 ,  H05K2203/0113 ,  H05K2203/0152 ,  H05K2203/0726 ,  H05K2203/167 ,  H05K3/365 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49158

    Abstract: Shaped contacts (40, 42) for interconnecting circuits or for use in an integrated circuit test probe are electroplated as integral parts of circuit traces (34) upon a stainless steel mandrel (10). A shaped, hardened steel indentation tool (16, 18, 26, 28) makes indentations (24a, 24b) of predetermined shape in the surface of the mandrel (10), which is provided with a pattern of dielectric, such as Teflon (12), or photoresist. Areas of the steel mandrel, including the indentations (24a,24b), are electroplated with a pattern of conductive material (34, 36, 38), and a dielectric substrate (32) is laminated to the conductive material. The circuit features formed by the indentations define raised contacts of a conical (18) or pyramidal (28) shape, having free ends with a small area that allows higher pressures to be applied to a surface against which the contacts are pressed. This enables the contacts to penetrate foreign materials, such as oxides, that may form on the surface of the pads (56, 58), to which the contacts are to be connected to ensure a good contact without any need for wiping action. The projecting contacts can also be pressed into plated holes (82, 84) in a substrate, such as a printed wiring board, to which mateable/demateable electrical connection is to be made.

    Abstract translation: 用于互连电路或用于集成电路测试探针的成形触点（40,42）作为电路迹线（34）作为不锈钢芯棒（10）的整体部件进行电镀。 成形的硬化钢压痕工具（16,18,26,28）在心轴（10）的表面中形成具有预定形状的凹部（24a，24b），其设置有电介质图案，例如特氟隆（12） ）或光致抗蚀剂。 包括凹陷（24a，24b）的钢心轴的区域用导电材料（34,36,38）的图案电镀，并且电介质基底（32）层压到导电材料上。 由凹口形成的电路特征限定了锥形（18）或金字塔形（28）形状的凸起接触，其具有小的面积的自由端，允许更高的压力施加到触点抵靠的表面。 这使得触点能够渗透可能形成在焊盘（56,58）的表面上的诸如氧化物的异物，触点将被连接到该表面，以确保良好的接触而不需要擦拭动作。 突出的触点也可以被压入诸如印刷电路板的基板中的电镀孔（82,84）中，以便进行可配对/可分离的电连接。

    Multifunction card type electronic apparatus
    100.
    发明授权
    Multifunction card type electronic apparatus 失效
    多功能卡式电子设备

    公开(公告)号：US5019700A

    公开(公告)日：1991-05-28

    申请号：US438206

    申请日：1989-11-20

    Applicant: Noburu Tada ,  Tadaharu Mukai ,  Katsuhide Shino

    Inventor： Noburu Tada ,  Tadaharu Mukai ,  Katsuhide Shino

    IPC: B42D15/10 ,  G06K19/077 ,  H05K1/11 ,  H05K1/14 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36

    CPC classification number: H05K1/141 ,  G06K19/07745 ,  H01L2924/0002 ,  H05K1/111 ,  H05K2201/0394 ,  H05K2201/049 ,  H05K2201/10666 ,  H05K3/321 ,  H05K3/3436 ,  H05K3/368

    Abstract: A multifunction card type electronic apparatus comprising a simple flat-shaped circuit board into which electronic components are mounted; a protective member that is disposed on at least the top surface of the circuit board except for a portion of the top surface of the circuit board on which external connection terminals are to be disposed; and a terminal board on the top surface of which the external connection terminals are disposed, the terminal board being placed and bonded onto the portion of the top surface of the circuit board by means of an electrically conductive material so that the external connection terminals are electrically connected to the circuit board, whereby the electronic apparatus is produced in a low cost, easy to produce and suited to a mass production.

    Abstract translation: 一种多功能卡式电子设备，包括：电子部件安装在其中的简单平板电路板; 保护构件，其设置在电路板的至少顶表面上，除了要布置外部连接端子的电路板的顶表面的一部分之外; 并且在其顶表面上设置有外部连接端子的端子板，端子板通过导电材料放置并接合到电路板的顶表面的部分上，使得外部连接端子电气 连接到电路板，由此电子设备以低成本生产，易于生产并且适合于批量生产。

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